Datasheet LDO Regulators with Voltage Detector 200mA / 300mA Output LDO Regulator with 2ch RESET BD4269FJ-C BD4269EFJ-C General Description Key Specifications BD4269FJ-C BD4269EFJ-C are a low quiescent voltage regulator with 45V absolute maximum voltage allowing usage in battery direct-connected systems. IC integrates Power on and under-voltage reset and Input voltage reset for VCC or other voltages. Quiescent current is minimized to optimize the system current consumption. Offers selection of the output current between 200 mA or 300 mA depending on the application. Power on and under-voltage reset and Input voltage reset threshold voltage can be adjusted by external resistance. Power on and under-voltage reset delay time can programmed set by external capacitor. Qualified for Automotive Applications Input voltage range: -0.3 to +45 V Low quiescent current: 70 μA (Typ) Output load (BD4269FJ-C): 200 mA (BD4269EFJ-C) 300 mA Output voltage: 5.0 V ±2 % Power on and under-voltage reset detect voltage: 4.62 V ±2.6 % (Adjusting detect voltage accuracy:±3 %) Over Current Protection (OCP) Thermal Shut Down (TSD) Packages Features AEC-Q100 Qualifies (Note 1) Low ESR ceramic capacitors applicable for output. Low drop voltage: PDMOS output transistor Power on and under-voltage reset Sense input comparator for VCC or other voltage Adjustable power on and under-voltage reset and Sense input comparator by external resistance Programmable reset delay time by external capacitor. FJ: SOP-J8 W (Typ) x D (Typ) x H (Max) 4.90 mm x 6.00 mm x 1.65 mm EFJ：HTSOP-J8 4.90 mm x 6.00 mm x 1.00 mm (Note 1: Grade 1) Applications Onboard vehicle device (body-control, car stereos, satellite navigation system, etc.) Typical Application Circuits VCC and VO pin capacitors: 0.1 μF ≤ CIN (Typ), 6 μF ≤ CO (Min) Please refer to the "Selection of Components Externally Connected". < Using SI and RADJ > VIN < Not Using SI and RADJ > SO VCC RO SI CIN CT VO GND Sen se Ou tput Reset Output VIN 5V Output RADJ ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 SO VCC RO SI C IN CO CT VO GND RADJ Sen se Ou tput Reset Output 5V Output CO ○This product is not designed for protection against radioactive rays 1/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Pin Configurations SOP-J8 (TOP VIEW) HTSOP-J8 (TOP VIEW) 8 7 6 5 8 7 6 5 1 2 3 4 1 2 3 4 Pin Description Pin No. Symbol 1 VCC 2 SI 3 RADJ 4 CT 5 GND 6 RO 7 SO 8 VO Function Supply voltage input Sense input ; if not needed, connect to VO. Power on and under-voltage reset Threshold adjust ; if not needed, connect to GND. Power on and under-voltage reset Delay; connect capacitor to GND for setting delay time. Ground Power on and under-voltage reset output ; the open-collector output is internally linked to VO via a 24 kΩ pull-up resistor. Keep open, if not needed. Input voltage reset output ; the open-collector output is internally linked to VO via a 24 kΩ pull-up resistor. Keep open, if not needed. 5 V Output Block Diagram VO VCC Error Amplifier VO Reference RO CT Reference UVLO RADJ SO SI GND www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Description of Blocks Block Name Function Reference Reference Voltage Error Amplifier Error Amplifier TSD Thermal Shutdown Protection OCP Over Current Protection The OCP protect the device from damage caused by over current. UVLO Under Voltage Lock Out The UVLO prevents malfunction of the reset block in case of very low output voltage. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Description of Blocks The Reference generates the Reference Voltage The Error Amplifier amplifies the difference between the feedback voltage of the output voltage and the reference voltage The TSD protect the device from overheating. If the chip temperature (Tj) reaches ca. 175 °C (Typ), the output is turned off. 3/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Absolute Maximum Ratings Parameter Symbol Ratings Unit VCC -0.3 to + 45.0 V VRADJ -0.3 to +7.0 (≤ VO +0.3) V RO Input Voltage RO -0.3 to +7.0 (≤ VO +0.3) V VO Input Voltage VO -0.3 to +7.0 (≤ VO +0.3) V SO Input Voltage SO -0.3 to +7.0 (≤ VO +0.3) V SI Input Voltage VSI -0.3 to +45.0 (≤ VCC +0.3) V 0.80 W 0.96 W (Note 1) VCC Input Voltage RADJ Input Voltage Power Dissipation (SOP-J8) (Note 2) (HTSOP-J8) (Note 3) Pd Junction Temperature Range Tj -40 to + 150 °C Storage Temperature Range Tstg -55 to + 150 °C (Note 1) Not to exceed Pd. (Note 2) Reduced by 6.45 mW / °C over Ta = 25 °C, when mounted on glass epoxy board: 114.3 mm x 76.2 mm x 1.6 mm. (Note 3) Reduced by 7.69 mW / °C over Ta = 25 °C, when mounted on glass epoxy board: 114.3 mm x 76.2 mm x 1.6 mm. Caution: Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). Therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. Recommended Operating Conditions (-40 °C ≤ Tj ≤ +150 °C) Parameter Symbol Min Max Unit VCC 5.5 45.0 V VCC 6.0 45.0 V Start Up Voltage VCC 3.0 - V VO Operating Voltage for RO VOPR 1.0 - V VO Operating Voltage for SO VOPS 3.5 - V VRTADJ 3.5 4.5 V VSI 0 VCC V VRADJ 0 VO V 0 200 mA 0 300 mA -40 +125 °C Supply Voltage (IO ≤ 100mA) (Note 1) Supply Voltage (IO ≤ 200mA) (Note 1) Power on and Under-Voltage Reset Switching Threshold Adjustable Range SI Input Voltage RADJ Input Voltage Output Current (SOP-J8) (HTSOP-J8) Operating Temperature Range (Note 1) IO Ta Not to exceed Pd. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Thermal Characteristics (Note 1) Parameter Symbol Typ. Unit Conditions 155 °C / W 1s (Note 2) 87 °C / W 2s2p (Note 3) 15 °C / W 1s (Note 2) 13 °C / W 2s2p (Note 3) 130 °C / W 1s (Note 2) 34 °C / W 2s2p (Note 3) 15 °C / W 1s (Note 2) 7 °C / W 2s2p (Note 3) SOP-J8 Junction to Ambient θJA Junction to Top Center of Case (Note 4) ΨJT HTSOP-J8 Junction to Ambient θJA Junction to Top Center of Case (Note 4) ΨJT (Note 1) (Note 2) (Note 3) (Note 4) The thermal impedance is based on JESD51 - 2A (Still - Air) standard. JESD51 - 3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1 - layer (1s) (Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.) JESD51 - 5 / - 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4 - layer (2s2p) (Top copper foil: ROHM recommended footprint + wiring to measure / 2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side / inner layers) 2oz. / 1oz.) TT : Top center of case’s (mold) temperature www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Electrical Characteristics (Unless otherwise specified, Tj = -40 °C to +150 °C, VCC = 13.5 V) Limits Parameter Symbol Min Typ Max Unit Conditions Circuit current ICC - 70 150 μA IO = 0 mA to 200 mA Output voltage VQ 4.90 5.00 5.10 V 1 mA ≤ IO ≤ 100 mA 6 V ≤ VCC ≤ 16 V Dropout voltage ∆Vd - 0.25 0.50 V VCC = 4.75 V, IO = 100 mA Load regulation Reg.L - 10 30 mV IO = 10 mA to 100 mA Line regulation Reg.I - 10 30 mV VCC = 8 V to 16 V, IO = 1 mA 200 - - mA - 300 - - mA - - 175 - °C - BD4269FJ-C Current limit BD4269EFJ-C Thermal Shut Down Temperature IOCP TTSD Electrical Characteristics (Power on and under-voltage reset) (Unless otherwise specified, Tj = -40 °C to +150 °C, VCC = 13.5 V) Parameter Symbol Limits Unit Conditions Min Typ Max VRT 4.50 4.62 4.74 V - VRHY 20 60 100 mV - VRADJ,TH 0.776 0.800 0.824 V 3.5 V ≤ Vo ≤ 4.5 V RADJ input current IRADJ -1 0 +1 μA VRADJ = 2 V RO pull-up resistance RRO 10 24 40 kΩ - CT threshold high VCTH - 1.20 - V - CT threshold low VCTL - 0.25 - V - ICT 5 12 20 μA VCT = 0.5 V TDLH 17 22 28 ms CCT = 0.22 μF (Note 1) Power on and under-voltage reset Switching threshold Power on and under-voltage reset Switching Hysteresis RADJ switching threshold CT Charge current Delay time L→H (Power On Reset Time) (Note 1) TDLH can be varied by changing the CT capacitance value. ( 0.001µF to 10 µF available ) TDLH (ms) ≈ TDLH0 (Delay time L→H at CCT = 0.22 µF ) × CCT (μF) / 0.22 example: When CCT= 2.2µF, 170ms ≤ TPOR ≤ 280 ms CCT : 0.1µF ≤ CCT ≤ 10 μF TDLH (ms) ≈ TDLH0 ( Delay time L→H at CCT = 0.22 µF ) × CCT (μF) / 0.22 ±0.1 example: When CCT= 0.022µF, 1.6ms ≤ TDLH ≤ 2.9 ms CCT: 0.001µF ≤ CCT < 0.1 μF Electrical Characteristics (Input voltage reset) (Unless otherwise specified, Tj = -40 °C to 150 °C, VCC = 13.5 V) Parameter Symbol Limits Min Typ Max Unit Conditions SI threshold high VSIH 0.80 0.87 0.94 V - SI threshold low VSIL 0.75 0.80 0.85 V - SO pull-up resistance Rso 10 24 40 kΩ - SI input current ISI -1 0 +1 μA VSI = 2 V www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C 6 6 5 5 Output Voltage: VO [V] Output Voltage: VO [V] Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VCC = 13.5 V) 4 3 2 4 3 2 Tj = -40 °C Tj = 25 °C 1 1 0 Tj = 125 °C 0 0 5 10 15 20 25 30 35 Supply Voltage: VCC [V] 40 45 50 0 2 4 6 Supply Voltage: VCC [V] 8 10 Figure 2. Output Voltage vs. Supply Voltage (at low Supply Voltage: RL = open) Figure 1. Output Voltage vs. Supply Voltage (RL = open) 5.10 3.0 2.5 Circuit Current: ICC [mA] Output Voltage: VO [V] 5.05 5.00 4.95 2.0 1.5 1.0 0.5 4.90 -40 0 40 80 120 150 Junction Temperature : Tj [℃] Figure 3. Output Voltage vs. Junction Temperature (RL = 1 kΩ) www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0.0 0 5 10 15 20 25 30 35 40 Supply Voltage: VCC [V] 45 50 Figure 4. Circuit Current vs. Supply Voltage 7/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VCC = 13.5 V) -Continued 80 120 Circuit Current: ICC [μA] 150 Circuit Current: ICC [μA] 100 60 40 20 90 60 30 BD4269EFJ-C ≤ 300 mA BD4269FJ-C ≤ 200 mA 0 0 50 100 150 200 250 0 300 -40 0 Output Current : IO [mA] 120 150 Figure 6. Circuit Current vs. Junction Temperature 6 600 5 500 4 400 Output Current: IO [mA] Output Voltage: VO [V] 80 Junction Temperature : Tj [℃] Figure 5. Circuit Current vs. Output Current 3 2 Tj = -40 °C 1 40 Tj = 25 °C 300 200 100 Tj = 125 °C 0 0 100 200 300 400 Output Current: IO [mA] 500 0 600 -40 40 80 120 150 Junction Temperature : Tj [℃] Figure 8. Output Current vs. Junction Temperature Figure 7. Output Voltage vs. Output Current (Over Current Protection) www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 8/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VCC = 13.5 V) -Continued 6 800 Tj = -40 °C 700 5 600 Tj = 125 °C Output Voltage: VO [V] Dropout Voltage: ∆Vd [mV] Tj = 25 °C 500 400 300 3 2 200 1 100 BD4269EFJ-C ≤ 300 mA BD4269FJ ≤ 200 mA 0 0 0 50 100 150 200 Output Current: IO [mA] 250 100 300 Figure 9. Dropout Voltage vs. Output Current (VCC = 4.75 V) () 125 150 175 Junction Temperature: Tj [°C] 200 Figure 10. Output Voltage vs. Junction Temperature (Thermal Shut Down) 4.8 6 5 Power on and under-voltage reset Switing threshold and Hysteresis: VRT , VRHY [V] Tj = -40 °C Tj = 25 °C Tj = 125 °C RO Voltage : VRO [V] 4 4 3 2 1 4.7 4.6 4.5 VRT+VRHY 4.4 VRT 4.3 0 0 1 2 3 4 5 -40 6 40 80 120 150 Junction Temperature : Tj [℃] Figure 12. Power on and under-voltage reset Switing threshold and Hysteresis vs. Junction Temperature VO voltage : VO [V] Figure 11. RO Voltage vs. VO Voltage www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 9/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Typical Performance Curves (Unless otherwise specified, Tj = -40 °C to 150 °C, VCC = 13.5 V) -Continued 28 10000 27 Delay Time L→H: TDLH [ms] Delay time L→H: TDLH [ms] 1000 25 23 21 19 100 10 1 0.1 17 -40 0 40 80 120 0.01 0.001 150 0.01 Junction Temperature : Tj [℃] 1 10 CT Capacitance : CCT [μF] Figure 13. Delay Time L→H vs. Junction Temperature (CCT = 0.22 µF) Figure 14. Delay Time L→H vs. CT Capacitance 0.90 6 5 RADJ Switcting threshold : VRADJ,TH [V] Tj = -40 °C RO Voltage : VRO [V] 0.1 Tj = 25 °C Tj = 125 °C 4 3 2 1 0.85 0.80 0.75 0.70 0.65 0.60 0 0.0 0.2 0.4 0.6 0.8 1.0 0 40 80 120 150 Junction Temperature : Tj [℃] RADJ voltage : VRADJ [V] Figure 15. RO Voltage vs. RADJ Voltage www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 -40 Figure 16. RADJ switching threshold vs. Junction Temperature 10/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Typical Performance Curves (Unless otherwise specified, Tj = -40 °C to 150 °C, VCC = 13.5 V) -Continued 0.90 6 Tj = -40 °C Tj = 25 °C Tj = 125 °C 0.85 SI threshold : VSIH, VSIL [V] SO Voltage : VSO [V] 5 4 3 2 1 0.80 0.75 0.70 VSIH 0.65 0 0.0 0.2 0.4 0.6 0.8 0.60 1.0 -40 SI Voltage : VSI [V] 0 40 80 120 150 Junction Temperature : Tj [℃] Figure 17. SO Voltage vs. SI Voltage www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VSIL Figure 18. SI threshold vs. Junction Temperature 11/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Measurement circuit for Typical Performance Curves Measurement Circuit for Figure 1, 2, 3, 4, 6, 10 Measurement Circuit for Figure 9 Measurement Circuit for Figure 15, 16 www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Measurement Circuit for Figure 5 Measurement Circuit for Figure 11, 12 Measurement Circuit for Figure 7, 8 Measurement Circuit for Figure 13, 14 Measurement Circuit for Figure 17, 18 12/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Timing Chart 1. Power on and under-voltage reset (RADJ is connected to GND) 13.5 V VCC 0V VREC (1) 5V 0V VO VRU (2) VRT ≈ VO 0V VCT VCTH VCTL ≈ VO 0V VRO (1) VREC = VRT + VRHY VRU = 2 to 3.5 V (3) When RADJ is used, V RT = VRTADJ, VREC = VRTADJ + VRHY (2) 2. Input voltage reset 5V VRU VO VSIH 0V VSIL VSI 0V VO VSO 0V www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Selection of Components Externally Connected ・VCC pin capacitor Insert capacitors with a capacitance of 0.1 μF or higher between the VCC and GND pin. We recommend using ceramic capacitor generally featuring good high frequency characteristic. When selecting a ceramic capacitor, please be consider about temperature and DC - biasing characteristics. Place capacitors closest possible to VCC - GND pin. When input impedance is high, e.g. in case there is distance from battery, line voltage drop needs to be prevented by large capacitor. Choose the capacitance according to the line impedance between the power smoothing circuit and the VCC pin. Selection of the capacitance also depends on the applications. Verify the application and allow sufficient margins in the design. We recommend using a capacitor with excellent voltage and temperature characteristics. ・Output pin capacitor In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend using a ceramic capacitor with a capacitance of 6 μF or higher. In selecting the capacitor, ensure that the capacitance of 6 μF or higher is maintained at the intended applied voltage and temperature range. Due to changes in temperature the capacitor's capacitance can fluctuate possibly resulting in oscillation. In actual applications the stable operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is needed. When selecting a ceramic capacitor, we recommend using X7R or better components with excellent temperature and DC - biasing characteristics and high voltage tolerance. In case of the transient input voltage and the load current fluctuation, output voltage may fluctuate. In case this fluctuation can be problematic for the application, connect low ESR capacitor (capacitance > 6 μF, ESR < 1 Ω) in paralleled to large capacitor with a capacitance of 13 μF or higher and ESR of 5 Ω or lower. Electrolytic and tantalum capacitors can be used as large capacitor. When selecting an electrolytic capacitor, please consider about increasing ESR and decreasing capacitance at cold temperature. Place the capacitor closest possible to output pin. ・RADJ pin Power on and under-voltage reset threshold is changed by connecting external resister R1 and R2 in Figure 19.The available resister range is from VO VO R2 1 RADJ , RO R1 VREF 2 1 (R1 and R2 recommended resistance values are 100 kΩ or lower.) Power on and under-voltage reset is adjusted in from 3.5V to 4.5V. In case that it is needless to RADJ pin, it must be short GND. If it is open, the reset function can be unstable. Figure 19. RADJ pin configuration method ・SI pin Input voltage reset threshold is changed by connecting external resister R3 and R4 in Figure 20. The adjusted reset threshold VSIADJL and VSIADJH can be calculated by following equation. VCC VO 3 R4 SI 3 SO R3 VREF Figure 20. SI pin configuration method www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4 (R3 and R4 recommended resistance values are 100 kΩ or lower.) This IC incorporates UVLO circuit to prevent malfunction of the reset block in case of very low output voltage. When UVLO is activated, SO is L regardless of SI voltage. When SI is used, set VO ≥ 3.5 V. In case that it is needless to SI pin, it must be short VO. If it is open, the reset function can be unstable. 14/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Power Dissipation ■SOP-J8 Power Dissipation: Pd [W] 2.0 IC mounted on ROHM standard board based on JEDEC. ① : 1 - layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. ②1.43W 1.5 1.0 ② ①0.80 W 0.5 0.0 0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] Figure 21. SOP-J8 Package Data (Reference Data) : 4 - layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB : 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB : 74.2 mm x 74.2 mm, 2 oz. copper. Condition①: θJA = 155 °C / W, ΨJT (top center) = 15 °C / W Condition②: θJA = 87 °C / W, ΨJT (top center) = 13 °C / W ■HTSOP-J8 5 Power Dissipation: Pd[W] 4 IC mounted on ROHM standard board based on JEDEC. ① : 1 - layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. ②3.67 W 3 2 ② ①0.96 W 1 0 0 25 50 75 100 125 Ambient Temperature: Ta [°C] Figure 22. HTSOP-J8 Package Data (Reference Data) www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 150 : 4 - layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB : 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB : 74.2 mm x 74.2 mm, 2 oz. copper. Condition①: θJA = 130 °C / W, ΨJT (top center) = 15 °C / W Condition②: θJA = 34 °C / W, ΨJT (top center) = 7 °C / W 15/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Thermal Design Within this product, the power consumption is decided by the dropout voltage condition, the load current and the circuit current. Refer to Package Data illustrated in Figure 21, 22 when using the IC in an environment of Ta ≥ 25 °C. Even if the ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be very high. Consider the design to be Tj ≤ Tjmax = 150 °C in all possible operating temperature range. On the reverse side of the package BD4269EFJ-C has an exposed heat pad for improving the heat dissipation. Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in the thermal design by the following method is used to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods. 1. The following method is used to calculate the junction temperature Tj. Tj Ta PC θJA Where: Tj Ta PC θJA : Junction Temperature : Ambient Temperature : Power Consumption : Thermal Impedance (Junction to Ambient) 2. The following method is also used to calculate the junction temperature Tj. Tj TT PC ΨJT Where: Tj TT PC ΨJT : Junction Temperature : Top Center of Case’s (mold) Temperature : Power consumption : Thermal Impedance (Junction to Top Center of Case) The following method is used to calculate the power consumption Pc (W). Pc VCC ‐ VO IO VCC ICC Where: PC VCC VO IO ICC : Power Consumption : Input Voltage : Output Voltage : Load Current : Circuit Current www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C ・Calculation Example (SOP-J8) If VCC = 13.5 V, VO = 5.0 V, IO = 50 mA, ICC = 70 μA, the power consumption Pc can be calculated as follows: PC VCC ‐ VO IO VCC ICC 13.5 V – 5.0 V 50 mA 0.43 W 13.5 V 70 μA At the ambient temperature Tamax = 85°C, the thermal Impedance (Junction to Ambient)θJA = 87 °C / W ( 4-layer PCB ), Tj Tamax PC θJA 85 °C 0.43 W 87 °C / W 122.5 °C When operating the IC, the top center of case’s (mold) temperature TT = 100 °C、ΨJT = 15 °C / W (1-layer PCB), Tj TT PC ΨJT 100 °C 0.43 W 106.5 °C 15 °C / W For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad. ・Calculation Example (HTSOP-J8) If VCC = 13.5 V, VO = 5.0 V, IO = 50 mA, ICC = 70 μA, the power consumption Pc can be calculated as follows: PC VCC ‐ VO IO VCC ICC 13.5 V – 5.0 V 50 mA 0.43 W 13.5 V 70 μA At the ambient temperature Tamax = 85°C, the thermal impedance (Junction to Ambient) θJA = 34 °C / W (4-layer PCB), Tj Tamax PC θJA 85 °C 0.43 W 34 °C / W 99.7 °C When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 15 °C / W (1-layer PCB), Tj TT PC ΨJT 100 °C 0.43 W 106.5 °C 15 °C / W For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C I/O equivalence circuits 1 VCC 2 SI 3 RADJ VCC SI 100 kΩ (Typ) 20 kΩ (Typ) 3 pF (Typ) 4 CT VO CT 6 RO VO 7 SO VO 20 kΩ (Typ) RO 100 Ω (Typ) VO 24 kΩ (Typ) SO 100 Ω (Typ) 24 kΩ (Typ) 50 kΩ (Typ) 8 VO www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Application Examples ・Applying positive surge to the VCC If the possibility exists that surges higher than 45 V will be applied to the VCC, a Zener Diode should be placed between the VCC and GND as shown in the figure below. ・Applying negative surge to the VCC If the possibility exists that negative surges lower than the GND are applied to the VCC, a Shottky Diode should be place between the VCC and GND as shown in the figure below. ・Implementing a Protection Diode If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup and shutdown, a protection diode should be placed as shown in the figure below. VCC VO GND ・Reverse Polarity Diode In some applications, the VCC and the VO potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, the accumulated charge in the output pin capacitor flowing backward from the VO to the VCC when the VCC shorts to the GND. In order to minimize the damage in such case, use a capacitor with a capacitance less than 1000 μF. Also by inserting a reverse polarity diode in series to the VCC, it can prevent reverse current from reverse battery connection or the case. When the point A is short-circuited GND, if there may be any possible case point B is short-circuited to GND, we also recommend using a bypass diode between the VCC and the VO. Bypass Diode Reverse Polarity Diode A B VCC VO GND www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. On the reverse side of the package BD4269EFJ-C has an exposed heat pad for improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation pattern as far as possible. The amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed the Pd rating. Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in the thermal design. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Operational Notes – continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. 12. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 14. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Physical Dimension, Tape and Reel Information Package Name SOP-J8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 22/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Physical Dimension, Tape and Reel Information -Continued Package Name HTSOP-J8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 23/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Ordering Information B D 4 2 Part Number 6 9 F J - Package FJ: SOP-J8 EFJ: HTSOP-J8 C E2 Product Rank C:for Automotive Packaging and forming specification E2: Embossed tape and reel Marking Diagram HTSOP-J8 (TOP VIEW) SOP-J8 (TOP VIEW) Part Number Marking Part Number Marking D 4 2 6 9 D LOT Number 2 6 9 LOT Number 1PIN MARK 1PIN MARK www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4 24/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 BD4269FJ-C Datasheet BD4269EFJ-C Revision History Date 31.Jul.2014 Revision Changes 001 New Release 27.Feb.2015 002 BD4269EFJ-C was added. P1 Revised expression on the tittle P1 AEC-Q100 grade was added. P4, P5, P15, P16 and P17 Revised expression on the information of Thermal Characteristics of SOP-J8. P14 Revised expression on the information of VCC pin and Output pin capacitors. P19 Added description on Reverse Polarity Diode. P20 Revised expression on the information of Thermal Consideration. 20.Mar.2015 003 P5 A writing error of paragraph of Thermal Characteristics was corrected. P15 A writing error of paragraph of Power Dissipation was corrected. 5.Jun.2015 004 P1 The Figure of “Not Using SI and RADJ” was corrected. P16 Description of Thermal Design was corrected. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/25 TSZ02201-0G1G0AN00380-1-2 5.Jun.2015 Rev.004 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001