CYStech Electronics Corp. 1.0Amp. Surface Mount Schottky Barrier Diodes Spec. No. : C062SH Issued Date : 2016.07.01 Revised Date : Page No. : 1/6 SOD-123 CSOD140BSH Features For surface mounted applications. For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 Low leakage current High surge capability High temperature soldering: 250C/10 seconds at terminals Exceeds environmental standards of MIL-S-19500/228 RoHS compliant package Trench technology provides a superior avalanche capability Mechanical Data Case: Molded plastic, JEDEC SOD-123. Terminals: Pure tin plated, solderable per MIL-STD-202 method 208 Polarity: Indicated by cathode band. Weight: 0.009 gram approximately Ordering Information Device CSOD140BSH-0-T1-G Package SOD-123 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs/ tape & reel in 7” reel Product rank, zero for no rank products Product name CSOD140BSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062SH Issued Date : 2016.07.01 Revised Date : Page No. : 2/6 Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified.) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=1A (Note 1) Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=40V,TJ=25℃(Note 1) VR=40V,TJ=125℃(Note 1) Power Dissipation Maximum thermal resistance, Junction to ambient Diode junction capacitance @ f=1MHz and applied 5V reverse voltage Storage temperature range Operating temperature range Symbol Limits Units VRRM VRMS VR VF IO 40 28 40 0.50 1 V V V V A IFSM 20 A IR 0.3 10 mA mA PD Rth,JA CD Tstg TJ 500 215(typ) 55 (typ) -65 ~ +175 -50 ~ +150 mW ℃/W pF ℃ ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle Recommended Soldering Footprint CSOD140BSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062SH Issued Date : 2016.07.01 Revised Date : Page No. : 3/6 Typical Characteristics CSOD140BSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062SH Issued Date : 2016.07.01 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension CSOD140BSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062SH Issued Date : 2016.07.01 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 240 +0/-5 C 217C 60-150 seconds 260 +0/-5 C 10-30 seconds 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. CSOD140BSH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C062SH Issued Date : 2016.07.01 Revised Date : Page No. : 6/6 SOD-123 Dimension Marking: S5 2-Lead SOD-123 Plastic Surface Mounted Package CYStek Package Code: SH Inches Min. Max. 0.102 0.110 0.059 0.067 0.041 0.049 DIM A B C Millimeters Min. Max. 2.600 2.800 1.500 1.700 1.050 1.250 Style: Pin 1.Cathode 2.Anode DIM D E Inches Min. Max. 0.018 0.026 0.140 0.152 Millimeters Min. Max. 0.450 0.650 3.550 3.850 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: Lead: Pure tin plated. Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CSOD140BSH CYStek Product Specification