LITEON LTLA2S3TBW1K Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTLA2S3TBW1K
Spec No.: DS20-2015-0056
Effective Date: 04/11/2015
Revision: -
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
Through-Hole Lamp
LTLA2S3TBW1K
Through Hole Lamp
LTLA2S3TBW1K
Rev
Description
By
Date
Above data for PD and Customer tracking only
-
New spec.
Lewis Liu
1/9
03/13/2015
Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
Through-Hole Lamp
LTLA2S3TBW1K
1. Description
5mm round lamp is a popular design with a smooth uniform view angle radiation pattern suitable in Full color signboard,
Billboard sign, Message sign and bus sign. High luminous intensity output has a higher emitting efficiency to save power
energy. Advanced epoxy technology has a good moisture resistance and UV protection to be used in package, and it can
reduce the effect of long term exposure in outdoor environment.
1. 1. Features








High Luminous intensity output.
Low power consumption & High efficiency.
Superior resistance to moisture
Good UV inhibitor
Lead free & RoHS Compliant
Lead free reflow solder compatible
Popular T-1 3/4diameter, Blue InGaN 465nm Lamp,
Water clear package.
Typical viewing angle 15°
1.2. Applications

Motorcycle light
2. Outline Dimensions
Notes :
1.
2.
3.
4.
All dimensions are in millimeters (inches).
Tolerance is ±0.25mm (.010") unless otherwise noted.
Protruded resin under flange is 1.0mm (.04") max.
Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
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Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
Through-Hole Lamp
LTLA2S3TBW1K
3. Absolute Maximum Ratings at TA=25℃
Parameter
Maximum Rating
Unit
105
mW
(Duty Cycle≦1/10, Pulse Width≦10ms)
100
mA
DC Forward Current
30
mA
0.57
mA/℃
5
V
Power Dissipation
Peak Forward Current
Derating Linear From 38℃
Reverse Voltage
Operating Temperature Range
-30°C to + 85°C
Storage Temperature Range
-40°C to + 100°C
Lead Soldering Temperature
[2.0mm (.079") From Body]
260°C for 5 Seconds Max.
4. Electrical / Optical Characteristics at TA=25℃
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
IF = 20mA
Luminous Intensity
IV
5500
mcd
2θ1/2
15
deg
Peak Emission Wavelength
λP
471
nm
Dominant Wavelength
λd
465
nm
Spectral Line Half-Width
Δλ
25
nm
Forward Voltage
VF
3.2
V
IF = 20mA
Reverse Current
IR
μA
VR = 5V
Viewing Angle
Note 1,5
Note 2,7 (Fig.6)
Measurement
1
@Peak (Fig.1)
Note 4
NOTE:
1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Iv classification code is marked on each packing bag.
4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the device.
5. Iv guarantee must be included with ±15% testing tolerance.
6. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation.
7. View angle measurement is ±2 degree tolerance.
3/9
Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
Through-Hole Lamp
LTLA2S3TBW1K
5. Typical Electrical / Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
Relative Intensity
1.0
0.8
0.5
0.3
0.0
350
400
450
500
550
600
650
Wavelength (nm)
700
750
800
0
10
20
30
40
Forward Current If(mA)
Fig1. Spectrum
Relative Intensity
Forward Current IF (mA)
40
30
20
10
2
1.5
1
0.5
0
0
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Forword Voltage VF (V)
Fig 2. Vf vs If
Fig 3. If vs Relative Iv
Driving Current (mA)
35
-30°
30
25
20
-60°
15
10
5
0
0
20
40
60
80
100
Ambient Temperature (°C)
120
Fig 4. Ambient Temperature vs Driving Current
-90°
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0°
30°
60°
90°
Fig 5. Light Pattern
4/9
Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
Through-Hole Lamp
LTLA2S3TBW1K
6. Packing Spec.
500 or 250 pcs per packing bag
10 packing nags per inner carton
Total 5,000 pcs per inner carton
8 inner cartons per outer carton.
Total 40,000 pcs per outer carton.
In every shipping lot, only the last pack will be non-full packing
5/9
Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
Through-Hole Lamp
LTLA2S3TBW1K
7. Bin Table Specification
Luminous Intensity Iv (mcd) IF@20mA
Bin Code
Min.
Max.
V
4200
5500
W
5500
7200
X
7200
9300
Y
9300
12000
Note: Tolerance of each bin limit is ±15%
Dominant Wavelength Unit : nm @20mA
Bin Code
Min
Max
B07
460
465
B08
465
470
B09
470
475
Note: Tolerance of each bin limit is ±1nm
Forward Voltage Unit : V @20mA
Bin Code
Min
Max
3
2.75
3.0
4
3.0
3.25
5
3.25
3.5
Note: Tolerance of each bin limit is ±0.1V
6/9
Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
Through-Hole Lamp
LTLA2S3TBW1K
8. CAUTIONS
8.1. Application
This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment.
8.2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that
LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is
recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen
ambient.
8.3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
8.4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the
lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly
on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
8.5. Soldering
When soldering, leave a minimum of 3mm clearance from the base of the lens to the soldering point. Dipping the lens into the
solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high
temperature.
Recommended soldering conditions:
Soldering iron
Temperature
Soldering time
Position
350°C Max.
3 seconds Max.
(one time only)
No closer than 2mm
from the base of the epoxy bulb
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
Dipping Position
100°C Max.
60 seconds Max.
260°C Max.
5 seconds Max.
No lower than 2mm from the
base of the epoxy bulb
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not a suitable process for through hole type LED lamp product.
8.6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as
shown in Circuit A below.
Circuit model (A)
LED
Circuit model (B)
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.
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Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
Through-Hole Lamp
LTLA2S3TBW1K
8.7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:




Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
All devices, equipment, and machinery must be properly grounded
Work tables, storage racks, etc. should be properly grounded
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic
lens as a result of friction between LEDs during storage and handing
Suggested checking list:
Training and Certification
8.7.1.1. Everyone working in a static-safe area is ESD-certified?
8.7.1.2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
8.7.2.1. Static-safe workstation or work-areas have ESD signs?
8.7.2.2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
8.7.2.3. All ionizer activated, positioned towards the units?
8.7.2.4. Each work surface mats grounding is good?
Personnel Grounding
8.7.3.1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes
with conductive flooring?
8.7.3.1. If conductive footwear used, conductive flooring also present where operator stand or walk?
8.7.3.2. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
8.7.3.3. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
8.7.3.4. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
8.7.4.1. Every ESDS items identified by EIA-471 labels on item or packaging?
8.7.4.2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation?
8.7.4.3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
8.7.4.4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
8.7.5.1. Audit result reported to entity ESD control coordinator?
8.7.5.2. Corrective action from previous audits completed?
8.7.5.3. Are audit records complete and on file?
8/9
Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
Through-Hole Lamp
LTLA2S3TBW1K
9. Reliability Test
Classification
Endurance
Test
Environmental
Test
Test Item
Test Condition
Sample Size
Reference Standard
Operation Life
Ta = 25°C
IF = 30mA
Test Time= 1000hrs
45 PCS
(CL=90%;
LTPD=5%)
High Temperature
High Humidity
storage (THB)
Ta = 85°C
RH = 85%
Test Time= 1000hrs
45 PCS
(CL=90%;
LTPD=5%)
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
Steady state
Operation Life of
High Humidity Heat
Ta = 85°C, RH= 85 %
IF =3mA
Test Time= 500hrs
76 PCS
(CL=90%;
LTPD=3%)
JESD22-A101C (2009)
Low Temperature
Operation Life of
Ta = -30°C
IF = 30mA
Test Time= 1000hrs
45 PCS
(CL=90%;
LTPD=5%)
High Temperature
Storage
Ta= 105 ± 5°C
Test Time= 1000hrs
45 PCS
(CL=90%;
LTPD=5%)
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
Low Temperature
Storage
Ta= -55 ± 5°C
Test Time= 1000hrs
45 PCS
(CL=90%;
LTPD=5%)
JEITA ED-4701:200 202 (2001)
Temperature
Cycling
100°C ~ 25°C ~ -40°C ~ 25°C
76 PCS
30mins
5mins
30mins 5mins (CL=90%;
LTPD=3%)
Test time: 200 Cycles
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
Thermal
Shock
100 ± 5°C ~ -30°C ± 5°C
15mins
15mins
Test time: 200 Cycles
76 PCS
(CL=90%;
LTPD=3%)
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
Solder
Resistance
T.sol = 260 ± 5°C
Dwell Time= 10±1 seconds
3mm from the base of the epoxy bulb
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-750D:2031(1995)
JEITA ED-4701: 300 302 (2001)
Solderability
T. sol = 245 ± 5°C
11 PCS
Dwell Time= 5 ± 0.5 seconds
(CL=90%;
(Lead Free Solder, Coverage ≧95% of
LTPD=18.9%)
the dipped surface)
Soldering Iron
T. sol = 350 ± 5°C
Dwell Time= 3.5 ± 0.5 seconds
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
MIL-STD-750D:2026 (1995)
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
MIL-STD-202G:208H (2002)
JEITA ED-4701:300 302 (2001)
10. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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Part No. : LTLA2S3TBW1K
BNS-OD-FC002/A4
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