CM6400 EMI Filter with ESD Protection for Data Line Applications Product Description http://onsemi.com The CM6400 is a 24−bump EMI filter with ESD protection device for data line application in a 0.4 mm pitch, 5 x 5 CSP form factor. It is fully compliant with IEC 61000−4−2 Level 4. The CM6400 is RoHS II compliant. Features • 24−Bump, 2.06 mm X 2.06 mm Footprint Chip Scale Package • These Devices are Pb−Free and are RoHS Compliant WLCSP24 CASE 567CH ELECTRICAL SCHEMATIC R L Level 4 Level 4 GND 1 of 10 Filter Channels MARKING DIAGRAM + 6400 WWYY XXXX 6400 WWYY XXXX = CM6400 = Date Code = Last four digits of lot# ORDERING INFORMATION Device Package Shipping† CM6400 CSP−24 (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 3 1 Publication Order Number: CM6400/D CM6400 PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Orientation Marking 1 A + 2 3 4 Bottom View (Bumps Up View) 5 5 4 3 2 1 A A1 Corner Indicator B B 6400 C C D D E E Table 1. PIN DESCRIPTIONS Pin Description Pin Description A2 − A5 Channel 1 C4 − C1 Channel 6 A4 − A1 Channel 2 D2 − D5 Channel 7 B2 − B5 Channel 3 D4 − D1 Channel 8 B4 − B1 Channel 4 E2 − E5 Channel 9 C2 − C5 Channel 5 E4 − E1 Channel 10 A3, D3, C3, E3 GND ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Rating Units Storage Temperature Range Parameter –55 to +150 °C Operating Temperature Range –40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units 100 125 150 W R Resistance L Inductance (Note 2) C Capacitance per channel At 1 MHz, VIN = 0 V 23.3 29.2 35 pF At 1 MHz, VIN = 2.5 V 14.2 17.8 21.4 pF Att(5) FC Passband attenuation at 5 MHz Cut−off frequency ZSOURCE = 50 W, ZLOAD = 50 W VBR Breakdown voltage ILOAD = ±10 mA ILEAK Leakage current per channel VIN = +3.0 V Leakage current per chip VIN = −3.0 V ESD Peak Discharge Voltage Protection at all pins: a) Contact Discharge per IEC 61000−4−2 standard AND b) Air Discharge per IEC 61000−4−2 standard (Note 2) VESD 24 ±6 −2.0 ±15 ±15 1. All parameters specified at TA = 25°C unless otherwise noted. 2. Standard IEC 61000−4−2 (CDischarge = 150 pF, RDischarge = 330 W). http://onsemi.com 2 nH −7 dB 200 MHz ±6.8 ±20 V 0.01 0.10 mA −0.1 mA kV CM6400 RF CHARACTERISTICS Figure 1. Typical Insertion Loss (Bias = 0 V, TA = 255C, 50 W Environment) MECHANICAL SPECIFICATION Vertical Structure Specification* Table 4. VERTICAL STRUCTURE DIMENSIONS (nominal) Ref. Parameter Material Dimension Silicon 389 mm a Die Thickness h Dielectric Layer 1 Polyimide 7.0 mm j Dielectric Layer 2 Polyimide 10 mm UBM−(Ti/Cu) d Plated Cu 5.0 mm Sputtered Cu 0.4 mm Sputtered Ti 0.1 mm e UBM Wetting Area Diameter 240 mm b Bump Standoff 194 mm f Solder Bump Diameter after Bump Reflow 270 mm c Metal Pad Height g Metal Pad Diameter D2 D1 AlSiCu 1.5 mm Figure 2. Sectional View 60 mm 0.406 mm Finished Thickness * Daisy Chain CM6040 0.600 mm http://onsemi.com 3 CM6400 PACKAGE DIMENSIONS WLCSP24, 2.06x2.06 CASE 567CH−01 ISSUE O D È PIN A1 REFERENCE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B DIM A A1 A2 b D E e E 2X 0.05 C 2X 0.05 C TOP VIEW MILLIMETERS MIN MAX 0.63 0.57 0.17 0.24 0.40 REF 0.24 0.29 2.06 BSC 2.06 BSC 0.40 BSC A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 24X A1 C SEATING PLANE A1 PACKAGE OUTLINE e b 0.05 C A B 0.03 C SIDE VIEW E e 0.40 PITCH D C 24X 0.40 PITCH B A 1 2 3 4 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM6400/D