Material Content Data Sheet Sales Product Name IPP041N04N G MA# MA000733202 Package PG-TO220-3-123 Issued 29. August 2013 Weight* 2025.78 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel tin silver antimony iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-31-5 7440-22-4 7440-36-0 7439-89-6 7723-14-0 7440-50-8 2.247 0.11 0.816 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.11 1109 1109 403 0.245 0.01 815.335 40.25 40.30 402480 121 403004 6.371 0.31 0.31 3145 3145 2.343 0.12 1157 67.946 3.35 515.451 25.44 28.91 254446 289144 21.462 1.06 1.06 10595 10595 1.764 0.09 0.09 871 871 1.017 0.05 0.391 0.02 0.156 0.01 0.590 0.03 0.177 0.01 589.466 29.10 33541 502 193 0.08 77 87 29.14 290982 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 772 291 291360 1000000