TI1 JM38510/10103BGA Operational amplifier Datasheet

LM101AJAN
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SNOSAJ8A – JANUARY 2006 – REVISED MARCH 2013
LM101AJAN Operational Amplifiers
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FEATURES
DESCRIPTION
•
The LM101A is a general purpose operational
amplifier which features improved performance over
industry standards such as the LM709. Advanced
processing techniques make possible an order of
magnitude reduction in input currents, and a redesign
of the biasing circuitry reduces the temperature drift
of input current. Improved specifications include:
• Offset voltage 3 mV maximum over temperature
• Input current 100 nA maximum over temperature
• Offset current 20 nA maximum over temperature
• Ensured drift characteristics
• Offsets ensured over entire common mode and
supply voltage ranges
• Slew rate of 10V/μs as a summing amplifier
1
2
•
•
•
•
•
Offset Voltage 3 mV Maximum Over
Temperature
Input Current 100 nA Maximum Over
Temperature
Offset Current 20 nA Maximum Over
Temperature
Ensured Drift Characteristics
Offsets Ensured Over Entire Common Mode
and Supply Voltage Ranges
Slew Rate of 10 V/µS as a Summing Amplifier
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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This amplifier offers many features which make its
application nearly foolproof: overload protection
on the input and output, no latch-up when the
common mode range is exceeded, and freedom
from oscillations and compensation with a single
30 pF capacitor. It has advantages over internally
compensated amplifiers in that the frequency
compensation can be tailored to the particular
application. For example, in low frequency circuits
it can be overcompensated for increased stability
margin. Or the compensation can be optimized to
give more than a factor of ten improvement in high
frequency performance for most applications.
In addition, the device provides better accuracy
and lower noise in high impedance circuitry. The
low input currents also make it particularly well
suited for long interval integrators or timers,
sample and hold circuits and low frequency
waveform generators. Further, replacing circuits
where matched transistor pairs buffer the inputs of
conventional IC op amps, it can give lower offset
voltage and a drift at a lower cost.
Schematic
Pin connections shown are for 8-pin packages
Connection Diagrams
2
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Pin 4 connected to case.
Figure 1. (Top View)
TO-99 Package
See Package Number LMC
Figure 2. (Top View)
CDIP Package
See Package Number NAB0008A
Figure 3. (Top View)
CDIP Package
See NS Package Number J
Figure 4. (Top View)
CLGA Package
See NS Package Number NAD0010A
Fast AC/DC Converter
Feedforward compensation can be used to make a fast full wave rectifier without a filter.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings (1)
Supply Voltage
±22V
Differential Input Voltage
±30V
Input Voltage (2)
±15V
Output Short Circuit Duration
Continuous
−55°C ≤ TA ≤ +125°C
Operating Ambient Temp. Range
TJ Max
150°C
Power Dissipation at TA =
25°C (3)
LMC-Package
Still Air)
NAB0008A-Package
J-Package
NAD0010A-Package
LMC-Package
NAB0008A-Package
θJA
J-Package
Thermal Resistance
NAD0010A-Package
θJC (Typical)
750 mW
(500 LF / Min Air Flow)
1,200 mW
(Still Air)
1,000 mW
(500 LF / Min Air Flow)
1,500 mW
(Still Air)
1,200mW
(500 LF / Min Air Flow)
2,000mW
(Still Air)
500mW
(500 LF / Min Air Flow)
800mW
(Still Air)
165°C/W
(500 LF / Min Air Flow)
89°C/W
(Still Air)
128°C/W
(500 LF / Min Air Flow)
75°C/W
(Still Air)
98°C/W
(500 LF / Min Air Flow)
59°C/W
(Still Air)
233°C/W
(500 LF / Min Air Flow)
155°C/W
LMC-Package
39°C/W
NAB0008A-Package
26°C/W
J-Package
24°C/W
NAD0010A-Package
26°C/W
−65°C ≤ TA ≤ +150°C
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
300°C
ESD Tolerance (4)
3000V
(1)
(2)
(3)
(4)
4
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do no ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions.
For supply voltages less than ±15V, the absolute maximum input voltage is equal to the supply voltage.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
Human body model, 100 pF discharged through 1.5 kΩ.
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Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Temp (°C)
1
Static tests at
25
2
Static tests at
125
3
Static tests at
-55
4
Dynamic tests at
25
5
Dynamic tests at
125
6
Dynamic tests at
-55
7
Functional tests at
25
8A
Functional tests at
125
8B
Functional tests at
-55
9
Switching tests at
25
10
Switching tests at
125
11
Switching tests at
-55
LM101JAN Electrical Characteristics DC Parameters
The following conditions apply to all parameters, unless otherwise specified
VCC = ±20V, VCM = 0V, RS = 50Ω
Symbol
Parameters
Conditions
VIO
Input Offset Voltage
IIO
±IIB
Input Offset Current
Input Bias Current
Min
Max
Unit
Subgroups
+VCC = 35V, -VCC = -5V,
VCM = -15V
-2.0
+2.0
mV
1
-3.0
+3.0
mV
2, 3
+VCC = 5V, -VCC = -35V,
VCM = +15V
-2.0
+2.0
mV
1
-3.0
+3.0
mV
2, 3
VCM = 0V
-2.0
+2.0
mV
1
-3.0
+3.0
mV
2, 3
+VCC = 5V, -VCC = -5V,
VCM = 0V
-2.0
+2.0
mV
1
-3.0
+3.0
mV
2, 3
+VCC = 35V, -VCC = -5V,
VCM = -15V, RS = 100KΩ
-10
+10
nA
1, 2
-20
+20
nA
3
+VCC = 5V, -VCC = -35V,
VCM = +15V, RS = 100KΩ
-10
+10
nA
1, 2
-20
+20
nA
3
VCM = 0V, RS = 100KΩ
-10
+10
nA
1, 2
-20
+20
nA
3
+VCC = 5V, -VCC = -5V,
VCM = 0V, RS = 100KΩ
-10
+10
nA
1, 2
-20
+20
nA
3
+VCC = 35V, -VCC = -5V,
VCM = -15V, RS = 100KΩ
-0.1
75
nA
1, 2
-0.1
100
nA
3
+VCC = 5V, -VCC = -35V,
VCM = +15V, RS = 100KΩ
-0.1
75
nA
1, 2
-0.1
100
nA
3
VCM = 0V, RS = 100KΩ
-0.1
75
nA
1, 2
-0.1
100
nA
3
-0.1
75
nA
1, 2
-0.1
100
nA
3
+VCC = 5V, -VCC = -5V,
VCM = 0V, RS = 100KΩ
+PSRR
-PSRR
Power Supply Rejection Ratio
Power Supply Rejection Ratio
+VCC = 10V, -VCC = -20V
+VCC = 20V, -VCC = -10V
Notes
-50
+50
µV/V
1
-100
+100
µV/V
2, 3
-50
+50
µV/V
1
-100
+100
µV/V
2, 3
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LM101JAN Electrical Characteristics DC Parameters (continued)
The following conditions apply to all parameters, unless otherwise specified
VCC = ±20V, VCM = 0V, RS = 50Ω
Symbol
Parameters
Conditions
CMRR
Common Mode Rejection Ratio
VCC = ±35V to ±5V,
VCM = ±15V
+VIO Adj
Adjustment for Input Offset
Voltage
-VIO Adj
Adjustment for Input Offset
Voltage
+IOS
Output Short Circuit Current
+VCC = 15V, -VCC = -15V,
t ≤ 25mS, VCM = -15V
-IOS
Output Short Circuit Current
+VCC = 15V, -VCC = -15V,
t ≤ 25mS, VCM = +15V
ICC
Power Supply Current
+VCC = 15V, -VCC = -15V
ΔVIO / ΔT
Δ IIO / ΔT
-AVS
(1)
(2)
(3)
6
dB
1, 2, 3
4.0
mV
1, 2, 3
mV
1, 2, 3
mA
1, 2, 3
+60
mA
1, 2, 3
3.0
mA
1
2.32
mA
2
3.5
mA
3
-60
-18
+18
µV/°C
2
+25°C ≤ TA ≤ +125°C
See (1)
-15
+15
µV/°C
3
-55°C ≤ TA ≤ +25°C
See
(2)
-200
+200
pA/°C
2
+25°C ≤ TA ≤ +125°C
See (2)
-100
+100
pA/°C
3
Large Signal (Open Loop) Voltage RL = 2KΩ, VO = -15V
Gain
See (3)
50
V/mV
4
(3)
25
V/mV
5, 6
See (3)
50
V/mV
4
See (3)
25
V/mV
5, 6
See (3)
50
V/mV
4
See (3)
25
V/mV
5, 6
See (3)
50
V/mV
4
See (3)
25
V/mV
5, 6
See (3)
10
V/mV
4, 5, 6
See (3)
10
V/mV
4, 5, 6
RL = 10KΩ, VCM = -20V
+16
V
4, 5, 6
RL = 2KΩ, VCM = -20V
+15
V
4, 5, 6
Temperature Coefficient of Input
Offset Current
Large Signal (Open Loop) Voltage RL = 2KΩ, VO = +15V
Gain
VCC = ±5V, RL = 10KΩ,
VO = ±2V
-VOP
80
See (1)
Large Signal (Open Loop) Voltage VCC = ±5V, RL = 2KΩ,
Gain
VO = ±2V
+VOP
Subgroups
Max
-55°C ≤ TA ≤ +25°C
Temperature Coefficient of Input
Offset Voltage
RL = 10KΩ, VO = +15V
AVS
Unit
Min
-4.0
RL = 10KΩ, VO = -15V
+AVS
Notes
Output Voltage Swing
Output Voltage Swing
See
RL = 10KΩ, VCM = 20V
-16
V
4, 5, 6
RL = 2KΩ, VCM = 20V
-15
V
4, 5, 6
Calculated parameter
Calculated parameter
Datalog reading of K = V/mV.
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LM101AJAN Electrical Characteristics AC Parameters
The following conditions apply to all parameters, unless otherwise specified
VCC = ±20V, VCM = 0V, RS = 50Ω
Symbol
Parameter
Conditions
Units
Subgroups
+SR
Slew Rate
AV = 1, VI = -5V to +5V
-SR
Slew Rate
AV = 1, VI = +5V to -5V
0.3
V/µS
7
0.3
V/µS
TRTR
Rise Time
AV = 1, VI = 50mV
7
800
nS
TROS
Overshoot
7
AV = 1, VI = 50mV
25
%
7
NIBB
NIPC
Noise Broadband
BW = 10Hz to 5KHz, RS = 0Ω
15
µVRMS
7
Noise Popcorn
BW = 10Hz to 5KHz,
RS = 100KΩ
80
µVPK
7
Min
Max
Units
Subgroups
Notes
Min
Max
LM101AJAN Electrical Characteristics DC Parameters: Drift Values
The following conditions apply to all parameters, unless otherwise specified
VCC = ±20V, VCM = 0V, RS = 50Ω
Delta calculations performed on JAN S devices at group B, Subgroup 5 only.
Symbol
Parameter
Conditions
VIO
Input Offset Voltage
VCM = 0V
-0.5
0.5
mV
1
± IIB
Input Bias Current
VCM = 0V, RS = 100KΩ
-7.5
7.5
nA
1
Notes
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Typical Performance Characteristics LM101A
8
Input Voltage Range
Output Swing
Figure 5.
Figure 6.
Voltage Gain
Supply Current
Figure 7.
Figure 8.
Voltage Gain
Maximum Power Dissipation
Figure 9.
Figure 10.
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Typical Performance Characteristics LM101A (continued)
Input Current,
LM101A
Input Noise Voltage
Figure 11.
Figure 12.
Input Noise Current
Common Mode Rejection
Figure 13.
Figure 14.
Power Supply Rejection
Closed Loop Output
Impedance
Figure 15.
Figure 16.
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Typical Performance Characteristics for Various Compensation Circuits (1)
Single Pole Compensation
Two Pole Compensation
CS= 30 pF
CS= 30 pF
C2 = 10 C1
fo= 3 MHz
(1)
10
Figure 17.
Figure 18.
Feedforward Compensation
Open Loop Frequency
Response
Figure 19.
Figure 20.
Pin connections shown are for 8-pin packages.
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Typical Performance Characteristics for Various Compensation Circuits(1) (continued)
Open Loop Frequency
Response
Open Loop Frequency
Response
Figure 21.
Figure 22.
Large Signal Frequency
Response
Large Signal Frequency
Response
Figure 23.
Figure 24.
Large Signal Frequency
Response
Voltage Follower Pulse
Response
Figure 25.
Figure 26.
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Typical Performance Characteristics for Various Compensation Circuits(1) (continued)
12
Voltage Follower Pulse
Response
Inverter Pulse Response
Figure 27.
Figure 28.
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TYPICAL APPLICATIONS (2)
Inverting Amplifier
with Balancing Circuit
Variable Capacitance Multiplier
†May be zero or equal to parallel combination of R1 and R2 for
minimum offset.
Simulated Inductor
Sine Wave Oscillator
L ≃ R1 R2 C1
RS = R2
RP = R1
fo = 10 kHz
Fast Inverting Amplifier
with High Input Impedance
Integrator with Bias Current Compensation
*Adjust for zero integrator drift. Current drift typically 0.1 nA/°C over
−55°C to +125°C temperature range.
(2)
Pin connections shown are for 8-pin packages.
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Application Hints (2)
Protecting Against Gross
Fault Conditions
*Protects input
†Protects output
‡Protects output—not needed when R4 is used.
Compensating for Stray Input Capacitances
or Large Feedback Resistor
Isolating Large Capacitive Loads
Although the LM101A is designed for trouble free operation, experience has indicated that it is wise to observe
certain precautions given below to protect the devices from abnormal operating conditions. It might be pointed
out that the advice given here is applicable to practically any IC op amp, although the exact reason why may
differ with different devices.
14
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When driving either input from a low-impedance source, a limiting resistor should be placed in series with the
input lead to limit the peak instantaneous output current of the source to something less than 100 mA. This is
especially important when the inputs go outside a piece of equipment where they could accidentally be
connected to high voltage sources. Large capacitors on the input (greater than 0.1 μF) should be treated as a
low source impedance and isolated with a resistor. Low impedance sources do not cause a problem unless their
output voltage exceeds the supply voltage. However, the supplies go to zero when they are turned off, so the
isolation is usually needed.
The output circuitry is protected against damage from shorts to ground. However, when the amplifier output is
connected to a test point, it should be isolated by a limiting resistor, as test points frequently get shorted to bad
places. Further, when the amplifier drives a load external to the equipment, it is also advisable to use some sort
of limiting resistance to preclude mishaps.
Precautions should be taken to insure that the power supplies for the integrated circuit never become
reversed—even under transient conditions. With reverse voltages greater than 1V, the IC will conduct excessive
current, fusing internal aluminum interconnects. If there is a possibility of this happening, clamp diodes with a
high peak current rating should be installed on the supply lines. Reversal of the voltage between V+ and V− will
always cause a problem, although reversals with respect to ground may also give difficulties in many circuits.
The minimum values given for the frequency compensation capacitor are stable only for source resistances less
than 10 kΩ, stray capacitances on the summing junction less than 5 pF and capacitive loads smaller than 100
pF. If any of these conditions are not met, it becomes necessary to overcompensate the amplifier with a larger
compensation capacitor. Alternately, lead capacitors can be used in the feedback network to negate the effect of
stray capacitance and large feedback resistors or an RC network can be added to isolate capacitive loads.
Although the LM101A is relatively unaffected by supply bypassing, this cannot be ignored altogether. Generally it
is necessary to bypass the supplies to ground at least once on every circuit card, and more bypass points may
be required if more than five amplifiers are used. When feed-forward compensation is employed, however, it is
advisable to bypass the supply leads of each amplifier with low inductance capacitors because of the higher
frequencies involved.
Typical Applications (3)
Standard Compensation and
Offset Balancing Circuit
(3)
Pin connections shown are for 8-pin packages.
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Fast Voltage Follower
Power Bandwidth: 15 kHz
Slew Rate: 1V/μs
Fast Summing Amplifier
Power Bandwidth: 250 kHz
Small Signal Bandwiidth: 3.5 MHz
Slew Rate: 10V/μs
Bilateral Current Source
R3 = R4 + R5
R1 = R2
16
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Fast AC/DC Converter
Feedforward compensation can be used to make a fast full wave rectifier without a filter.
Instrumentation Amplifier
R1 = R4; R2 = R3
*,† Matching determines CMRR.
Integrator with Bias Current Compensation
Voltage Comparator for Driving RTL Logic or High Current
Driver
*Adjust for zero integrator drift. Current drift typically 0.1 nA/°C over
0°C to +70°C temperature range.
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Low Frequency Square Wave Generator
Voltage Comparator for Driving
DTL or TTL Integrated Circuits
Low Drift Sample and Hold
*Polycarbonate-dielectric capacitor
18
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REVISION HISTORY SECTION
Date
Released
Revision
Section
Originator
Changes
01/05/06
A
New Release to corporate format
L. Lytle
1 MDS datasheets converted into one Corp.
datasheet format. MJLM101A-X Rev 1A0
datasheet will be archived.
03/20/13
A
All
-
Changed layout of National Data Sheet to TI
format
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
Top-Side Markings
(4)
JL101ABCA
ACTIVE
CDIP
J
14
25
TBD
Call TI
Call TI
-55 to 125
JL101ABCA
JM38510/10103BCA Q
JL101ABGA
ACTIVE
TO-99
LMC
8
20
TBD
Call TI
Call TI
-55 to 125
JL101ABGA
JM38510/10103BGA Q
ACO
JM38510/10103BGA Q
>T
JL101ABPA
ACTIVE
CDIP
NAB
8
40
TBD
Call TI
Call TI
-55 to 125
JL101ABPA Q
JM38510/
10103BPA ACO
10103BPA >T
JM38510/10103BCA
ACTIVE
CDIP
J
14
25
TBD
Call TI
Call TI
-55 to 125
JL101ABCA
JM38510/10103BCA Q
JM38510/10103BGA
ACTIVE
TO-99
LMC
8
20
TBD
Call TI
Call TI
-55 to 125
JL101ABGA
JM38510/10103BGA Q
ACO
JM38510/10103BGA Q
>T
JM38510/10103BPA
ACTIVE
CDIP
NAB
8
40
TBD
Call TI
Call TI
-55 to 125
JL101ABPA Q
JM38510/
10103BPA ACO
10103BPA >T
M38510/10103BCA
ACTIVE
CDIP
J
14
25
TBD
Call TI
Call TI
-55 to 125
JL101ABCA
JM38510/10103BCA Q
M38510/10103BGA
ACTIVE
TO-99
LMC
8
20
TBD
Call TI
Call TI
-55 to 125
JL101ABGA
JM38510/10103BGA Q
ACO
JM38510/10103BGA Q
>T
M38510/10103BPA
ACTIVE
CDIP
NAB
8
40
TBD
Call TI
Call TI
-55 to 125
JL101ABPA Q
JM38510/
10103BPA ACO
10103BPA >T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
NAB0008A
J08A (Rev M)
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