TI1 MAX202CDG4 5-v dual rs-232 line driver/receiver with esd protection Datasheet

MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E – JULY 2003 – REVISED APRIL 2007
FEATURES
•
•
•
•
•
•
ESD Protection for RS-232 Bus Pins
– ±15-kV – Human-Body Model
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates at 5-V VCC Supply
Operates Up to 120 kbit/s
External Capacitors . . . 4 × 0.1 µF
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D, DW, N, OR PW PACKAGE
(TOP VIEW)
C1+
V+
C1C2+
C2VDOUT2
RIN2
APPLICATIONS
•
•
•
•
•
•
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The MAX202 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The device operates at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs driver output
slew rate.
ORDERING INFORMATION
PACKAGE (1) (2)
TA
PDIP – N
SOIC – D
0°C to 70°C
SOIC – DW
TSSOP – PW
PDIP – N
SOIC – D
–40°C to 85°C
SOIC – DW
TSSOP – PW
(1)
(2)
ORDERABLE PART NUMBER
Tube of 25
MAX202CN
Tube of 40
MAX202CD
Reel of 2500
MAX202CDR
Tube of 40
MAX202CDW
Reel of 2000
MAX202CDWR
Tube of 90
MAX202CPW
Reel of 2000
MAX202CPWR
Tube of 25
MAX202IN
Tube of 40
MAX202ID
Reel of 2500
MAX202IDR
Tube of 40
MAX202IDW
Reel of 2000
MAX202IDWR
Tube of 90
MAX202IPW
Reel of 2000
MAX202IPWR
TOP-SIDE MARKING
MAX202CN
MAX202C
MAX202C
MA202C
MAX202IN
MAX202I
MAX202I
MB202I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated
MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E – JULY 2003 – REVISED APRIL 2007
Function Tables
xxx
EACH DRIVER (1)
(1)
INPUT
DIN
OUTPUT
DOUT
L
H
H
L
H = high level, L = low level
EACH RECEIVER (1)
(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
14
DIN1
DOUT1
10
7
DIN2
DOUT2
12
13
ROUT1
RIN1
9
8
ROUT2
2
RIN2
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E – JULY 2003 – REVISED APRIL 2007
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range (2)
V+
Positive charge pump voltage range (2)
V–
Negative charge pump voltage
VI
Input voltage range
VO
Output voltage range
DOUT
Short-circuit duration
θJA
MIN
MAX
–0.3
6
V
VCC – 0.3
14
V
–14
0.3
V
–0.3
V+ + 0.3
range (2)
Drivers
±30
Receivers
Drivers
V – –0.3
V+ + 0.3
–0.3
VCC + 0.3
Receivers
D package
73
DW package
57
N package
67
PW package
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
V
V
Continuous
Package thermal impedance (3) (4)
TJ
UNIT
°C/W
108
–65
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
(see Figure 4)
MIN
NOM
MAX
4.5
5
5.5
Supply voltage
VIH
Driver high-level input voltage
DIN
VIL
Driver low-level input voltage
DIN
Driver input voltage
DIN
VI
TA
(1)
Receiver input voltage
MAX202I
V
2
V
0.8
0
5.5
–30
30
0
70
–40
85
MAX202C
Operating free-air temperature
UNIT
V
V
°C
Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ±0.5 V.
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
ICC
(1)
(2)
Suppy current
TEST CONDITIONS
No load, VCC = 5 V
MIN
TYP (2)
MAX
8
15
UNIT
mA
Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V, and TA = 25°C.
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E – JULY 2003 – REVISED APRIL 2007
DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
9
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–9
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI at 0 V
IOS (3)
Short-circuit output current
VCC = 5.5 V
VO = 0 V
rO
Output resistance
VCC, V+, and V– = 0 V
VO = ±2 V
(1)
(2)
(3)
MAX
UNIT
V
V
µA
15
200
–15
–200
µA
±10
±60
mA
Ω
300
Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of suply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
Maximum data rate
TEST CONDITIONS
CL = 50 to 1000 pF,
RL = 3 kΩ to 7 kΩ,
One DOUT switching,
See Figure 1
tPLH(D)
Propagation delay time, low- to
high-level output
CL = 2500 pF,
RL = 3 kΩ,
All drivers loaded,
See Figure 1
tPHL(D)
Propagation delay time, high- to
low-level output
CL = 2500 pF,
RL = 3 kΩ,
All drivers loaded,
See Figure 1
tsk(p)
Pulse skew (3)
CL = 150 to 2500 pF,
RL = 3 kΩ to 7 kΩ,
SR(tr)
Slew rate, transition region
(see Figure 1)
(1)
(2)
(3)
MIN
RL = 3 kΩ to 7 kΩ,
VCC = 5 V
MAX
120
See Figure 2
CL = 50 to 1000 pF,
TYP (2)
3
UNIT
kbit/s
2
µs
2
µs
300
ns
6
30
V/µs
Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
ESD Protection
PIN
DOUT, RIN
4
TEST CONDITIONS
Human-body model
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TYP
UNIT
±15
kV
MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E – JULY 2003 – REVISED APRIL 2007
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (seeFigure 4)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VCC = 5 V,
TA = 25°C
VIT–
Negative-going input threshold voltage
VCC = 5 V,
TA = 25°C
Vhys
Input hysteresis (VIT+ – VIT–)
ri
Input resistance
(1)
(2)
MIN
TYP (2)
3.5
VCC – 0.4
1.7
MAX
UNIT
V
0.4
V
2.4
V
0.8
1.2
0.2
0.5
1
V
3
5
7
kΩ
VI = ±3 V to ±25 V
V
Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of suply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
UNIT
tPLH(R)
Propagation delay time, low- to high-level output
CL = 150 pF
0.5
10
µs
tPHL(R)
Propagation delay time, high- to low-level output
CL = 150 pF
0.5
10
µs
tsk(p)
(1)
(2)
(3)
Pulse
skew (3)
300
ns
Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E – JULY 2003 – REVISED APRIL 2007
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 W
RL
1.5 V
0V
tPHL (D)
CL
(see Note A)
Output
tPLH (D)
3V
3V
–3 V
–3 V
TEST CIRCUIT
SR(tf) =
6V
tPHL(D) or tPLH(D)
VOH
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 W
RL
1.5 V
Input
1.5 V
0V
CL
(see Note A)
tPHL (D)
tPLH (D)
VOH
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 2. Driver Pulse Skew
Input
Generator
(see Note B)
3V
1.5 V
1.5 V
–3 V
Output
50 W
CL
(see Note A)
tPHL (R)
tPLH (R)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E – JULY 2003 – REVISED APRIL 2007
APPLICATION INFORMATION
1
C1 +
†
C3 +
0.1 mF,
–
0.1 mF
6.3 V
–
16 V
VCC
C1+
16
+ CBYPASS
– = 0.1 mF,
2
V+
GND
3
15
14
DOUT1
C1–
13
4
C2
0.1 mF,
16 V
5 kW
+
–
5 C2–
12
C4
0.1 mF,
16 V
DOUT2
RIN2
RIN1
C2+
6
–
11
V–
ROUT1
DIN1
+
7
10
8
9
DIN2
ROUT2
5 kW
†
C3 can be connected to VCC or GND.
NOTES: A . Resistor values shown are nominal.
B . Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation. The MAX202 requires 0.1-µF capacitors,
although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF
capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V–.
Use larger capacitors (up to 10 µF) to reduce the output impedance at V+ and V–.
Bypass VCC to ground with at least 0.1 µF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1–C4).
ESD Protection
TI MAX202 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15-kV when powered down.
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E – JULY 2003 – REVISED APRIL 2007
APPLICATION INFORMATION (continued)
ESD Test Conditions
Stringent ESD testing is performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5. Figure 6 shows the current waveform that is generated during a
discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of
concern, and subsequently discharged into the device under test (DUT) through a 1.5-kΩ resistor.
RD
1.5 kW
VHBM
CS
+
-
DUT
100 pF
Figure 5. HBM ESD Test Circuit
1.5
VHBM = 2 kV
DUT = 10-V, 1-W Zener Diode
|
IDUT - A
1.0
0.5
0.0
0
50
100
150
200
Time - ns
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
8
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX202CD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CDRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CDW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CDWE4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CDWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CDWRE4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX202C
MAX202CPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MA202C
MAX202CPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MA202C
MAX202CPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MA202C
MAX202ID
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
MAX202IDE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
MAX202IDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
MAX202IDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
MAX202IDRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX202IDRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
MAX202IDW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
MAX202IDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
MAX202IDWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX202I
MAX202IPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB202I
MAX202IPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB202I
MAX202IPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB202I
MAX202IPWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MB202I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MAX202CDR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX202CDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
MAX202CPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MAX202IDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX202IDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
MAX202IPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX202CDR
SOIC
D
16
2500
333.2
345.9
28.6
MAX202CDWR
SOIC
DW
16
2000
367.0
367.0
38.0
MAX202CPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
MAX202IDR
SOIC
D
16
2500
333.2
345.9
28.6
MAX202IDWR
SOIC
DW
16
2000
367.0
367.0
38.0
MAX202IPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
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