Foshan LV10T150B Schottky diode in a to-263 plastic package Datasheet

LV10T150B
Rev.E May.-2016
描述
/
DATA SHEET
Descriptions
TO-263 塑封封装 肖特基二极管。
Schottky Diode in a TO-263 Plastic Package.
特征
/ Features
高正向浪涌能力,超低正向压降,优异的高温稳定性。
High Forward Surge Capability, Ultra Low Forward Voltage Drop, Excellent High Temperature
Stability.
用途
/
Applications
用于高频、低压、大电流整流二极管,续流二极管,保护二极管。
For use in low voltage,high frequency inverters, free wheeling, and polarity protection applications.
内部等效电路
引脚排列
1
/ Equivalent Circuit
/ Pinning
2
4
3
PIN1:Anode
放大及印章代码
PIN 2,4:Cathode
PIN 3:Anode
/ hFE Classifications & Marking
见印章说明。See Marking Instructions.
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LV10T150B
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极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
符号
Symbol
VRM
VRSM
VDC
数值
Rating
单位
Unit
150
V
RMS Reverse Voltage
VRMS
105
V
Average forward rectified current
IF(AV)
1×10
A
Non Repetitive Peak Surge Current
IFSM
200
A
Thermal Resistance Junction to Case
RθJc
2.8
℃/W
-40~+150
℃
Tj
Junction and Storage Temperature Range
电性能参数
Tstg
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Reverse Voltage
Forward Voltage
Instantaneous Reverse Current
符号
Symbol
V(BR)R
VF
IR
(Note 1)
测试条件
Test Conditions
IR=1mA(Ta=25℃)
最小值 典型值 最大值
Min
Typ
Max
150
单位
Unit
V
IF =2A(Ta=25℃)
0.58
IF =10A(Ta=25℃)
0.81
IF =2A(Ta=125℃)
0.47
IF =10A(Ta=125℃)
0.69
75
V
VR=150V(Ta=25℃)
5
50
μA
20
mA
VR=150V(Ta=125℃)
V
0.85
V
V
注/Notes:
1. 使用极短的测试时间,以尽量减少自热效应。
Short duration pulse test used to minimize self-heating effect.
2. 除非特别注明,数值为一个芯片的参数。
Unless otherwise noted, values for the parameters of a single chip
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LV10T150B
Rev.E May.-2016
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
IF - TA
12
PEAK FORWARD SURGE CURRENT-(A)
10
8
IF(A)
IFSM
250
6
4
2
0
8.3ms Single Half Sine
Wave Jedec Method
200
150
100
50
0
25
50
75
100 125
TC(℃)
150
0
175
10
20
30
40
50
60
70
NO.OF CYCLES AT 60HZ
80
90
100
IR - VR
IF - VF
100
100
10
10
TA=125℃
1
IR(mA)
TA=125℃
IF(A)
TA=100℃
TA=100℃
1
0.1
0.01
TA=75℃
TA=75℃
TA=25℃
0.001
TA=25℃
0.0001
0.1
0
0.2
0.4
0.6
VF(V)
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0.8
1
0
30
60
90
120
150
VR(V)
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LV10T150B
Rev.E May.-2016
外形尺寸图
DATA SHEET
/ Package Dimensions
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LV10T150B
Rev.E May.-2016
印章说明
/
DATA SHEET
Marking Instructions
BR
****
10T150
说明:
为公司代码
BR:
10T150:
****:


为型号代码
为生产批号代码,随生产批号变化。
Note:
BR:
Company Code
10T150:
Product Type.
****:
Lot No. Code, code change with Lot No.
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LV10T150B
Rev.E May.-2016
DATA SHEET
回流焊温度曲线图(无铅)
/
Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:260±5℃
包装规格
Package Type
封装形式
TO-263
套管包装
Package Type
封装形式
使用说明
Temp.:260±5℃
Time:10±1 sec
/ Packaging SPEC.
卷盘包装
TO-263
时间:10±1 sec.
/ REEL
Units 包装数量
Dimension
Units/Reel
只/卷盘
Reels/Inner Box
卷盘/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
800
1
800
5
4,000
包装尺寸
3
(unit:mm )
Reel
Inner Box 盒
Outer Box 箱
13〞×24
360×360×50
385×257×392
/ TUBE
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
Units/Tube
只/套管
Tubes/Inner Box
套管/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Tube 套管
Inner Box 盒
Outer Box 箱
50
20
1,000
5
5,000
532×33×7.0
555×164×50
575×290×180
/ Notices
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