MOTOROLA MC1662 Quad 2-input nor gate Datasheet

 SEMICONDUCTOR TECHNICAL DATA
ELECTRICAL CHARACTERISTICS
–30°C
+ 25°C
+ 85°C
Ch
Characteristic
i i
S b l
Symbol
Min
Max
Min
Max
Min
Max
U i
Unit
Power Supply Drain Current
IE
—
—
—
56
—
—
mAdc
IinH
—
—
—
350
—
—
µAdc
t–+
t+–
t +, t –
0.6
0.6
1.6
1.8
0.6
0.6
1.5
1.7
0.6
0.6
1.7
1.9
0.6
2.2
0.6
2.1
0.6
2.3
Input Current
Switching Times
Propagation Delay
ns
Rise Time, Fall Time
(10% to 90%)
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
ns
LOGIC DIAGRAM
AIN1
4
AIN2
BIN1
5
2 AOUT
PIN ASSIGNMENT
6
3 BOUT
BIN2 7
CIN1 10
14 COUT
CIN2 11
DIN1 12
15 DOUT
DIN2 13
OUT = IN1 + IN2
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
tpd = 0.9 ns typ (510 ohm load)
= 1.1 ns typ (50 ohm load)
PD = 240 mW typ/pkg (No load)
Full Load Current, IL = – 25 mAdc max
3/93
 Motorola, Inc. 1996
4–354
REV 5
VCC1
1
16
VCC2
AOUT
2
15
DOUT
BOUT
3
14
COUT
AIN1
4
13
DIN2
AIN2
5
12
DIN1
BIN1
6
11
CIN2
BIN2
7
10
CIN1
VEE
8
9
NC
MC1662
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
M
T B
S
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
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◊
MECL Data
DL122 — Rev 6
4–355
*MC1650/D*
MC1650/D
MOTOROLA
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