ON NLVVHC1G02DFT2G Single 2-input nor gate Datasheet

MC74VHC1G02
Single 2-Input NOR Gate
The MC74VHC1G02 is an advanced high speed CMOS 2−input
NOR gate fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
The MC74VHC1G02 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage. This
allows the MC74VHC1G02 to be used to interface 5 V circuits to 3 V
circuits.
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MARKING
DIAGRAMS
5
Features
•
High Speed: tPD = 3 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1.0 mA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Pin and Function Compatible with Other Standard Logic Families
Chip Complexity: FETs = 56
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
M
•
•
•
•
•
•
•
SC70−5/SC−88A/SOT−353
DF SUFFIX
CASE 419A
V3M G
G
1
1
5
SOT23−5/TSOP−5/SC59−5
DT SUFFIX
CASE 483
V3 M G
G
1
1
V3
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
IN B
1
VCC
5
PIN ASSIGNMENT
1
IN A
GND
2
3
OUT Y
4
IN B
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
Figure 1. Pinout (Top View)
IN A
IN B
1
Inputs
OUT Y
Output
A
B
Y
L
L
H
H
L
H
L
H
H
L
L
L
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
April, 2016 − Rev. 18
1
Publication Order Number:
MC74VHC1G02/D
MC74VHC1G02
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
Characteristics
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
−0.5 to 7.0
−0.5 to VCC + 0.5
V
−20
mA
+20
mA
VOUT
DC Output Voltage
IIK
Input Diode Current
IOK
Output Diode Current
IOUT
DC Output Current, per Pin
+25
mA
ICC
DC Supply Current, VCC and GND
+50
mA
PD
Power Dissipation in Still Air at 85°C
SC70−5/SC−88A
TSOP−5
150
200
mW
qJA
Thermal Resistance
SC70−5/SC−88A (Note 1)
TSOP−5
350
230
°C/W
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
)150
°C
*65 to )150
°C
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
Above VCC and Below GND at 125°C (Note 5)
$500
mA
TSTG
Storage Temperature Range
VESD
ESD Withstand Voltage
ILATCHUP
VCC = 0
High or Low State
VOUT < GND; VOUT > VCC
Latchup Performance
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
5.5
V
VCC
DC Supply Voltage
2.0
VIN
DC Input Voltage
0.0
5.5
V
DC Output Voltage
0.0
VCC
V
Operating Temperature Range
−55
+125
°C
0
0
100
20
ns/V
VOUT
TA
tr , tf
VCC = 3.3 V $ 0.3 V
VCC = 5.0 V $ 0.5 V
Input Rise and Fall Time
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80°C
117.8
TJ = 90°C
1,032,200
TJ = 100°C
80
TJ = 110°C
Time, Years
TJ = 120°C
Time, Hours
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 130°C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2
MC74VHC1G02
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
Min
1.5
2.1
3.15
3.85
VIH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
5.5
VIL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
5.5
VOH
Minimum High−Level
Output Voltage
VIN = VIH or VIL
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
TA ≤ 85°C
TA = 25°C
VCC
(V)
Typ
Max
Min
2.0
3.0
4.5
1.9
2.9
4.4
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
Min
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
VIN = VIH or VIL
IOH = −50 mA
−55 ≤ TA ≤ 125°C
Max
2.0
3.0
4.5
Max
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
V
0.5
0.9
1.35
1.65
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
Unit
V
V
V
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
V
IIN
Maximum Input
Leakage Current
VIN = 5.5 V or GND
0 to
5.5
$0.1
$1.0
$1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
5.5
1.0
10
40
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
TA ≤ 85°C
TA = 25°C
Symbol
Parameter
tPLH,
tPHL
Maximum Propagation
Delay,
Input A or B to Y
CIN
Min
Typ
Max
Max
Unit
VCC = 3.3 $ 0.3 V
CL = 15 pF
CL = 50 pF
4.0
5.4
7.9
11.4
9.5
13.0
11.0
15.5
ns
VCC = 5.0 $ 0.5 V
CL = 15 pF
CL = 50 pF
3.0
3.8
5.5
7.5
6.5
8.5
8.0
10.0
5.5
10
10
10
Test Conditions
Maximum Input
Capacitance
Min
−55 ≤ TA ≤ 125°C
Max
Min
pF
Typical @ 25°C, VCC = 5.0 V
CPD
11
Power Dissipation Capacitance (Note 6)
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74VHC1G02
TEST POINT
VCC
A or B
INPUT
50%
OUTPUT
GND
tPLH
Y
tPHL
CL *
50% V
*Includes all probe and jig capacitance
Figure 4. Switching Waveforms
Figure 5. Test Circuit
ORDERING INFORMATION
Device
Package
Shipping†
SC−88A
(Pb−Free)
3000/Tape & Reel
TSOP−5
(Pb−Free)
3000/Tape & Reel
MC74VHC1G02DFT1G
MC74VHC1G02DFT2G
NLVVHC1G02DFT2G*
MC74VHC1G02DTT1G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74VHC1G02
PACKAGE DIMENSIONS
SC−88A/SOT−353/SC−70
DF SUFFIX
CASE 419A−02
ISSUE K
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
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5
SCALE 20:1
mm Ǔ
ǒinches
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74VHC1G02
PACKAGE DIMENSIONS
TSOP−5
DT SUFFIX
CASE 483−02
ISSUE L
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
DIM
A
B
C
D
G
H
J
K
M
S
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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MC74VHC1G02/D
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