IRF IRFH7184PBF Optimized for secondary side synchronous rectification Datasheet

FastIRFET™
IRFH7184PbF
HEXFET® Power MOSFET
VDSS
100
V
4.8
m
36
nC
Rg (typical)
1.2

ID
(@TC (Bottom) = 25°C)
128
A
RDS(on) max
(@ VGS = 10V)
Qg (typical)
PQFN 5X6 mm
Applications
 Optimized for Secondary Side Synchronous Rectification
 Primary Switch for High Frequency 48V/60V Telecom DC-DC Power Supplies
 Hot Swap and Active O-Ring
 BLDC Motor Drive
Features
Low RDS(ON) (< 4.8m)
Internal Snubber
Low Thermal Resistance to PCB (<0.8°C/W)
100% Rg Tested
Low Profile (<1.05 mm)
Industry-Standard Pinout
Compatible with Existing Surface Mount Techniques
RoHS Compliant, Halogen-Free
MSL1
Base part number
Package Type
IRFH7184PbF
PQFN 5mm x 6 mm
Benefits
Lower Conduction Losses
Reduced Vds Spike, Improved EMI
Increased Power Density
Increased Reliability
results in Increased Power Density
Multi-Vendor Compatibility

Easier Manufacturing
Environmentally Friendlier
Increased Reliability
Standard Pack
Form
Quantity
Tape and Reel
4000
Orderable Part Number
IRFH7184TRPbF
Absolute Maximum Ratings
Parameter
VGS
Gate-to-Source Voltage
Max.
Units
± 20
V
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V
20
ID @ TC(Bottom) = 25°C
Continuous Drain Current, VGS @ 10V
128
ID @ TC(Bottom) = 100°C
Continuous Drain Current, VGS @ 10V
81
IDM
Pulsed Drain Current 
260
PD @TA = 25°C
Power Dissipation
3.9
PD @TC(Bottom) = 25°C
Power Dissipation
156
Linear Derating Factor
0.03
W/°C
TJ
Operating Junction and
-55 to + 150
°C
TSTG
Storage Temperature Range
A
W
Notes  through  are on page 8
1
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IRFH7184PbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter
BVDSS
Drain-to-Source Breakdown Voltage
BVDSS/TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
VGS(th)
IDSS
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
gfs
Forward Transconductance
Qg
Total Gate Charge
Qgs1
Pre-Vth Gate-to-Source Charge
Qgs2
Post-Vth Gate-to-Source Charge
Qgd
Gate-to-Drain Charge
Qgodr
Gate Charge Overdrive
Qsw
Switch Charge (Qgs2 + Qgd)
Qoss
Output Charge
RG
Gate Resistance
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
tf
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Diode Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) 
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Min.
100
–––
–––
2.0
–––
–––
–––
–––
117
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
54
4.0
–––
-5.4
–––
–––
–––
–––
36
7.3
2.7
11
15
13.7
120
1.2
6.5
9.9
14
3.9
2320
1070
19
Max.
–––
–––
4.8
3.6
–––
1.0
100
-100
–––
54
–––
–––
–––
–––
–––
–––
2.2
–––
–––
–––
–––
–––
–––
–––
Units
V
mV/°C
m
V
mV/°C
µA
Min.
–––
Typ.
–––
Max.
128
Units
–––
–––
260
nA
S
nC
nC

Conditions
VGS = 0V, ID = 250µA
Reference to 25°C, ID = 1mA
VGS = 10V, ID = 50A 
VDS = VGS, ID = 150µA
VDS = 80V, VGS = 0V
VGS = 20V
VGS = -20V
VDS = 25V, ID = 50A
VDS = 50V
VGS = 10V
ID = 50A
VDS = 50V, VGS = 0V
ns
VDD = 50V, VGS = 10V
ID = 50A
RG = 1.0
pF
VGS = 0V
VDS = 50V
ƒ = 1.0MHz
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
TJ = 25°C, IS= 50A, VGS=0V 
TJ = 25°C, IF = 50A, VDD = 50V
di/dt = 100A/µs 
D
A
G
S
–––
–––
–––
0.8
55
76
1.3
83
114
V
ns
nC
Avalanche Characteristics
Parameter
EAS (Thermally limited) Single Pulse Avalanche Energy 
Avalanche Current 
IAR
Typ.
–––
Max.
360
Units
mJ
–––
50
A
Typ.
–––
Max.
0.8
Units
–––
21
°C/W
Thermal Resistance
Parameter
RJC (Bottom) Junction-to-Case 
Junction-to-Case 
RJC (Top)
RJA
Junction-to-Ambient 
–––
32
RJA (<10s)
Junction-to-Ambient 
–––
19
2
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IRFH7184PbF
1000
1000
100
BOTTOM
100
4.5V
10
BOTTOM
4.5V
10
 60µs PULSE WIDTH
 60µs PULSE WIDTH
Tj = 150°C
Tj = 25°C
1
1
0.1
1
10
100
0.1
1000
1
Fig 1. Typical Output Characteristics
1000
2.0
100
TJ = 150°C
TJ = 25°C
10
1
V DS = 50V
 60µs PULSE WIDTH
RDS(on) , Drain-to-Source On Resistance
(Normalized)
ID, Drain-to-Source Current (A)
100
Fig 2. Typical Output Characteristics
1000
0.1
ID = 50A
V GS = 10V
1.8
1.6
1.4
1.2
1.0
0.8
0.6
1.5
2.5
3.5
4.5
5.5
-60 -40 -20 0
20 40 60 80 100 120 140 160
V GS, Gate-to-Source Voltage (V)
TJ , Junction Temperature (°C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance vs. Temperature
100000
14.0
VGS = 0V,
f = 1 MHZ
C iss = C gs + Cgd, C ds SHORTED
ID= 50A
V GS, Gate-to-Source Voltage (V)
C rss = C gd
C oss = C ds + Cgd
10000
C, Capacitance (pF)
10
V DS, Drain-to-Source Voltage (V)
V DS, Drain-to-Source Voltage (V)
Coss
Ciss
1000
Crss
100
12.0
V DS= 80V
V DS= 50V
10.0
V DS= 20V
8.0
6.0
4.0
2.0
0.0
10
1
10
100
V DS, Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
3
VGS
15V
10V
7.0V
6.5V
6.0V
5.5V
5.0V
4.5V
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
VGS
15V
10V
7.0V
6.5V
6.0V
5.5V
5.0V
4.5V
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0
5
10
15
20
25
30
35
40
45
QG, Total Gate Charge (nC)
Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
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IRFH7184PbF
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
1000
TJ = 150°C
100
TJ = 25°C
10
1msec
OPERATION IN
THIS AREA
LIMITED BY RDS(on)
10
1
0.1
V GS = 0V
1.0
100µsec
100
10msec
DC
Tc = 25°C
Tj = 150°C
Single Pulse
0.01
0.2
0.4
0.6
0.8
1.0
1.2
0.1
1
V SD, Source-to-Drain Voltage (V)
100
VDS, Drain-to-Source Voltage (V)
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
140
4.5
V GS(th) , Gate threshold Voltage (V)
120
ID, Drain Current (A)
10
100
80
60
40
20
0
4.0
3.5
3.0
2.5
ID = 150µA
ID = 250µA
2.0
ID = 1.0mA
ID = 1.0A
1.5
25
50
75
100
125
150
-75 -50 -25
TC , Case Temperature (°C)
0
25
50
75 100 125 150
TJ , Temperature ( °C )
Fig 9. Maximum Drain Current vs. Case Temperature
Fig 10. Threshold Voltage vs. Temperature
1
Thermal Response ( Z thJC ) °C/W
D = 0.50
0.20
0.10
0.1
0.05
0.01
0.001
0.0001
1E-006
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRFH7184PbF
Avalanche Current (A)
1000
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming Tj = 125°C and
Tstart =25°C (Single Pulse)
100
10
1
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming j = 25°C and
Tstart = 125°C.
0.1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
tav (sec)
1500
12
EAS , Single Pulse Avalanche Energy (mJ)
RDS(on), Drain-to -Source On Resistance (m )
Fig 12. Typical Avalanche Current vs. Pulse Width
ID = 50A
1250
10
1000
T J = 125°C
8
6
4
T J = 25°C
750
500
250
0
2
4
6
8
10
12
14
16
18
20
VGS, Gate -to -Source Voltage (V)
Fig 13. On–Resistance vs. Gate Voltage
5
ID
TOP
13A
21A
BOTTOM 50A
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25
50
75
100
125
150
Starting T J , Junction Temperature (°C)
Fig 14. Maximum Avalanche Energy vs. Drain Current
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IRFH7184PbF
Fig 15. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
V(BR)DSS
tp
15V
L
VDS
DRIVER
D.U.T
RG
IAS
20V
tp
+
V
- DD
A
I AS
0.01
Fig 16a. Unclamped Inductive Test Circuit
Fig 16b. Unclamped Inductive Waveforms
Fig 17b. Switching Time Waveforms
Fig 17a. Switching Time Test Circuit
Id
Vds
Vgs
VDD
Vgs(th)
Qgs1 Qgs2
Fig 18. Gate Charge Test Circuit
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Qgd
Qgodr
Fig 19. Gate Charge Waveform
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IRFH7184PbF
PQFN 5x6 Outline "B" Package Details
For more information on board mounting, including footprint and stencil recommendation, please refer to application note
AN-1136: http://www.irf.com/technical-info/appnotes/an-1136.pdf
For more information on package inspection techniques, please refer to application note AN-1154:
http://www.irf.com/technical-info/appnotes/an-1154.pdf
PQFN 5x6 Outline "B" Part Marking
INTERNATIONAL
RECTIFIER LOGO
DATE CODE
ASSEMBLY
SITE CODE
(Per SCOP 200-002)
PIN 1
IDENTIFIER
XXXX
XYWWX
XXXXX
PART NUMBER
(“4 or 5 digits”)
MARKING CODE
(Per Marking Spec)
LOT CODE
(Eng Mode - Min last 4 digits of EATI#)
(Prod Mode - 4 digits of SPN code)
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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IRFH7184PbF
PQFN 5x6 Outline "B" Tape and Reel
REEL DIMENSIONS
TAPE DIMENSIONS
CODE
Ao
Bo
Ko
W
P1
DESCRIPTION
Dimension design to accommodate the component width
Dimension design to accommodate the component lenght
Dimension design to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Note: All dimension are nominal
Package
Type
Reel
Diameter
(Inch)
QTY
Reel
Width
W1
(mm)
Ao
(mm)
Bo
(mm)
Ko
(mm)
P1
(mm)
W
(mm)
Pin 1
Quadrant
5 X 6 PQFN
13
4000
12.4
6.300
5.300
1.20
8.00
12
Q1
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
Qualifiction Information†
Industrial
(per JEDEC JESD47F†† guidelines)
Qualification Level
Moisture Sensitivity Level
PQFN 5mm x 6mm
MSL1
(per JEDEC J-STD-020D††)
Yes
RoHS Compliant
† Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
†† Applicable version of JEDEC standard at the time of product release.
Notes:
 Repetitive rating; pulse width limited by max. junction temperature.
 Starting TJ = 25°C, L = 290µH, RG = 50, IAS = 50A.
 Pulse width  400µs; duty cycle  2%.
 R is measured at TJ of approximately 90°C.
 When mounted on 1 inch square PCB (FR-4). Please refer to AN-994 for more details:
http://www.irf.com/technical-info/appnotes/an-994.pdf
Revision History
Date
01/06/2015 
Comments
FIg 8 SOA Curve is corrected — The label PW = 1msec and 10msec are switched—page 4.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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January 06, 2015
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