MN103SD3 Series MN103SD3P MN103SFD3R Mask ROM FLASH ROM (byte) 640K 1024K RAM (byte) 40K 64K Type Internal ROM type LQFP100-P-1414 Package (Lead-free) Minimum Instruction Execution Time 16.7 ns (at 2.7 V to 3.6 V, 60 MHz) Interrupts RESET. IRQ × 8. NMI. Timer × 32. I2C × 3. SIF × 16. DMA × 12. WDT. A/D. Time base timer × 2. System error. Key input. Remote control × 4 Timer Counter 8-bit timer A × 10 Reload-down count. Cascade connection possible (usable as a 16-bit to 32-bit timer) 8-bit timer B × 3 Interval timer. Event count. Square-wave output. Simple pulse width measurement. PWM output 16-bit timer × 6 Up-down count. Input capture. PWM output. Compare/capture register 2 channnels Time base timer × 1 Watchdog timer × 1 Serial interface UART/Synchronous/Multi-master I2C interface selective × 3 UART/Synchronous interface selective × 5 Remote Contorol Interface Remote control reception: Correspondence with AEHA (Association for Electric Home Appliances) format. Queued reception by low speed clock DMA controller Number of channels: 4 channels Unit of transfer: 8/16/32 bits Maximum transfer cycles: 65535 Starting factor: External interrupt. Timer. Serial transmission/reception. A/D conversion finish. I2C transmission/reception. Software. Remote control data reception Transfer method: 2-bus cycle transfer Adressing modes: Fixed. Increment. Decrement Transfer mode: Word transfer. Burst transfer. Intermittent transfer I/O Pins I/O Input 81 : Common use 1 : Common use A/D converter 10-bit × 8 channels ROM Correction 8 channels Electrical Charactreistics (A/D converter characteristics) Parameter Symbol Condition Resolution Non-linear error Differential non-linearity error VDD33 = VREFH = 3.3 V. VSS = 0 V min Limit typ max 10 Unit Bits ±4 LSB ±4 LSB MAF00027FEM MN103SD3P, MN103SFD3R Pin Assignment 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 VDD18 P42, SBT4, SCL4, IRQ7, NMIRQ P41, SBO4, SDA4, IRQ6 P40, SBI4, TM13IOB, D15 P87, TM13IOA, D14 P86, TM12IOB, D13 P85, TM12IOA, D12 P84, TM11IOB, D11 P83, TM11IOA, D10 P82, TM10IOB, D9 P81, TM10IOA, D8 P80 VSS P77 VDD33 P75, D7 P74, D6 P73, D5 P72, D4 P71, D3 P70, D2 P67, KEY7, D1 P66, KEY6, D0 P65, KEY5, A0 P64, KEY4, A1 LQFP100-P-1414 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 P00, SBO0A, NWE0 P01, SBI0A, NWE1 P02, SBT0A, NRE P03, SBO2A, SDA2A, SBT5A P04, SBI2A, SBI5A P05, SBT2A, SCL2A, SBO5A P06, IRQ5B, TM20IOB P10, TM4IO, (OCD_SDA) P11, TM5IO, (OCD_SCL) P12, TM6IO, SYSCLK, TM22IOB MMOD OSCO OSCI VSS XI, P07 XO VDD33 VDD18 NRST LON P14, SBT1B, TM14IOA, SBT6A P15, SBO1B, TM14IOB, SBI6A P16, SBI1B, TM7IO, SBO6A OCDMOD P20, IRQ0A, DK, (VPP) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 P90, SBO0B P91, SBI0B, SBO5C P92, SBT0B P93, SBO3B, SDA3B P94, SBI3B, SBO6C P95, SBT3B, SCL3B, SBO7C PD0, SBO2B, SDA2B PD1, SBI2B PD2, SBT2B, SCL2B PD3, IRQ0B PD4, IRQ1B PD5, IRQ2B PD6, IRQ3B, TM15IOA VDD33 PD7, IRQ4B, TM15IOB VSS PA0, AN0, SBO7A PA1, AN1, SBI7A PA2, AN2, SBT7A PA3, AN3, TM22IOA PA4, AN4, TM21BKA PA5, AN5, TM21GCPA PA6, AN6, TM21IOA PA7, AN7, TM20IOA VREFH MAF00027FEM 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P63, KEY3, A2 P62, KEY2, A3 P61, KEY1, A4 P60, KEY0, A5 P57, KEY15, A6 P56, KEY14, A7 P55, KEY13, A8 P54, KEY12, A9 P53, KEY11, A10 P52, KEY10, A11 P51, KEY9, A12 VSS P50, KEY8, A13 VDD18 P35, SBT3A, SCL3A, A14 P34, SBI3A, A15 P33, SBO3A, SDA3A, A16 P32, SBT1A, A17 P31, SBI1A, A18 P30, SBO1A, A19 P25, IRQ5A, A20 P24, IRQ4A, NSC3 P23, IRQ3A, NSC2 P22, IRQ2A, NSC1 P21, IRQ1A, RMIN, NSC0 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805