Material Content Data Sheet Sales Product Name BBY 53-03W E6327 MA# MA000302800 Package PG-SOD323-2-1 Issued Weight* Construction Element Material Group Substances chip noble metal non noble metal inorganic material non noble metal inorganic material non noble metal non noble metal noble metal inorganic material organic material plastics plastics inorganic material non noble metal noble metal < 10% gold arsenic silicon chromium silicon titanium copper gold antimonytrioxide carbon black brominated resin epoxy resin silicondioxide tin silver leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 4.47 mg CAS# if applicable Weight [mg] Average Mass [%] 7440-57-5 7440-38-2 7440-21-3 7440-47-3 7440-21-3 7440-32-6 7440-50-8 7440-57-5 1309-64-4 1333-86-4 60676-86-0 7440-31-5 7440-22-4 0.003 0.07 0.000 0.00 0.026 0.57 0.004 0.09 0.000 0.01 62 0.001 0.03 312 1.387 31.06 31.19 310602 311912 0.018 0.41 0.41 4082 4082 0.032 0.72 0.032 0.72 7166 0.079 1.76 17590 0.730 16.35 2.037 45.59 65.14 456031 651472 0.076 1.71 1.71 17051 17051 0.041 0.91 0.91 9080 Sum [%] Average Mass [ppm] 670 7 0.64 5726 2. 3. 7166 163519 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 6403 936 Important Remarks: 1. Sum [ppm] 9080 1000000