Diodes DMC3025LSD 30v complementary enhancement mode mosfet Datasheet

DMC3025LSD
30V COMPLEMENTARY ENHANCEMENT MODE MOSFET
ADVANCED INFORMATION
Product Summary
Device
V(BR)DSS
N-Channel
30V
P-Channel
-30V
Features
RDS(ON) max
Package
ID MAX
TA = +25°C
SO-8
8.5A
7.0A
-5.5A
-4.1A
20mΩ @ VGS = 10V
32mΩ @ VGS = 4.5V
45mΩ @ VGS = -10V
85mΩ @ VGS = -4.5V
•
•
•
•
•
•
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description
Mechanical Data
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
•
•
ideal for high-efficiency power management applications.
•
•
•
Applications
•
•
DC Motor Control
DC-AC Inverters
•
Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminals: Finish  Matte Tin Annealed Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (Approximate)
D1
D2
SO-8
S2
D2
G2
D2
S1
D1
G1
D1
G1
G2
Top View
S1
S2
Q2 N-CHANNEL MOSFET
Pin Configuration
Q1 P-CHANNEL MOSFET
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMC3025LSD-13
Notes:
Case
SO-8
Packaging
2,500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Top View
8
5
Logo
C3025LD
Part no.
YY WW
Xth week: 01 ~ 53
Year: “11” = 2011
1
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
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DMC3025LSD
Maximum Ratings N-CHANNEL– Q2 (@TA = +25°C, unless otherwise specified.)
Characteristic
ADVANCED INFORMATION
Symbol
Value
Drain-Source Voltage
VDSS
30
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 5) VGS = 4.5V
Units
Steady
State
TA = +25°C
TA = +70°C
ID
6.5
5.1
A
t<10s
TA = +25°C
TA = +70°C
ID
8.5
6.8
A
Steady
State
TA = +25°C
TA = +70°C
ID
5.3
4.1
A
t<10s
TA = +25°C
TA = +70°C
ID
7.0
5.5
A
IS
2
A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
IDM
60
A
Pulsed Body Diode Current (10µs pulse, duty cycle = 1%)
ISM
60
A
Avalanche Current (Note 7) L = 0.1mH
IAS
14
A
Avalanche Energy (Note 7) L = 0.1mH
EAS
10
mJ
Symbol
Value
Units
VDSS
-30
V
Maximum Continuous Body Diode Forward Current (Note 5)
Maximum Ratings P-CHANNEL– Q1 (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = -10V
Continuous Drain Current (Note 5) VGS = -4.5V
VGSS
±20
V
Steady
State
TA = +25°C
TA = +70°C
ID
-4.2
-3.2
A
t<10s
TA = +25°C
TA = +70°C
ID
-5.5
-4.3
A
Steady
State
TA = +25°C
TA = +70°C
ID
-3.5
-2.3
A
t<10s
TA = +25°C
TA = +70°C
ID
-4.1
-3.2
A
IS
-2
A
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
IDM
-30
A
Pulsed Body Diode Current (10µs pulse, duty cycle = 1%)
ISM
-30
A
Avalanche Current (Note 7) L = 0.1mH
IAS
-14
A
EAS
10
mJ
Value
Units
Avalanche Energy (Note 7) L = 0.1mH
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Symbol
TA = +25°C
TA = +70°C
Steady State
t<10s
TA = +25°C
TA = +70°C
Steady State
t<10s
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
Notes:
PD
RθJA
PD
1.2
0.77
104
62
1.5
0.95
RθJA
83
49
RθJC
15
TJ, TSTG
-55 to +150
W
°C/W
W
°C/W
°C
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
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DMC3025LSD
Electrical Characteristics N-CHANNEL– Q2 (@TA = +25°C, unless otherwise specified.)
ADVANCED INFORMATION
Characteristic
OFF CHARACTERISTICS (Note 8)
Symbol
Min
Typ
Max
Drain-Source Breakdown Voltage
BVDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Source Leakage
Unit
Test Condition
30
—
—
V
VGS = 0V, ID = 250µA
—
—
1
µA
VDS = 30V, VGS = 0V
IGSS
—
—
±1
µA
VGS = ±20V, VDS = 0V
VGS(th)
1.0
—
2.0
V
—
15
20
—
23
32
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
RDS (ON)
mΩ
VDS = VGS, ID = 250µA
VGS = 10V, ID = 7.4A
VGS = 4.5V, ID = 6A
Forward Transfer Admittance
|Yfs|
—
8
—
S
VDS = 5V, ID = 10A
Diode Forward Voltage
VSD
—
0.70
1.2
V
VGS = 0V, IS = 1A
pF
VDS = 15V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = 15V, ID = 10A
ns
VDD = 15V, VGS = 10V,
RG = 6Ω, ID = 1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Ciss
—
501
—
Output Capacitance
Coss
—
72
—
Reverse Transfer Capacitance
Crss
—
57
—
Gate Resistance
Rg
—
1.84
—
Total Gate Charge (VGS = 4.5V)
Qg
—
4.6
—
Total Gate Charge (VGS = 10V)
Qg
—
9.8
—
Gate-Source Charge
Qgs
—
1.6
—
Gate-Drain Charge
Qgd
—
2.0
—
Turn-On Delay Time
tD(on)
—
3.9
—
Turn-On Rise Time
tr
—
4.2
—
Turn-Off Delay Time
tD(off)
—
16.6
—
Turn-Off Fall Time
tf
—
5.8
—
Reverse Recovery Time
trr
—
5.5
—
ns
Reverse Recovery Charge
Qrr
—
2.6
—
nC
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Document number: DS35717 Rev. 7 - 2
IF = 12A, di/dt = 500A/µs
February 2015
© Diodes Incorporated
DMC3025LSD
Electrical Characteristics P-CHANNEL – Q1 (@TA = +25°C, unless otherwise specified.)
Symbol
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
BVDSS
IDSS
IGSS
-30
—
—
—
—
—
—
-1
±100
V
µA
nA
VGS = 0V, ID = -250µA
VDS = -30V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
RDS (ON)
-2.0
45
85
—
-1.2
V
Static Drain-Source On-Resistance
—
38
65
5
-0.7
VDS = VGS, ID = -250µA
VGS = -10V, ID = -5.2A
VGS = -4.5V, ID = -4A
VDS = -5V, ID = -5.2A
VGS = 0V, IS = -1A
ADVANCED INFORMATION
Characteristic
OFF CHARACTERISTICS (Note 8)
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
|Yfs|
VSD
-1.0
—
—
—
—
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Ciss
Coss
Crss
Rg
—
—
—
—
590
69
53
11
—
—
—
—
pF
pF
pF
Ω
Total Gate Charge (VGS = 4.5V)
Qg
—
5.1
—
nC
Total Gate Charge (VGS = 10V)
Qg
—
10.5
—
nC
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Qgs
Qgd
—
—
—
—
—
—
—
—
1.8
1.9
6.8
4.9
28.4
12.4
14
11
—
—
—
—
—
—
—
—
nC
nC
ns
ns
ns
ns
ns
nC
Notes:
tD(on)
tr
tD(off)
tf
trr
Qrr
mΩ
S
V
Test Condition
VDS = -25V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
VDS = -15V, ID = -6A
VDD = -15V, VGS = -10V,
RG = 6Ω, ID = -1A
IF = 12A, di/dt = 500A/µs
7. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
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DMC3025LSD
30
25
25
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
30
20
15
10
VDS = 5.0V
20
15
10
TA = 150°C
T A = 125°C
5
5
TA = 85°C
TA = 25°C
0
0.5
1.0
1.5
2.0
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
3.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.030
0.025
VGS = 4.5V
0.020
0.015
VGS = 10V
0.010
0.005
0
0
5
10
15
ID, DRAIN-SOURCE CURRENT (A)
Figure. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0
T A = -55°C
0
1
2
3
4
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristics
5
0.10
0.08
0.06
0.04
ID = 10A
0.02
20
0
3
4
5
6
7
8
9
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical On-Resistance vs.
Drain Current and Gate Voltage
10
1.6
0.08
VGS = 4.5V
0.07
0.06
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ADVANCED INFORMATION
N-CHANNEL
TA = 150°C
0.05
TA = 125°C
0.04
TA = 85°C
0.03
TA = 25°C
TA = -55°C
0.02
1.4
1.2
VGS = 10 V
ID = 10A
VGS = 4.5V
ID = 5A
1.0
0.8
0.01
0
0
5
10
15
20
25
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs.
Drain Current and Temperature
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
30
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0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6. On-Resistance Variation with Temperature
February 2015
© Diodes Incorporated
2.0
VGS(th), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.040
0.035
VGS = 4.5V
ID = 5A
0.030
0.025
0.020
0.015
VGS = 10 V
ID = 10A
0.010
0.005
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. On-Resistance Variation with Temperature
ID = 1mA
1.6
1.4
ID = 250µA
1.2
1.0
0.8
0.6
0.4
0.2
0
-50
-25
0
25
50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
CT, JUNCTION CAPACITANCE (pF)
25
IS, SOURCE CURRENT (A)
1.8
10,000
30
TA = 25°C
20
15
10
5
1,000
Ciss
100
Coss
Crss
f = 1MHz
0
0
10
0.2
0.4
0.6
0.8
1.0
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
5
10
15
20
25
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
30
100
RDS(on)
Limited
VGS GATE THRESHOLD VOLTAGE (V)
VDS = 15V
ID = 10A
ID, DRAIN CURRENT (A)
ADVANCED INFORMATION
DMC3025LSD
PW = 10µs
10
DC
1
PW = 10s
PW = 1s
PW = 100ms
0.1 T
J(max) = 150°C
TA = 25°C
Single Pulse
0
2
4
6
8
10
Qg, TOTAL GATE CHARGE (nC)
Figure 11. Gate Charge
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
12
0.01
0.1
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PW = 10ms
PW = 1ms
PW = 100µs
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
100
February 2015
© Diodes Incorporated
DMC3025LSD
P-CHANNEL
20
VGS = -10V
20
VGS = -5.0V
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
15
VGS = -4.5V
VGS = -4.0V
10
VGS = -3.5V
5
15
10
5
TA = 150°C
VGS = -3.0V
TA = 125°C
VGS = -2.5V
0
0.5
1.0
1.5
2.0
2.5
-VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 13. Typical Output Characteristics
0
3.0
RDS(ON),DRAIN-SOURCE ON-RESISTANCE (Ω)
0.12
0.10
0.08
0.06
0.04
0.02
0
0
4
8
12
16
-ID, DRAIN SOURCE CURRENT (A)
Figure 15. Typical On-Resistance vs.
Drain Current and Gate Voltage
TA = -55°C
0
1
2
3
4
-VGS, GATE-SOURCE VOLTAGE (V)
Figure 14. Typical Transfer Characteristics
5
0.08
0.06
0.04
0.02
20
0.10
0
3
4
5
6
7
8
9
-VGS, GATE SOURCE VOLTAGE (V)
Figure 16. Typical On-Resistance vs.
Drain Current and Gate Voltage
10
1.7
VGS = -4.5V
0.08
0.06
TA = 150 °C
TA = 125 °C
0.04
TA = 85°C
TA = 25°C
TA = -55°C
0.02
0
TA = 85°C
TA = 25°C
0.10
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RDS(ON),DRAIN-SOURCE ON-RESISTANCE (Ω)
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE(Ω)
ADVANCED INFORMATION
VDS = -5.0V
0
5
10
15
-ID, DRAIN SOURCE CURRENT (A)
Figure 17. Typical On-Resistance vs.
Drain Current and Temperature
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
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1.5
1.3
1.1
0.9
0.7
0.5
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 18. On-Resistance Variation with Temperature
February 2015
© Diodes Incorporated
2.0
VGS(TH), GATE THRESHOLD VOLTAGE(V)
RDS(on), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.10
0.08
VGS = -4.5V
ID = -5A
0.06
0.04
VGS = -10V
ID = -10A
0.02
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. On-Resistance Variation with Temperature
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 20. Gate Threshold Variation vs. Ambient Temperature
10,000
20
CT, JUNCTION CAPACITANCE (pF)
f = 1MHz
-IS, SOURCE CURRENT (A)
16
12
8
4
0
0.4
1,000
Ciss
Coss
100
Crss
10
0.6
0.8
1.0
1.2
1.4
-VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 21. Diode Forward Voltage vs. Current
0
5
10
15
20
25
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 22. Typical Junction Capacitance
30
100
10
RDS(on)
Limited
PW = 10µs
8
-ID, DRAIN CURRENT (A)
-VGS, GATE-SOURCE VOLTAGE (V)
ADVANCED INFORMATION
DMC3025LSD
6
4
2
0
10
DC
1
PW = 10s
PW = 1s
PW = 100ms
PW = 10ms
0.1 T
J(max) = 150°C
TA = +25°C
Single Pulse
0
2
4
6
8
10
Qg, TOTAL GATE CHARGE (nC)
Figure 23. Gate-Charge Characteristics
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
12
0.01
0.1
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PW = 1ms
PW = 100µs
1
10
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 24. SOA, Safe Operation Area
100
February 2015
© Diodes Incorporated
DMC3025LSD
r(t), TRANSIENT THERMAL RESISTANCE
D = 0.7
D = 0.5
D = 0.3
D = 0.9
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
Rthja (t) = r(t) * Rthja
D = 0.005
Rthja = 83C/W
Duty Cycle, D = t1/ t2
D = Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIMES (sec)
Figure 25 Transient Thermal Resistance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
0.254
ADVANCED INFORMATION
1
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0°
8°
θ
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
SO-8
X
Dimensions
X
Y
C1
C2
C1
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
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DMC3025LSD
IMPORTANT NOTICE
ADVANCED INFORMATION
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
10 of 10
www.diodes.com
February 2015
© Diodes Incorporated
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