Diodes DMT2004UPS N-channel enhancement mode mosfet Datasheet

DMT2004UPS
Green
N-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI
Product Summary
BVDSS
Features and Benefits
ID max
TC = +25°C
RDS(ON) max
24V
5mΩ @ VGS = 10V
80A
6.5mΩ @ VGS = 4.5V
70A
10mΩ @ VGS = 2.5V
55A


Low RDS(ON) – Minimizes On-State Losses
Excellent Qgd x RDS(ON) Product (FOM)


Advanced Technology for DC-DC Converters
Small Form Factor Thermally Efficient Package Enables Higher
Density End Products
100% Unclamped Inductive Switching – Ensures More Reliability
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)



Description and Applications
Mechanical Data
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it

Case: PowerDI5060-8

Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
ideal for high efficiency power management applications.

Moisture Sensitivity: Level 1 per J-STD-020

Backlighting

Terminal Connections Indicator: See Diagram

Power Management Functions


DC-DC Converters
Terminals: Finish  Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208

Weight: 0.097 grams (Approximate)
PowerDI5060-8
Pin1
Internal Schematic
Bottom View
Top View
S
D
S
D
S
D
G
D
Top View
Pin Configuration
Ordering Information (Note 4)
Part Number
DMT2004UPS-13
Notes:
Case
PowerDI5060-8
Packaging
2,500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
D
D
D
D
= Manufacturer’s Marking
T2004US = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 16 = 2016)
WW = Week (01 to 53)
T2004US
YY WW
S
S
S
G
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DMT2004UPS
Document number: DS38955 Rev. 1 - 2
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DMT2004UPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 7) VGS = 10V
Steady
State
TC = +25°C
TC = +70°C
Unit
V
V
IDM
Value
24
±12
80
65
160
IS
2
A
IAS
EAS
26
36
A
mJ
ID
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Continuous Source-Drain Diode Current (Note 6)
Avalanche Current (Note 8) L = 0.1mH
Avalanche Energy (Note 8) L = 0.1mH
A
A
Thermal Characteristics
Characteristic
Total Power Dissipation
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
TA = +25°C
Steady State
TA = +25°C
Steady State
Symbol
PD
RJA
PD
RJA
RJC
TJ, TSTG
Value
1.4
88
2.5
-55 to +150
Units
W
°C/W
W
°C/W
°C/W
°C
Electrical Characteristics (TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current (TJ = +25°C)
Gate-Source Leakage
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
24
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 250μA
VDS = 20V, VGS = 0V
VGS = ±10V, VDS = 0V
VGS(TH)
RDS(ON)
—
3.7
4.5
7.5
0.65
1.45
5.0
6.5
10.0
1.0
V
Static Drain-Source On-Resistance
0.55
—
—
—
—
VDS = VGS, ID = 250μA
VGS = 10V, ID = 20A
VGS = 4.5V, ID = 20A
VGS = 2.5V, ID = 20A
VGS = 0V, IS = 2A
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1683
581
559
1.6
29.6
53.7
4.2
13.4
3.9
9.6
30.8
38.6
11.2
22.9
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
VSD
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
mΩ
V
Test Condition
pF
VDS = 15V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDD = 15V, ID = 9A
ns
VDD = 15V, VGS = 10V,
RG = 3Ω, ID = 9A
ns
nC
IF = 1.5A, di/dt = 100A/μs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.
PowerDI is a registered trademark of Diodes Incorporated.
DMT2004UPS
Document number: DS38955 Rev. 1 - 2
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DMT2004UPS
20
30.0
VGS = 2.0V
16
VGS = 2.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25.0
VGS = 3.0V
20.0
VGS = 4.0V
15.0
VDS = 5V
18
VGS = 4.5V
VGS = 10.0V
10.0
VGS = 1.5V
5.0
14
12
10
TJ = 150℃
TJ = 85℃
8
6
TJ = 125℃
4
TJ = -55℃
2
VGS = 1.2V
0.0
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
0
0
2
0.009
0.008
VGS = 2.5V
0.007
0.006
VGS = 4.5V
0.005
0.004
0.003
VGS = 10.0V
0.002
0.001
2.5
0.009
0.008
0.007
0.006
ID = 12A
0.005
0.004
0.003
0
0
0
5
10
15
20
25
30
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
2
4
6
8
10
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
12
1.8
0.008
RDS(ON, DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
0.5
1
1.5
2
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
0.01
0.01
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
0
TJ = 25℃
VGS = 10V
0.007
TJ = 125℃
0.006
TJ = 150℃
0.005
TJ = 85℃
0.004
TJ = 25℃
0.003
TJ = -55℃
0.002
0.001
1.6
VGS = 4.5V, ID = 12A
1.4
1.2
VGS = 2.5V, ID = 12A
1
0.8
0.6
0
0
2
4
6
8
10
12
14
16
18
20
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Temperature
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
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1.2
0.01
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
0.012
VGS = 2.5V, ID = 12A
0.008
0.006
0.004
VGS = 4.5V, ID = 12A
1
ID = 1mA
0.8
0.6
ID = 250μA
0.4
0.2
0
0.002
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs.Junction
Temperature
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
10000
20
IS, SOURCE CURRENT (A)
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
18
16
14
12
10
TJ = 85℃
TJ = 150℃
8
TJ = 25℃
TJ = 125℃
6
4
TJ = -55℃
2
f = 1MHz
Ciss
Coss
1000
Crss
100
0
0
0.3
0.6
0.9
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
1.2
10
2
4
6
8 10 12 14 16 18
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
20
1000
RDS(ON)
Limited
ID, DRAIN CURRENT (A)
VGS (V)
8
6
VDS = 15V, ID = 9A
4
100
PW =1s
10
PW = 100ms
PW = 10ms
PW = 1ms
TJ(Max) = 150℃
PW = 100µs
TC= 25℃
Single Pulse
DUT on Infinite Heatsink
VGS = 10V
1
2
0
0.1
0
10
20
30
Qg (nC)
40
50
60
Figure 11. Gate Charge
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
100
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1
r(t), TRANSIENT THERMAL RESISTANCE
D=0.9
D=0.5
D=0.7
D=0.3
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJC (t) = r(t) * RθJC
RθJC = 1.1℃/W
Duty Cycle, D = t1/t2
D=Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
D
Detail A
D1
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
b3 (4X)
M1
Detail A
L1
G
PowerDI5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51
L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
Θ
10º
12º
11º
Θ1
6º
8º
7º
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
G
Y(4x)
Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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Copyright © 2016, Diodes Incorporated
www.diodes.com
PowerDI is a registered trademark of Diodes Incorporated.
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