Hamamatsu C12200-461 X-ray tdi camera Datasheet

MEASUREMENT EXAMPLES
Void inspection of BGAs
X-ray TDI camera
Line sensor reduced
X-ray irradiation area
X-ray TDI Camera
C12200 Series
High speed readout
Large field of view
High Resolution
High Sensitivity
X-ray light
source
X-ray TDI camera can inspect the samples easily by high
speed scan with narrow irradiate area.
S/N ratio is one of advantage and low X-ray radiation is
enough to inspect the void existence.
Furthermore it contribute to make a smaller size of system
by reducing a lot of X-ray irradiation.
X-ray TDI camera can reduce the X-ray irradiation
on the sample dramatically by high speed with
narrow irradiation area. So it can reduce the risks
to break down the ICs on the PC.
C12200-321 (Approx. 5 kg)
160±0.5
10.6
239±0.5
250±0.5
293.472 *
(Sensor range)
10.7
(38.264±0.5)
High speed readout
(Approx. 2 kg)
42.4±0.5
(Sensor position)
50±0.5
6−φ4.5
66
32.5
147
270±0.5
302.2
Evolutional high speed scanning with
TDI technology
15.1±0.3
228±0.5
5.5
112±0.5
50±0.5
4-φ4.5
160±0.5
11±0.5
25±0.5
64
6(Sensor range)
123
134±0.5
11±0.5
370±0.5
30
32.9
A8206-35 (Option)
50.05±0.5 (Sensor position)
C12200-461 (Approx. 7 kg)
360±0.5
300
221.184 * (Sensor range)
5.5±0.3
DIMENSIONAL OUTLINES (Unit: mm)
36.8
293
6144
m/min.
mm
pixels
X-ray TDI camera C12200 Series is useful for in-line
applications requiring high-speed operation with high
sensitivity. TDI imaging is appropriate for applications where
it is desired to record a linear movement, or where the aspect
ratio of the subject being imaged is significantly asymmetric.
Low brightness under high resolution usage, a problem with
conventional line sensor cameras, is improved with this X-ray
TDI camera, making it suitable for applications which require
high resolution.
OPTIONS
Power supply unit : A8206-35
Power cable: A10847-05 (5 m)
Software API Support (Microsoft Windows): DCAM-API (http://www.dcamapi.com)
★ Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.
●
Horizontal spatial
resolution
16.1 2-M4 D=6
* Sensor length is a theoretical value and does not include the dead space between CCDs. In case of overlapped type, the overlapped pixels are defined as 10 pixels.
●
Detection area
Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications and external appearance are subject to change without notice.
Printed circuit board (PCB) inspection
Surface-mounted component inspection
© 2014 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K.
Battery inspection
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Systems Division
812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected]
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater. N.J. 08807-0910, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected]
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658 E-mail: [email protected]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected]
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 SE-164 40 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected]
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-93581733, Fax: (39)02-93581741 E-mail: [email protected]
China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected]
Cat. No. SFAS0026E07
JAN/2014 HPK
Created in Japan
High-resolution in-line non-destructive inspection
TDI technology
Time Delay Integration is a technology of scanning in
which a frame transfer device produces a continuous
video image of a moving object by means of a stack
of linear arrays aligned with and synchronized to the
motion of the object to be imaged in such a way that,
as the image moves from one line to the next, the
integrated charge moves along with it, providing
higher resolution at lower light levels than is possible
with a line-scan camera.
Shield box
X-ray source
Object motion
Object
X-ray TDI Camera
Conveyor belt
TDI sensor
Signal intensity
Features
High S/N ratio with 12 bit (-321) / 16 bit (-461) output
Camera Link interface (Base configuration)
Single power supply (+15 V) operation
Real time dark current / shading correction function
Frame readout mode for easy installation alignment
High-resolution, High-speed Camera with a Wide Field of View for In-line 100 % X-ray Inspection
High speed readout
Large field of view
High Resolution
High Sensitivity
TDI technology offers all four simultaneously.
High resolution
image acquisition
X-ray Source
MEASUREMENT EXAMPLES
Inspection of a solder's back fillet
Resolution chart (2× magnification)
Soldering failure
Normal soldering
Line scan
Line scan
Profile
Large field of view
Object
< 16 Line Pair / mm
= 31 mm resolution
* When the focal size of the X-ray
source is large, this value gets worse.
X-ray
TDI Camera
*C12200-321 measurement image
High speed readout
If the back fillet of the solder on a PCB has a defect, a
connection error will occur even with small vibrations. For
observation of the back fillet part, X-ray transmission
technique has been applied but only with an off-line system.
Our X-ray TDI camera realizes in-line inspection because it
can acquire high speed profile data with high sensitivity. 3D
brightness level can be displayed using software.
3D display
SPECIFICATIONS
Type number
CCD pixel number
Active CCD pixel number
CCD pixel size
X-ray sensitive area
Window
Recommended use range
CCD pixel clock
1×1
TDI line rate
C12200-461
6144 (H) × 128 (V)
6144 (H) × 110 (V) *1
C12200-321
4608 (H) × 128 (V)
4608 (H) × 110 (V)
48 μm × 48 μm
221 mm(H) × 6 mm(V)
293 mm(H) × 6 mm(V)
FOS (Fiber optic plate with scintillator)
Approx. 25 kV to 90 kV *2
5.0 MHz
Max. 8.0 kHz (23.04 m/min)
Max. 6.4 kHz (36.86 m/min)
12 bit
16 bit
12 bit
16 bit
Base Configuration
40 MHz
50 MHz
0 dB to 14 dB (64 steps)
DC +15 V (±1 V)
40 VA
45 VA
binning 2 × 2
A/D converter
Data output
Interface (Camera Link)
Pixel clock (Camera Link)
A/D gain value
Power requirements
Power consumption
Defect point
Lithium-ion battery inspection
*1 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary.
*2 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance.
Dead space between chips
In case of 2D sensor, the dimensional measurement cannot
be implemented correctly because the image is distorted
on the corner areas of the X-ray irradiation. The long length
sample needs to be located on center of X-ray source, so
the sample has to be relocated each time. X-ray TDI
camera can capture the image with no distortion by line
scan method, so it is not necessary to relocate the
samples and it enables the continuous inspection for long
length object without stopping.
C12200-461 offers a wide detection area with no dead areas due to its
staggered sensors.
X-ray image intensifier
(I.I.) camera :
C12200-321
10 pixels
Dead space 1:
130 μm min.
200 μm max.
±50 μm MAX.
Edge pixel
C12200-461
(Min. 4 pixels,
Max. 16 pixels)
Not necessary to relocate the samples and possible
to inspect the long length object with no distortion.
The image is distorted on the
corner areas in thickness direction,
and the dimensional measurement
cannot be implemented correctly.
X-ray TDI camera:
The non-distortion image can be
realized since X-ray is radiated
vertically to the object and the
dimensional measurement can be
implemented correctly.
Slack of rolling
Right chip
Center chip
Edge pixel
Dead space 2:
130 μm min.
200 μm max.
±50 μm MAX.
Center chip
Dead space 2
15.1±0.5
(Unit: mm)
Left chip
Inspection by
X-ray TDI camera
Wide detection width with no dead areas.
C12200-321 has a following dead space between chips. The effect by the
dead space to X-ray image depends on the measurement conditions such
as X-ray magnification ratio and X-ray source's focus size.
Dead space 1
Inspection by
2D sensor
Overlapped type measurement example
Possible to inspect the mismatch of rolling and measure
the length of electrode with no distortion.
Short of the solution
Condition of the connection on electrode
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