Diodes DMT10H015LPS-13 100v n-channel enhancement mode mosfet Datasheet

DMT10H015LPS
Green
100V N-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI
Product Summary
RDS(ON) Max
ID
TC = +25°C
16mΩ @ VGS = 10V
44A
18mΩ @ VGS = 6.0V
41A
V(BR)DSS
ADVANCED INFORMATION
Features
100V



Thermally Efficient Package – Cooler Running Applications
High Conversion Efficiency
Low RDS(ON) – Minimizes On-State Losses






Low Input Capacitance
Fast Switching Speed
<1.1mm Package Profile – Ideal for Thin Applications
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description
This new generation N-Channel Enhancement Mode MOSFET is
designed to minimize RDS(ON), yet maintain superior switching
Mechanical Data
performance. This device is ideal for use in notebook battery power
management and loadswitch.

Case: POWERDI 5060-8

Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminals: Finish – Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)



Applications



Motor Control
DC-DC Converters
Power Management

®
POWERDI®5060-8
D
Pin1
G
S
D
S
D
S
D
G
D
S
Top View
Bottom View
Internal Schematic
Top View
Pin Configuration
Ordering Information (Note 4)
Part Number
DMT10H015LPS-13
Notes:
Case
®
POWERDI 5060-8
Packaging
2,500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
D
D
D
D
=Manufacturer’s Marking
T1015LS = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 15 = 2015)
WW = Week Code (01 to 53)
T1015LS
YY WW
S
S
S
G
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DMT10H015LPS
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DMT10H015LPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Steady
State
ADVANCED INFORMATION
Continuous Drain Current (Note 5) VGS = 10V
Steady
State
TA = +25°C
TA = +70°C
TC = +25°C
TC = +100°C
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 5)
Avalanche Current (Note 7) L=3mH
Avalanche Energy (Note 7) L=3mH
ID
Value
100
±20
7.3
5.8
ID
44
28
IDM
IS
IAS
EAS
1.5
7.5
85
Unit
V
V
A
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Electrical Characteristics
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
TA = +25°C
TC = +25°C
Value
Unit
W
°C/W
W
°C/W
°C
-55 to +150
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
100
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 1mA
VDS = 80V, VGS = 0V
VGS = 20V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
2.0
14
15
17
0.9
3.0
16
18
25
1.3
V
Static Drain-Source On-Resistance
1.4
—
—
—
—
VDS = VGS, ID = 250 A
VGS = 10V, ID = 20A
VGS = 6.0V, ID = 20A
VGS = 4.5V, ID = 5A
VGS = 0V, IS = 20A
CISS
COSS
CRSS
RG
QG
QGS
QGD
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
1,871
261
6.9
0.75
33.3
6.9
5.1
6.5
7.0
19.7
8.1
37.9
51.9
—
—
—
—
—
—
—
—
—
—
—
—
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
mΩ
V
Test Condition
pF
VDS = 50V, VGS = 0V
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDD = 50V, ID = 10A,
VGS = 10V
ns
VDD = 50V, VGS = 10V,
ID = 10A, RG = 6Ω
ns
nC
IF = 10A, di/dt = 100A/µs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
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DMT10H015LPS
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30
30
VGS = 10.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 5.0V
20
VGS = 4.5V
15
VGS = 4.0V
10
VDS = 5.0V
25
VGS = 6.0V
VGS = 3.5V
20
15
T A = 150C
10
T A = 125 C
TA = 85 C
T A = 25 C
5
5
T A = -55 C
VGS = 3.0V
0
0
0.5
1
1.5
2
2.5
VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
1.5
3
0.025
0.02
VGS = 4.5V
VGS = 6V
0.015
VGS = 10V
0.01
2
2.5
3
3.5
4
4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
0.005
0.05
0.04
0.03
ID = 5A
ID = 20A
0.02
0.01
0
0
5
10
15
20
25
30
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs. Drain Current and
Gate Voltage
0
0.03
5
10
15
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristic
20
1.8
VGS = 10V
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RD S(ON ), DRAIN-SOURCE ON-RESISTANCE ()
ADVANCED INFORMATION
25
TA = 150 C
0.025
TA = 125C
0.02
TA = 85 C
0.015
T A = 25 C
0.01
T A = -55C
0.005
0
1.6
VGS = 6V, ID = 20A
VGS = 10V, ID = 20A
1.4
1.2
VGS = 4.5V, ID = 5A
1
0.8
0.6
0
5
10
15
20
25
ID , DRAIN SOURCE CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Junction Temperature
30
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6 On-Resistance Variation with Junction
Temperature
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VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
2.6
0.04
0.03
VGS = 4.5V, ID = 5A
0.02
VGS = 10V, ID = 20A
0.01
VGS = 6V, ID = 20A
I D = 1mA
2.2
2
ID = 250µA
1.8
1.6
1.4
1.2
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7 On-Resistance Variation with Junction
Temperature
10000
30
CT , JUNCTION CAPACITANCE (pF)
25
IS, SOURCE CURRENT (A)
2.4
1
0
-50
T A= 150 C
20
T A= 25C
T A= 125 C
15
T A= 85C
10
T A= -55 C
5
Ciss
1000
C oss
100
10
Crss
f = 1MHz
0
1
0
0.3
0.6
0.9
1.2
V SD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
0
1.5
10
20
30
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
50
100
10
8
VDS = 50V
6
ID = 10A
4
ID, DRAIN CURRENT (A)
RDS(on)
Limited
VGS GATE THRESHOLD VOLTAGE (V)
ADVANCED INFORMATION
DMT10H015LPS
2
10
1
0
5
10
15
20
25
30
Qg, TOTAL GATE CHARGE (nC)
Figure 11 Gate Charge
DC
PW = 10s
PW = 1s
0.1
0.01
0
PW = 100µs
0.001
0.1
PW = 100ms
PW = 10ms
PW = 1ms
TJ (m ax ) = 150°C
TA = 25°C
VGS = 4.5V
Single Pulse
DUT on 1 * MRP Board
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
1000
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DMT10H015LPS
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCED INFORMATION
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RJA(t) = r(t) * R JA
Single Pulse
RJA = 99°C/W
Duty Cycle, D = t1/ t2
0.001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Figure 13 Transient Thermal Resistance
10
100
1000
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DMT10H015LPS
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
ADVANCED INFORMATION
POWERDI®5060-8
D
Detail A
D1
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
b3 (4X)
M1
Detail A
L1
G
POWERDI®5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05

b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51


L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
Θ
10°
12°
11°
Θ1
6°
8°
7°
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
POWERDI®5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
G
Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
Y(4x)
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IMPORTANT NOTICE
ADVANCED INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
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