TI1 OPA349NA/250G4 Rail-to-rail i/o cmos operational amplifier Datasheet

OPA
OPA349
OPA2349
349
OPA
2349
SBOS121B – JUNE 2000 – REVISED JANUARY 2004
1µA, Rail-to-Rail I/O CMOS
OPERATIONAL AMPLIFIERS
FEATURES
DESCRIPTION
●
●
●
●
●
●
●
●
●
●
The OPA349 and OPA2349 are ultra-low power operational
amplifiers that provide 70kHz bandwidth with only 1µA quiescent current. These rail-to-rail input and output amplifiers are
specifically designed for battery-powered applications. The
input common-mode voltage range extends 200mV beyond
the power-supply rails and the output swings to within 350mV
of the rails, maintaining wide dynamic range. Unlike some
micropower op amps, these parts are unity-gain stable and
require no external compensation to achieve wide bandwidth. The OPA349 features a low input bias current that
allows the use of large source and feedback resistors.
LOW SUPPLY CURRENT: 1µA
GAIN-BANDWIDTH: 70kHz
UNITY-GAIN STABLE
LOW INPUT BIAS CURRENT: 10pA (max)
WIDE SUPPLY RANGE: 1.8V to 5.5V
INPUT RANGE: 200mV Beyond Rails
OUTPUT SWINGS TO 350mV OF RAILS
OUTPUT DRIVE CURRENT: 8mA
OPEN-LOOP GAIN: 90dB
MicroPACKAGES: SC70, SOT23-5, SOT23-8
The OPA349 can be operated with power supplies from 1.8V
to 5.5V with little change in performance, ensuring continuing
superior performance even in low battery situations.
APPLICATIONS
●
●
●
●
●
●
●
●
BATTERY PACKS AND POWER SUPPLIES
PORTABLE PHONES, PAGERS, AND CAMERAS
SOLAR-POWERED SYSTEMS
SMOKE, GAS, AND FIRE DETECTION SYSTEMS
REMOTE SENSORS
PCMCIA CARDS
DRIVING ANALOG-TO-DIGITAL (A/D) CONVERTERS
MicroPOWER FILTERS
The OPA349 comes in miniature SOT23-5, SC70, and SO-8
surface-mount packages. The OPA2349 dual is available in
SOT23-8, and SO-8 surface-mount packages. These tiny
packages are ideal for use in high-density applications, such
as PCMCIA cards, battery packs, and portable instruments.
The OPA349 is specified for 0°C to +70°C. The OPA2349 is
specified for –40°C to +70°C.
OPEN-LOOP GAIN AND PHASE vs FREQUENCY
100
FEATURES
90
PRODUCT
0
Gain
80
TLV240x
TLV224x
TLV238x
TLV27Lx
TLV276x
OPAx347
OPAx348
70
Gain (dB)
1µA, 5.5kHz, Rail-To-Rail
1µA, 5.5kHz, Rail-To-Rail
7µA, 160kHz, Rail-To-Rail, 2.7V to 16V Supply
7µA, 160kHz, Rail-To-Rail, Micro Power
20µA, 500kHz, Rail-To-Rail, 1.8V Micro Power
20µA, 350kHz, Rail-To-Rail, Micro Power
45µA, 1MHz, Rail-To-Rail, 2.1V to 5.5V Supply
45
Phase
60
50
90
40
30
Phase (°)
OPAx349 RELATED PRODUCTS
135
20
10
180
0
0.1
1
10
100
1k
Frequency (Hz)
10k
100k
1M
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 2000-2004, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, V+ to V– ................................................................... 5.5V
Signal Input Terminals, Voltage(2) .................. (V–) – 0.5V to (V+) + 0.5V
Current(2) .................................................... 10mA
Output Short Circuit(3) .............................................................. Continuous
Operating Temperature, OPA2349 ................................ –55°C to +125°C
Operating Temperature, OPA349 ........................................ 0°C to +85°C
Storage Temperature ..................................................... –65°C to +150°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 3s) ................................................... 300°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these, or any other conditions beyond those specified,
is not implied. (2) Input terminals are diode-clamped to the power-supply
rails. Input signals that can swing more than 0.5V beyond the supply rails
should be current-limited to 10mA or less. (3) Short-circuit to ground, one
amplifier per package.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE
PACKAGE
DESIGNATOR(1)
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
Single
OPA349NA
SOT23-5
DBV
A49
"
"
"
SO-8
D
OPA349UA
"
"
"
SC70-5
DCK
S49
"
"
"
"
OPA349NA /250
OPA349NA/3K
OPA349UA
OPA349UA/2K5
OPA349SA/250
OPA349SA/3K
Tape and Reel, 250
Tape and Reel, 3000
Rails, 100
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 3000
Dual
OPA2349EA
SOT23-8
DCN
C49
"
"
"
"
OPA2349UA
SO-8
D
OPA2349UA
"
"
"
"
OPA2349EA/250
OPA2349EA/3K
OPA2349UA
OPA2349UA/2K5
Tape and Reel, 250
Tape and Reel, 3000
Rails, 100
Tape and Reel, 2500
"
OPA349UA
"
OPA349SA
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
PIN CONFIGURATIONS
OPA349
OPA2349
OPA349
NC(1)
1
8
NC(1)
Out A
1
8
V+
–In
2
7
V+
–In A
2
7
Out B
+In
3
6
Out
+In A
3
6
–In B
5
NC(1)
V–
4
5
+In B
V–
4
SO-8
SOT23-8, SO-8
Out
1
V–
2
+In
3
5
V+
4
–In
SOT23-5
OPA349
+In 1
5 V+
V– 2
NOTE: (1) NC indicates no internal connection.
–In 3
4 Out
SC70-5
2
OPA349, 2349
www.ti.com
SBOS121B
ELECTRICAL CHARACTERISTICS (Single): VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = 0°C to +70°C.
At TA = +25°C, and RL = 1MΩ connected to VS /2, unless otherwise noted.
OPA349
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
Over Temperature
Drift
vs Power-Supply Rejection Ratio
Over Temperature
CONDITION
VOS
dVOS /dT
PSRR
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
Over Temperature
VCM
CMRR
VS = 1.8V to 5.5V, VCM = (V–) + 0.3V
VS = +5V, –0.2V < VCM < 5.2V
VS = +5V, –0.2V < VCM < 3.5V
(V–) – 0.2
48
46
52
50
OPEN-LOOP GAIN
Open-Loop Voltage Gain
Over Temperature
Open-Loop Voltage Gain
Over Temperature
en
in
AOL
RL = 1MΩ, VS = +5.5V, +0.3V < VO < +5.2V
AOL
RL = 10kΩ, VS = +5.5V, +0.35V < VO < +5.15V
OUTPUT
Voltage Output Swing from Rail
Over Temperature
74
72
74
60
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.1%
0.01%
Overload Recovery Time
POWER SUPPLY
Specified Voltage Range
Quiescent Current (per amplifier)
Over Temperature
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
SOT23-5 Surface-Mount
SO-8 Surface-Mount
SC70-5 Surface-Mount
mV
mV
µV/°C
µV/V
µV/V
1000
3000
(V+) + 0.2
V
dB
dB
dB
dB
±10
±10
pA
pA
Ω || pF
Ω || pF
8
300
4
µVp-p
nV/√Hz
fA/√Hz
90
dB
dB
dB
dB
90
300
300
350
350
±8
±10
See Typical Characteristics
ISC
CLOAD
VS
IQ
±10
±13
1013 || 2
1013 || 4
RL = 1MΩ, VS = +5.5V, AOL > 74dB
GBW
SR
tS
UNITS
72
RL = 10kΩ, VS = +5.5V, AOL > 74dB
Over Temperature
Output Current
Short-Circuit Current
Capacitive Load Drive
MAX
60
±0.5
±1
IB
IOS
INPUT IMPEDANCE
Differential
Common-Mode
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 1kHz
Current Noise Density, f = 1kHz
TYP(1)
±2
±2
±15
350
VS = 5V, VCM = 2.5V
Over Temperature
INPUT BIAS CURRENT
Input Bias Current
Input Offset Current
MIN
CL = 10pF
G = +1
VS = +5V, G = +1
VS = 5V, 1V Step
VS = 5V, 1V Step
VIN • Gain = VS
70
0.02
65
80
5
+1.8
IO = 0
1
0
0
–65
θJA
200
150
250
mV
mV
mV
mV
mA
mA
kHz
V/µs
µs
µs
µs
+5.5
2
10
V
µA
µA
+70
+85
+150
°C
°C
°C
°C/W
°C/W
°C/W
NOTE: (1) Refer to Typical Characteristic curves.
OPA349, 2349
SBOS121B
www.ti.com
3
ELECTRICAL CHARACTERISTICS (Dual): VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +70°C.
At TA = +25°C, and RL = 1MΩ connected to VS /2, unless otherwise noted.
OPA2349
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
Over Temperature
Drift
vs Power Supply
Over Temperature
Channel Separation, dc
CONDITION
VOS
dVOS /dT
PSRR
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
Over Temperature
VCM
CMRR
VS = 1.8V to 5.5V, VCM = (V–) + 0.3V
RL = 100kΩ
f = 1kHz
10
66(1)
VS = +5V, –0.2V < VCM < 5.2V
VS = +5V, –0.2V < VCM < 3.5V
(V–) – 0.2
48
46
52
50
OPEN-LOOP GAIN
Open-Loop Voltage Gain
Over Temperature
Open-Loop Voltage Gain
Over Temperature
en
in
AOL
RL = 1MΩ, VS = +5.5V, +0.3V < VO < +5.2V
AOL
RL = 10kΩ, VS = +5.5V, +0.35V < VO < +5.15V
OUTPUT
Voltage Output Swing from Rail
Over Temperature
Over Temperature
Output Current
Short-Circuit Current
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.1%
0.01%
Overload Recovery Time
POWER SUPPLY
Specified Voltage Range
Quiescent Current (per amplifier)
Over Temperature
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
SOT23-8 Surface-Mount
SO-8 Surface-Mount
74
72
74
60
GBW
SR
tS
VS
IQ
mV
mV
µV/°C
µV/V
µV/V
µV/V
dB
1000
3000
(V+) + 0.2
V
dB
dB
dB
dB
±10
±10
pA
pA
Ω || pF
Ω || pF
8
300
4
µVp-p
nV/√Hz
fA/√Hz
90
dB
dB
dB
dB
90
RL = 10kΩ, VS = +5.5V, AOL > 74dB
200
±8
±10
mV
mV
mV
mV
mA
mA
70
0.02
65
80
5
kHz
V/µs
µs
µs
µs
+1.8
IO = 0
±10
±13
1013 || 2
1013 || 4
150
CL = 10pF
G = +1
VS = +5V, G = +1
VS = 5V, 1V Step
VS = 5V, 1V Step
VIN • Gain = VS
UNITS
72
RL = 1MΩ, VS = +5.5V, AOL > 74dB
ISC
MAX
60
±0.5
±1
IB
IOS
INPUT IMPEDANCE
Differential
Common-Mode
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 1kHz
Current Noise Density, f = 1kHz
TYP(1)
±2
±2
±15
350
VS = 5V, VCM = 2.5V
Over Temperature
INPUT BIAS CURRENT
Input Bias Current
Input Offset Current
MIN
1
–40
–40
–65
θJA
200
150
300
300
350
350
+5.5
2
10
V
µA
µA
+70
+85
+150
°C
°C
°C
°C/W
°C/W
NOTE: (1) Refer to Typical Characteristic curves.
4
OPA349, 2349
www.ti.com
SBOS121B
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, and RL = 1MΩ connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN vs TEMPERATURE
OPEN-LOOP GAIN AND PHASE vs FREQUENCY
100
100
90
0
RL = 1MΩ
90
50
90
40
30
Gain (dB)
45
Phase
60
Phase (°)
70
Gain (dB)
95
Gain
80
Single version operation
below 0°C is not recommended.
85
75
135
70
20
10
65
180
0
60
0.1
1
10
100
1k
Frequency (Hz)
10k
100k
1M
–75
–50
–25
0
25
50
75 85
Temperature (°C)
COMMON-MODE REJECTION RATIO
vs TEMPERATURE
COMMON-MODE REJECTION RATIO vs FREQUENCY
80
80
70
75
–0.2V < VCM < 3.5V
60
50
CMRR (dB)
CMRR (dB)
RL = 10kΩ
80
40
30
70
65
Single version operation
below 0°C is not recommended.
60
–0.2V < VCM < 5.2V
20
55
10
0
10
100
1k
Frequency (Hz)
10k
50
–75
100k
–50
–25
0
25
50
75 85
Temperature (°C)
POWER-SUPPLY REJECTION RATIO
vs TEMPERATURE
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
100
80
90
80
70
PSRR (dB)
PSRR (dB)
70
60
–PSRR
50
+PSRR
40
60
Single version operation
below 0°C is not recommended.
30
50
20
10
0
40
10
100
1k
Frequency (Hz)
10k
100k
–50
–25
0
25
50
75 85
Temperature (°C)
OPA349, 2349
SBOS121B
–75
www.ti.com
5
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 1MΩ connected to VS/2, unless otherwise noted.
QUIESCENT AND SHORT-CIRCUIT
vs SUPPLY VOLTAGE
QUIESCENT CURRENT vs TEMPERATURE
Quiescent Current (µA)
2.5
Quiescent Current (µA)
12
1.4
2.0
OPA2349
1.5
1.0
OPA349
1.2
ISC at 25°C
8
1.0
6
0.8
IQ
ISC at 125°C
4
2
0.4
–50
–25
0
25
50
75 85
1.5
2.0
2.5
Temperature (°C)
4.0
4.5
5.0
5.5
10k
VS = +5.5V
10
Input Bias Current (pA)
Short-Circuit Current (mA)
3.5
INPUT BIAS CURRENT vs TEMPERATURE
SHORT-CIRCUIT CURRENT vs TEMPERATURE
VS = +2.5V
5
0 VS = +1.8V
Single version operation
below 0°C is not recommended.
VS = +2.5V
–10
VS = +5.5V
–15
–55
–35
3.0
Supply Voltage (V)
15
–5
10
0.6
0.5
0.0
–75
ISC at –40°C
(dual version only)
Short-Circuit Current, ISC (mA)
3.0
1k
100
10
Single version operation
below 0°C is not recommended.
1
0.1
–15
0 5
25
45
65
85
–75
–50
–25
Temperature (°C)
0
25
75 85
50
Temperature (°C)
INPUT VOLTAGE NOISE DENSITY
CHANNEL SEPARATION vs FREQUENCY
1000
100
Channel Separation (dB)
Voltage Noise (nV/√Hz)
90
400
80
70
60
50
40
30
20
10
100
0
10
100
1k
10k
10
Frequency (Hz)
6
100
1k
Frequency (Hz)
10k
100k
OPA349, 2349
www.ti.com
SBOS121B
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 1MΩ connected to VS/2, unless otherwise noted.
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
OUTPUT VOLTAGE vs OUTPUT CURRENT
(V+)
Population
Output Voltage (V)
(V+) – 1
(V+) – 2
125°C
25°C
(V–) + 2
–40°C
(dual version
only)
(V–) + 1
(V–)
–30 –25 –20 –15 –10 –5
0
5
0
10 15 20 25 30 35 40
1
2
3
4
5
6
7
8
9
10
Output Current (mA)
Offset Voltage Drift (µV/°C)
LARGE-SIGNAL STEP RESPONSE
G = 1, RL = 1MΩ
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
6
VS = +5.5V
VS = +5V
4
1V/div
Output Voltage (Vp-p)
5
3
VS = +2.5V
2
VS = +1.8V
1
0
100
1k
10k
100µs/div
100k
Frequency (Hz)
SMALL-SIGNAL STEP RESPONSE
G = 1, RL = 1MΩ, CL = 500pF
50mV/div
50mV/div
SMALL-SIGNAL STEP RESPONSE
G = 1, RL = 1MΩ, CL = 20pF
100µs/div
40µs/div
OPA349, 2349
SBOS121B
www.ti.com
7
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 1MΩ connected to VS/2, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
(SOT23, SO-8)
100
100
90
90
80
70
60
50
G = −1V/V, RL = 1MΩ
40
30
G = +1V/V, RL = 1MΩ
20
Small-Signal Overshoot (%)
Small-Signal Overshoot (%)
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
(SC70)
G = +1V/V
70
60
50
40
30
20
10
10
0
0
10
8
G = −1V/V
80
100
Load Capacitance (pF)
10
1k
100
Load Capacitance (pF)
1k
OPA349, 2349
www.ti.com
SBOS121B
APPLICATIONS INFORMATION
The OPA349 series op amps are unity-gain stable and can
operate on a single supply, making them highly versatile and
easy to use. Power-supply pins should be bypassed with
0.01µF ceramic capacitors.
The OPA349 series op amps are fully specified and tested
from +1.8V to +5.5V. Parameters that vary significantly with
operating voltages or temperature are shown in the Typical
Characteristic curves.
The ultra-low quiescent current of the OPA349 requires
careful application circuit techniques to achieve low overall
current consumption. Figure 1 shows an ac-coupled amplifier
+1.8V to 5.5V
R3
2M
R1
10M
CF
3pF
R5
10M
CF may be required
for best stability or to
reduce frequency
peaking—see text.
G = 11
10nF
OPA349
R2
10M
VOUT
R4
2M
biased with a voltage divider. Resistor values must be very
large to minimize current. The large feedback resistor value
reacts with input capacitance and stray capacitance to produce a pole in the feedback network. A feedback capacitor
may be required to assure stability and limit overshoot or
gain peaking. Check circuit performance carefully to assure
that biasing and feedback techniques meet signal and quiescent current requirements.
RAIL-TO-RAIL INPUT
The input common-mode voltage range of the OPA349 series
extends 200mV beyond the supply rails. This is achieved with a
complementary input stage—an N-channel input differential pair
in parallel with a P-channel differential pair (as shown in Figure 2).
The N-channel pair is active for input voltages close to the positive
rail, typically (V+) – 1.3V to 200mV above the positive supply,
while the P-channel pair is on for inputs from 200mV below the
negative supply to approximately (V+) – 1.3V. There is a small
transition region, typically (V+) – 1.5V to (V+) – 1.1V, in which both
pairs are on. This 400mV transition region can vary 300mV with
process variation. Thus, the transition region (both stages on) can
range from (V+) – 1.8V to (V+) – 1.4V on the low end, up to
(V+) – 1.2V to (V+) – 0.8V on the high end. Within the 400mV
transition region PSRR, CMRR, offset voltage, offset drift, and
THD may be degraded compared to operation outside this region.
For more information on designing with rail-to-rail input op amps,
see Figure 3, Design Optimization with Rail-to-Rail Input Op
Amps.
FIGURE 1. AC-Coupled Amplifier.
V+
Reference
Current
VIN+
VIN–
VBIAS1
Class AB
Control
Circuitry
VO
VBIAS2
V–
(Ground)
FIGURE 2. Simplified Schematic.
OPA349, 2349
SBOS121B
www.ti.com
9
DESIGN OPTIMIZATION WITH RAIL-TO-RAIL INPUT OP AMPS
wide input swing is required. A design option would be to
configure the op amp as a unity-gain inverter as shown below
and hold the noninverting input at a set common-mode voltage
outside the transition region. This can be accomplished with a
voltage divider from the supply. The voltage divider should be
designed such that the biasing point for the noninverting input
is outside the transition region.
In most applications, operation is within the range of only one
differential pair. However, some applications can subject the
amplifier to a common-mode signal in the transition region.
Under this condition, the inherent mismatch between the two
differential pairs may lead to degradation of the CMRR and
THD. The unity-gain buffer configuration is the most problematic—it will traverse through the transition region if a sufficiently
R
R
VOUT
VIN
VCM
FIGURE 3. Design Optimization.
COMMON-MODE REJECTION
The CMRR for the OPA349 is specified in two ways so the best
match for a given application may be used. First, the CMRR of
the device in the common-mode range below the transition
region (VCM < (V+) – 1.5V) is given. This specification is the
best indicator of the capability of the device when the application requires use of one of the differential input pairs. Second,
the CMRR at VS = 5V over the entire common-mode range is
specified.
OUTPUT DRIVEN TO V– RAIL
Loads that connect to single-supply ground (or the V– supply
pin) can cause the OPA349 or OPA2349 to oscillate if the
output voltage is driven into the negative rail (as shown in
a)
Figure 4a). Similarly, loads that can cause current to flow out
of the output pin when the output voltage is near V– can
cause oscillations. The op amp will recover to normal operation a few microseconds after the output is driven positively
out of the rail.
Some op amp applications can produce this condition even
without a load connected to V–. The integrator in Figure 4b
shows an example of this effect. Assume that the output
ramps negatively, and saturates near 0V. Any negativegoing step at VIN will produce a positive output current pulse
through R1 and C1. This may incite the oscillation. Diode D1
prevents the input step from pulling output current when the
output is saturated at the rail, thus preventing the oscillation.
V+
b)
V+
R1
1MΩ
C1
1nF
VIN
2V
VO
OPA349
VIN
0V
D1
1N4148
OPA349
(No Load)
0V
RL
1V
0V
FIGURE 4. Output Driven to Negative Rail.
10
OPA349, 2349
www.ti.com
SBOS121B
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
HPA00215EA/3K
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
C49
OPA2349EA/250
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
C49
OPA2349EA/3K
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
C49
OPA2349UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2349UA
OPA2349UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2349UA
OPA2349UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2349UA
OPA2349UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2349UA
OPA349NA/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
A49
OPA349NA/250G4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
A49
OPA349NA/3K
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
A49
OPA349NA/3KG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
A49
OPA349SA/250
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
S49
OPA349SA/250G4
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
OPA349SA/3K
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
S49
OPA349SA/3KG4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
S49
OPA349UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
349UA
OPA349UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Addendum-Page 1
-40 to 85
-40 to 85
S49
OPA
349UA
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
15-Apr-2017
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
OPA349UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA349UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
OPA
349UA
OPA
349UA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Apr-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
OPA2349EA/250
SOT-23
DCN
8
250
180.0
B0
(mm)
K0
(mm)
P1
(mm)
8.4
3.2
3.1
1.39
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
OPA2349EA/3K
SOT-23
DCN
8
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
OPA2349UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA349SA/250
SC70
DCK
5
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
OPA349SA/3K
SC70
DCK
5
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
OPA349UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Apr-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2349EA/250
SOT-23
DCN
OPA2349EA/3K
SOT-23
DCN
8
250
210.0
185.0
35.0
8
3000
210.0
185.0
35.0
OPA2349UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA349SA/250
SC70
DCK
5
250
180.0
180.0
18.0
OPA349SA/3K
SC70
DCK
5
3000
180.0
180.0
18.0
OPA349UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
Similar pages