Formosa MDS26 Smd schottky bridge rectifier Datasheet

Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
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TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2014/04/10
D
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
2.0A Surface Mount Schottky
Barrier Single-Phase Bridge
Rectifiers-20-100V
Package outline
Features
• Schottky barrier chips in TO-269AA bridge.
• Metal semiconductor junction with guard ring.
• Silicon epitaxial planar chips.
• Very low forward drop down voltage.
• For use in low voltage, high efficiency inverters,
•
•
TO-269AA (MDS)
free
wheeling, and polarity protection applications.
Lead-free parts meet RoHS requirments.
Suffix "-H" indicates Halogen free parts, ex. MDS22-H.
.165(4.2)
.142(3.6)
.008(0.2)MAX
.275(7.0)
.031(0.8)
.019(0.5)
MAX
.043(1.1)
Mechanical data
.027(0.7)
.193(4.9)
.177(4.5)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, TO-269AA (MDS)
• Terminals : Solder plated, solderable per
.106(2.7)
.090(2.3)
.106(2.7)
.090(2.3)
MIL-STD-750, Method 2026
• Polarity : marked on body
• Mounting Position : Any
• Weight : Approximated 0.11 gram
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT
PARAMETER
o
T A=25 C unless otherwise noted)
CONDITIONS
Symbol
Average Forward rectified current
2.0x2.0”(5.0x5.0mm) copper pad, See Fig.1
I F(AV)
Peak Forward surge current
8.3ms single half sine-wave (JEDEC methode)
I FSM
MIN.
TYP.
O
V R = V RRM T J = 25 C
Reverse current
O
V R = V RRM T J = 100 C
Thermal resistance
Diode junction capacitance
80
Junction to lead
RθJL
20
f=1MHz and applied 4V DC reverse voltage
CJ
150
*1
V RRM
(V)
V RMS*2
(V)
*3
VR
(V)
MDS22
20
14
20
MDS24
40
28
40
MDS26
60
42
60
MDS28
80
56
80
SYMBOLS
MDS210
100
70
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100
*4
VF
(V)
Operating
temperature
T J, ( OC)
2.0
A
50
A
mA
20
RθJA
T STG
UNIT
0.5
IR
Junction to ambient
Storage temperature
MAX.
O
C/W
pF
O
+175
-65
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
0.50
-55 to +125
*3 Continuous reverse voltage
0.70
0.85
-55 to +150
Page 2
*4 Maximum forward voltage
@I F =2.0A per element
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2014/04/10
D
7
Average Forward Current (A)
Fig.1 - Forward Current Derating Curve
2.4
2.0
1.6
MDS22 - MDS24
1.2
MDS26- MDS210
0.8
0.4
0
25
50
75
100
125
150
Peak Forward Surge Current (A)
Rating and characteristic curves (MDS22 THRU MDS210)
175
Fig. 2 - Maximum Non-Repetitive Peak
Forward Surge Current
100
10
1
1
10
10
pulse width =300μs
1% duty cycle, T j =25°C
MDS22 - MDS24
MDS26
0.1
MDS28 - MDS210
0.01
0
0.2
0.4
0.6
0.8
Fig. 4A - Typical Reverse Characteristics
100
MDS22 - MDS26
T J =125°C
T J =100°C
10
T J =75°C
1.0
0.1
T J =25°C
0.01
0.001
0
1.0
20
40
60
80
100
120
140
Instantaneous Forward Voltage (Volts)
Percent of Rated Peak Reverse Voltage ( %)
Fig. 5 - Typical Junction Capacitance
Fig. 4B - Typical Reverse Characteristics
1000
Junction Capacitance (pF)
Instantaneous Reverse Current (mA)
Fig. 3 - Typical Instantaneour Forward
Characteristics
1.0
100
Number of Cycles at 60 Hz
100
T J =25°C
f=1.0MHz
10
0.1
1.0
10
100
Instantaneous Reverse Current (μA)
Instantaneous Forward Current (A)
Lead Temperature (°C)
MDS28 -MDS210
1000
T J =125°C
T J =100°C
100
T J =75°C
10
1.0
T J =25°C
0.1
0
Reverse Voltage (Volts)
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10000
20
40
60
80
100
Percent of Rated Peak Reverse Voltage ( %)
Page 3
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2014/04/10
D
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
Pinning information
Simplified outline
Symbol
+
~
~
-
Marking
Type number
Marking code
MDS22
MDS24
MDS26
MDS28
MDS210
MDS22
MDS24
MDS26
MDS28
MDS210
Suggested solder pad layout
A
D
B
C
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
D
TO-269AA (MDS)
0.023 (0.58)
0.030 (0.76)
0.070 (1.78)
0.226 (5.75)
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FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2014/04/10
D
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
Packing information
P0
d
P1
T
E
F
W
B
A
P
C
D
D1
D2
W1
unit:mm
Item
Symbol
Tolerance
TO-269AA (MDS)
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
5.00
7.24
3.33
1.50
330.00
50.00
13.00
1.75
5.50
8.00
4.00
2.00
0.30
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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Page 5
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2014/04/10
D
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
Reel packing
PACKAGE
REEL SIZE
TO-269AA (MDS)
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
2,500
8.0
5,000
337*337*37
330
CARTON
SIZE
(m/m)
350*330*360
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
40,000
11.8
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 C /sec
o
o
Time 25 C to Peak Temperature
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<6minutes
Page 6
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2014/04/10
D
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16" ± 1/32"
2. Solderability
at 245 ± 5 C for 5 sec.
O
3. High Temperature Reverse Bias
V R=80% rate at T J=125 C for 168 hrs.
MIL-STD-750D
METHOD-1038
O
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1027
O
5. Intermittent Operation Life
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
O
6. Pressure Cooker
15P SIG at T A=121 C for 4 hrs.
O
JESD22-A102
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
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MIL-STD-750D
METHOD-1031
O
Page 7
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2014/04/10
D
7
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