rev.2.0 07.05.15 DUV-FW18 • • • • • Deep Ultraviolet Light Emission Source 265, 280, 310, 325, 340 nm TO18 metal can Flat SiO2 window Beam angle 113 deg. Description DUV-FW18 is a series of AlGaN based single emitter DEEP-UV LEDs in a hermetically sealed TO18 package, utilizing a flat quartz glass window with a beam angle of 113 degree. DUV-FW18 is available from 265 nm up to 340 nm peak wavelength with an optical output power of typically 0.8 mW. Maximum Rating (T CASE Parameter Forward Current (TA=25°C) = 25°C) Symbol Values Min. Unit Max. IF 40 mA Operating Temperature TOPR - 20 + 80 °C Storage Temperature TSTG - 40 + 100 °C Soldering Temperature (max. 5s) TSOL + 300 °C Electro-Optical Characteristics (T Parameter Symbol CASE = 25°C, IF =20 mA) DUV265 DUV280 DUV310 DUV325 DUV340 -FW18 - FW18 - FW18 - FW18 - FW18 Unit Peak Wavelength λP 265 ±5 280 ±5 310 ±5 325 ±5 340 ±5 nm Radiated Power PO 0.4 1.2 0.7 0.8 0.8 mW Spectral Width (FWHM) ∆λ 9 11 9 8 9 nm Forward Voltage VF 10 7 6.5 5 4 V Reverse Voltage (IR=10µA) VR >4 >2 >10 >10 >10 V Reverse Current (VR=5V) IR <50 <200 <1 <1 <1 µA Viewing Angle Thermal resistance 2Ө1/2 113 deg. RӨJ-REF 190 °C/W Rise time* tR / / 16 20 12 ns Fall time* tF / / 8 9 9 ns * frequency=100kHz, duty cycle=1%, IFP=200mA www.roithner-laser.com 1 Performance Characteristics Forward Current vs. Forward Voltage Spectrum Forward Voltage vs. Ambient Temp. Wavelength Shift vs. Ambient Temp. Radiant Flux vs. Ambient Temp. Forward Current vs. Relative Radiant Flux [%] www.roithner-laser.com 2 Performance Characteristics Junction Temp. vs. Forward Current Radiation Pattern Outline Dimensions TO18 all dimensions in mm Device Materials Pin # Material Glass A SiO2 Cap Stem ring Glass B Leads Fe-Ni alloy, Ni plating Fe-Ni alloy, Au plating Hard-glass (Black) Fe-Ni alloy, Au plating www.roithner-laser.com 3 Precautions Soldering: • • • • • • • • • • Do avoid overheating of the LED Do avoid electrostatic discharge (ESD) Do avoid mechanical stress, shock, and vibration Do only use non-corrosive flux. Do only solder the leads. Soldering of header or cap will damage the LED Do only cut the leads at room temperature with an ESD protected tool Do not solder closer than 3 mm from base of the header Do form leads prior to soldering Do not impose mechanical stress on the header when forming the leads Do not apply current to the LED until it has cooled down to room temperature after soldering Static Electricity: LEDs are sensitive to electrostatic discharge (ESD). Precautions against ESD must be taken when handling or operating these LEDs. Surge voltage or electrostatic discharge can result in complete failure of the device. UV-Radiation: During operation these LEDs do emit high intensity ultraviolet light, which is hazardous to skin and eyes, and may cause cancer. Do avoid exposure to the emitted UV light. Protective glasses are recommended. It is further advised to attach a warning label on products/systems that do utilize UV-LEDs: Class 1 Operation: Do only operate LEDs with a current source. Running these LEDs from a voltage source will result in complete failure of the device. Current of a LED is an exponential function of the voltage across it. Usage of current regulated drive circuits is mandatory © All Rights Reserved The above specifications are for reference purpose only and subjected to change without prior notice www.roithner-laser.com 4