Material Content Data Sheet Sales Product Name IPD5N25S3-430 MA# MA000921702 Package PG-TO252-3-313 Issued 29. August 2013 Weight* 317.74 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 1.310 0.41 0.147 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.41 4124 4124 464 0.044 0.01 147.096 46.28 46.34 462945 139 463548 1.054 0.33 0.33 3317 3317 1.418 0.45 4462 24.813 7.81 115.558 36.37 44.63 363687 78092 446241 3.740 1.18 1.18 11771 11771 0.003 0.00 1.421 0.45 0.048 0.02 0.039 0.01 1.846 0.58 0.019 0.01 0.006 0.00 19.177 6.04 11 0.45 4471 122 0.61 5809 2. 3. 18 6.05 60356 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 6083 60 Important Remarks: 1. 4482 152 60434 1000000