Material Content Data Sheet Sales Product Name BCW 68G E6327 MA# MA000366749 Package PG-SOT23-3-4 Issued Weight* Construction Element Material Group Substances chip non noble metal noble metal inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material inorganic material plastics plastics inorganic material non noble metal noble metal < 10% arsenic gold silicon chromium silicon titanium copper gold carbon black antimonytrioxide brominated resin epoxy resin silicondioxide tin silver leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 9.08 mg CAS# if applicable Weight [mg] Average Mass [%] 7440-38-2 7440-57-5 7440-21-3 7440-47-3 7440-21-3 7440-32-6 7440-50-8 7440-57-5 1333-86-4 1309-64-4 60676-86-0 7440-31-5 7440-22-4 0.000 0.00 14 0.013 0.14 1415 0.110 1.21 0.009 0.10 0.001 0.01 66 0.003 0.03 332 3.001 33.05 33.19 330486 331880 0.019 0.20 0.20 2040 2040 0.091 1.00 10007 0.136 1.50 15011 0.170 1.88 18764 1.420 15.64 156365 3.862 42.53 62.55 425313 625460 0.136 1.50 1.50 15024 15024 0.110 1.21 1.21 12082 Sum [%] 1.35 Average Mass [ppm] 12085 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 13514 996 Important Remarks: 1. Sum [ppm] 12082 1000000