Material Content Data Sheet Sales Product Name TDA5255 Issued MA# MA000218823 Package PG-TSSOP-38-1 Weight* Construction Element Material Group Substances CAS# if applicable chip leadframe inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon nickel iron gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7440-02-0 7439-89-6 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 wire encapsulation leadfinish plating glue *deviation 29. August 2013 Weight [mg] 117.09 mg Average Mass [%] Sum [%] 4.66 Average Mass [ppm] Sum [ppm] 46638 46638 5.461 4.66 19.584 16.73 27.045 23.10 39.83 230984 398248 0.460 0.39 0.39 3927 3927 0.178 0.15 167264 1520 7.532 6.43 51.596 44.07 50.65 440670 506518 2.173 1.86 1.86 18556 18556 1.464 1.25 1.25 12506 12506 0.319 0.27 1.275 1.09 64328 2721 1.36 10886 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 13607 1000000