Superworld L3-1R0K-10 Chip inductor Datasheet

P1
Chip Inductors – L3 Series
1. Part No. Expression:
L 3 – 4 7 N K - □□
(a)
(b)
(c) (d)
(a) Series Code
(c) Tolerance Code
(b) Inductance Code
(f) 10: Standard Code
2. Configuration & Dimensions :
Unit: mm
A
B
2.00 ± 0.20
1.25 ± 0.20
C
See Table
Below
D
G
H
L
0.50 ± 0.30
1.00 Ref.
1.45 Ref.
3.10 Ref.
3. Schematic
4. Material List
NOTE: Specifications subject to change without notice. Please check our website for latest information.
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P2
Chip Inductors – L3 Series
5. General Specification
a) Operating Temperature: - 40°C to +105°C (including self-temperature rise)
b) Storage Condition (component in its packaging)
i)
Temperature: Less than 40°C
ii) Humidity: 60% RH
6. Electrical Characteristics
Inductance (uH)
Dimension C
Test
Part No.
(mm)
Q
Tolerance
Frequency
Min.
Test
Frequency
(MHz)
(Hz)
Rated
Current
(mA) Max.
DCR
(Ω)
Max.
SRF
(MHz)
Min.
L3-47N□-10
0.85±0.20
0.047
60mV / 50M
15
50
300
0.20
320
L3-68N□-10
0.85±0.20
0.068
60mV / 50M
15
50
300
0.20
280
L3-82N□-10
0.85±0.20
0.082
60mV / 50M
15
50
300
0.20
255
L3-R10□-10
0.85±0.20
0.10
60mV / 25M
20
25
250
0.30
235
L3-R12□-10
0.85±0.20
0.12
60mV / 25M
20
25
250
0.30
220
L3-R15□-10
0.85±0.20
0.15
60mV / 25M
20
25
250
0.40
200
L3-R18□-10
0.85±0.20
0.18
60mV / 25M
20
25
250
0.40
185
L3-R22□-10
0.85±0.20
0.22
60mV / 25M
20
25
250
0.50
170
L3-R27□-10
0.85±0.20
0.27
60mV / 25M
20
25
250
0.50
150
L3-R33□-10
0.85±0.20
0.33
60mV / 25M
20
25
250
0.55
145
L3-R39□-10
0.85±0.20
0.39
60mV / 25M
25
25
200
0.65
135
L3-R47□-10
1.25±0.20
0.47
60mV / 25M
25
25
200
0.65
125
L3-R56□-10
1.25±0.20
0.56
60mV / 25M
25
25
150
0.75
115
L3-R68□-10
1.25±0.20
0.68
60mV / 25M
25
25
150
0.80
105
L3-1R0□-10
0.85±0.20
1.0
60mV / 10M
45
10
50
0.40
75
L3-1R5□-10
0.85±0.20
1.5
60mV / 10M
45
10
50
0.50
60
L3-1R8□-10
0.85±0.20
1.8
60mV / 10M
45
10
50
0.60
55
L3-2R2□-10
0.85±0.20
2.2
60mV / 10M
45
10
30
0.65
50
L3-2R7□-10
1.25±0.20
2.7
60mV / 10M
45
10
30
0.75
45
L3-3R3□-10
1.25±0.20
3.3
60mV / 10M
45
10
30
0.80
41
L3-4R7□-10
1.25±0.20
4.7
60mV / 10M
45
10
30
1.00
35
L3-100□-10
1.25±0.20
10.0
60mV / 2M
45
2
15
1.15
24
Note: □ Tolerance: K=±10%, L=±15%, M=±20%
NOTE: Specifications subject to change without notice. Please check our website for latest information.
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Chip Inductors – L3 Series
P3
7. Characteristics Curves
L vs IDC
Q vs Freq.
NOTE: Specifications subject to change without notice. Please check our website for latest information.
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P4
Chip Inductors – L3 Series
8. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note:
If wave soldering is used, there will be some risk.
Re-flow soldering temperatures below 240°C, there will be non-wetting risk
8-1 Solder Re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
8-2 Soldering Iron (Figure 2):
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In
the event that a soldering iron must be employed the following precautions are recommended.
Note:
a) Preheat circuit and products to 150°C.
b) 350°C tip temperature (Max.)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (Max.)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4~5 secs.
8-3 Soldering Volume:
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding
solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to
be exceeding as shown in the Figure 3. Minimum fillet height = soldering thickness + 25% product height.
NOTE: Specifications subject to change without notice. Please check our website for latest information.
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P5
Chip Inductors – L3 Series
9. Packaging Information
9-1 Reel Dimension
Type
A (mm)
B (mm)
C (mm)
D (mm)
7” x 8mm
9.0 ± 0.5
60.0 ± 2.0
13.5 ± 0.5
178.0± 2.0
9-2 Tape Dimension
Material of taping is paper
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
201209
2.10±0.05
1.30±0.05
0.95±0.05
4.0±0.10
0.95±0.05
NOTE: Specifications subject to change without notice. Please check our website for latest information.
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P6
Chip Inductors – L3 Series
Material of taping is plastic
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
201212
2.10±0.10
1.28±0.10
1.28±0.10
4.0±0.10
0.22±0.05
1.0±0.10
9-3. Packaging Quantity
Size
201209
201212
Chip/ Reel
4000
2000
Inner Box
20000
10000
Middle Box
100000
50000
Carton
200000
100000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams in the arrow
direction under the following conditions.
Room Temp
(°C)
Room
Humidity (%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5 - 35
45 - 85
860 - 1060
300
NOTE: Specifications subject to change without notice. Please check our website for latest information.
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P7
Chip Inductors – L3 Series
Application Notice:
1. Storage Conditions:
To maintain the solderabililty of terminal electrodes:
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation:
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) Vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE: Specifications subject to change without notice. Please check our website for latest information.
Proprietary and Confidential
Document of Superworld
14/08/2017
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