Material Content Data Sheet Sales Product Name SAA-XC866L-4FRA BE MA# MA000998838 Package PG-TSSOP-38-4 Issued 29. August 2013 Weight* 117.81 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material noble metal noble metal noble metal non noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide gold silver palladium nickel epoxy resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-57-5 7440-22-4 7440-05-3 7440-02-0 7440-22-4 6.433 5.46 0.075 0.06 0.326 0.28 2767 1.504 1.28 12769 48.239 40.95 42.57 409467 425641 0.550 0.47 0.47 4665 4665 0.177 0.15 wire encapsulation plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 5.46 54607 54607 638 1500 7.481 6.35 51.246 43.49 0.004 0.00 37 0.002 0.00 20 0.003 0.00 0.080 0.07 0.338 0.29 1.351 1.15 63499 49.99 434991 23 0.07 678 2. 3. 1.44 11471 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 758 2868 Important Remarks: 1. 499990 14339 1000000