TDK C1608C0G1H332J080AE Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : November 28, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1608C0G1H332J080AE
新製品
TDK item description C1608C0G1H332JT***S
Commercial Grade
Applications
Please refer to Part No. CGA3E2C0G1H332J080AE for Automotive use.
Feature
Soft Soft Termination
Series
C1608 [EIA 0603]
Status
Production
Size
Length(L)
1.60mm +0.20,-0.10mm
Width(W)
0.80mm +0.15,-0.10mm
Thickness(T)
0.80mm +0.15,-0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
Recommended Land Pattern (PA)
0.60mm to 0.80mm(Reflow Soldering)
0.80mm to 1.00mm(Flow Soldering)
Recommended Land Pattern (PB)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
3.3nF ±5%
Rated Voltage
50VDC
Temperature Characteristic
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : November 28, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1608C0G1H332J080AE
新製品
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
Capacitance
C1608C0G1H332J080AE
C1608C0G1H332J080AE
DC Bias Characteristic
C1608C0G1H332J080AE
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Temperature Characteristic
C1608C0G1H332J080AE(No Bias)
C1608C0G1H332J080AE(DC Bias =
25V)
Multilayer Ceramic Chip Capacitors
C1608C0G1H332J080AE
新製品
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : November 28, 2017 (GMT)
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