ON EMI9106 Emi filter for microsd interface Datasheet

EMI9106
EMI Filter for MicroSD
Interfaces
Description
The EMI9106 is a combination EMI filter and line termination
device with integrated TVS diodes for use on Multimedia Card
interfaces. This state−of−the−art device utilizes solid−state, silicon−
avalanche technology for superior clamping performance and DC
electrical characteristics. The EMI9106 has been optimized for
protection of MicroSD interfaces in cellular phones and other portable
electronics.
The EMI9106 consists of six circuits that includes series impedance
matching resistors as required by the SD specification. TVS diodes are
included on each line for ESD protection. An additional TVS diode
connection is included for protection of the voltage (Vcc) bus.
Termination resistor value of 40 W is provided on the SDData0,
SDData1, SDData2, SDData3, CMD, and CLK lines.
The TVS diodes provide effective suppression of ESD voltages in
excess of ±15 kV (contact discharge) per IEC 61000−4−2, level 4. The
EMI9106 is in a 16−pin, RoHS/WEEE compliant, UDFN 16−pin
package. It measures 3.30 x 1.35 x 0.50 mm. The leads are spaced at a
pitch of 0.4 mm and are finished with lead−free NiPd.
Features
• Bidirectional EMI/RFI Filtering and Line Termination with
•
16
1
UDFN16
CASE 517BE
MARKING DIAGRAM
9106 MG
G
1
9106
= Specific Device Code
M
= Single Character Date Code
G
= Pb−Free Package
(*Note: Microdot may be in either location)
PINOUT DIAGRAM
SDData1
Data1
SDData0
Data0
SDCLK
ESD1
ESD3
Applications
• MicroSD Interfaces
• MMC Interfaces
• CDMA, GSM, 3G Cell Phones
GND PAD
•
•
•
•
•
Integrated ESD Protection
Provides ESD Protection to IEC61000−4−2:
±15 kV Contact Discharge
TVS Working Voltage: 3.3 V
Termination Resistors: 40 W
Typical Capacitance per Line: 12 pF (VIN = 2.5 V)
Protection and Termination for Six Lines + Vcc
Solid−state Technology
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CLK
ESD1
VCC
SDCMD
CMD
SDData3
Data3
SDData2
Data2
(Top View)
Mechanical Characteristics
•
•
•
•
•
0.40 mm, uDFN 16−pin Package
Nominal Dimensions: 3.30 x 1.35 x 0.50 mm
Pitch: 0.4 mm
Pin−lead Finish: NiPd
RoHS/WEEE Compliance, Lead−free Finish
© Semiconductor Components Industries, LLC, 2013
December, 2013 − Rev. 0
ORDERING INFORMATION
Device
Package
Shipping†
EMI9106MUTAG
UDFN16
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1
Publication Order Number:
EMI9106/D
EMI9106
ELECTRICAL SCHEMATIC
Table 1. PIN DESCRIPTIONS
Pin
Name
Description
1
SDData1
Data line #1 input/output
2
SDData0
Data line #0 input/output
3
SDCLK
Clock line Input/Output
4
ESD1
Single ESD
5
ESD3
Single ESD
6
SDCMD
Command Line Input/Output
7
SDData3
Data line #3 input/output
8
SDData2
Data line #2 input/output
9
Data2
Data line #2 input/output
10
Data3
Data line #3 input/output
11
CMD
Command Line Input/Output
12
VCC
Power Supply ESD Protection
13
ESD1
Single ESD
14
CLK
Clock line Input/Output
15
Data0
Data line #0 input/output
16
Data1
Data line #1 input/output
GND PAD
GND
Ground return to shield
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2
EMI9106
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
Operating Temperature Range
−40 to +85
°C
Storage Temperature Range
−55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
RCH
Channel Resistance (R1 to R6)
LCH
Channel Inductance
C
Conditions
Capacitance per Channel
VIN = 0 V; 1 MHz; 30 mVRMS
Max
Units
34
40
46
W
16
20
nH
24
VIN = 2.5 V; 1 MHz; 30 mVRMS;
(Note 2)
12
0.1
0.5
6.8
−0.8
9.0
−0.4
Diode Leakage Current per Channel
VIN = 3 V
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
fC
Typ
20
ILEAK
VESD
Min
pF
pF
mA
V
ESD Protection − Peak Discharge Voltage at any
channel input, in system:
a) Contact discharge per IEC 61000−4−2 Standard
and
b) Air discharge per IEC 61000−4−2 Standard
5.6
−1.5
kV
(Note 2)
±15
(Note 2)
±15
Cut−off frequency
ZSOURCE = 50 W, ZLOAD = 50 W
300
1. All parameters specified at TA = 25°C unless otherwise noted.
2. This parameter is guaranteed by design and verified by device characterization
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3
MHz
EMI9106
PERFORMANCE INFORMATION
0
INSERTION LOSS (dB)
−5
−10
−15
−20
−25
−30
−35
−40
−45
−50
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
Figure 1. Typical Insertion Loss vs. Frequency (Data0, Data1, Data2, Data3, CLK, CMD)
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4
EMI9106
PACKAGE DIMENSIONS
UDFN16, 3.3x1.35, 0.4P
CASE 517BE
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
L1
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
TOP VIEW
EXPOSED Cu
A
DETAIL B
0.05 C
(A3)
16X
A1
0.05 C
NOTE 4
16X
A1
SIDE VIEW
K
1
8
16
9
e
C
SEATING
PLANE
ÇÇ
ÇÇ
ÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MOLD CMPD
A3
DETAIL B
OPTIONAL
CONSTRUCTION
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
3.30 BSC
2.70
2.90
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
DETAIL A
D2
L
L
L
E2
16X
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
b
BOTTOM VIEW
3.00
16X
0.40
0.10 C A B
0.05 C
NOTE 3
1.55
0.50
16X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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PUBLICATION ORDERING INFORMATION
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
EMI9106/D
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