ON MC74HC595ADTG 8-bit serial-input/serial or parallel-output shift register with latched 3-state output Datasheet

MC74HC595A
8-Bit Serial-Input/Serial or
Parallel-Output Shift
Register with Latched
3-State Outputs
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High−Performance Silicon−Gate CMOS
The MC74HC595A consists of an 8−bit shift register and an 8−bit
D−type latch with three−state parallel outputs. The shift register
accepts serial data and provides a serial output. The shift register also
provides parallel data to the 8−bit latch. The shift register and latch
have independent clock inputs. This device also has an asynchronous
reset for the shift register.
The HC595A directly interfaces with the SPI serial data port on
CMOS MPUs and MCUs.
MARKING
DIAGRAMS
16
PDIP−16
N SUFFIX
CASE 648
16
1
1
16
Features
•
•
•
•
•
•
•
•
•
•
MC74HC595AN
AWLYYWWG
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC
Standard No. 7 A
Chip Complexity: 328 FETs or 82 Equivalent Gates
Improvements over HC595
− Improved Propagation Delays
− 50% Lower Quiescent Power
− Improved Input Noise and Latchup Immunity
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free and are RoHS Compliant
SOIC−16
D SUFFIX
CASE 751B
16
1
HC595AG
AWLYWW
1
16
16
1
HC
595A
ALYWG
G
TSSOP−16
DT SUFFIX
CASE 948F
1
A
WL, L
YY, Y
WW, W
G, G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
July, 2013 − Rev. 15
1
Publication Order Number:
MC74HC595A/D
MC74HC595A
LOGIC DIAGRAM
PIN ASSIGNMENT
SERIAL
DATA
INPUT
A
15
14
1
2
QB
1
16
VCC
3
QC
2
15
QA
4
QD
3
14
A
QE
4
13
OUTPUT ENABLE
QF
5
12
LATCH CLOCK
QG
6
11
SHIFT CLOCK
QH
7
10
RESET
GND
8
9
SQH
SHIFT
REGISTER
LATCH
5
6
7
SHIFT 11
CLOCK
10
RESET
LATCH 12
CLOCK
OUTPUT 13
ENABLE
9
QA
QB
QC
QD
QE
PARALLEL
DATA
OUTPUTS
QF
QG
QH
SQH
SERIAL
DATA
OUTPUT
VCC = PIN 16
GND = PIN 8
ORDERING INFORMATION
Package
Shipping†
MC74HC595ANG
PDIP−16
(Pb−Free)
500 Units / Rail
MC74HC595ADG
SOIC−16
(Pb−Free)
48 Units / Rail
Device
NLV74HC595ADG*
MC74HC595ADR2G
NLV74HC595ADR2G*
MC74HC595ADTR2G
NLV74HC595ADTR2G*
MC74HC595ADTG
SOIC−16
(Pb−Free)
2500 Tape & Reel
TSSOP−16
(Pb−Free)
TSSOP−16
(Pb−Free)
96 Units / Tube
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
MC74HC595A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
–0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
Vin
DC Input Voltage (Referenced to GND)
–0.5 to VCC+0.5
V
Vout
DC Output Voltage (Referenced to GND)
–0.5 to VCC+0.5
V
Iin
DC Input Current, per Pin
±20
mA
Iout
DC Output Current, per Pin
±35
mA
ICC
DC Supply Current, VCC and GND Pins
±75
mA
PD
Power Dissipation in Still Air,
750
500
450
mW
Tstg
Storage Temperature
–65 to +150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
260
VESD
ESD Withstand Voltage Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
>3000
>400
N/A
Plastic DIP†
SOIC Package†
TSSOP Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
_C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
DC Supply Voltage (Referenced to GND)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
500
400
ns
DC Input Voltage, Output Voltage
(Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
Test Conditions
Guaranteed Limit
VCC
V
– 55 to 25_C
v 85_C
v 125_C
Unit
VIH
Minimum High−Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum Low−Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
VOH
Minimum High−Level Output
Voltage, QA − QH
Vin = VIH or VIL
|Iout| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.2
3.7
5.2
Vin = VIH or VIL
|Iout| v 2.4 mA
|Iout| v 6.0 mA
|Iout| v 7.8 mA
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3
MC74HC595A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
VOL
Parameter
Test Conditions
Maximum Low−Level Output
Voltage, QA − QH
Vin = VIH or VIL
|Iout| v 20 mA
Vin = VIH or VIL
VOH
Minimum High−Level Output
Voltage, SQH
Vin = VIH or VIL
IIoutI v 20 mA
Vin = VIH or VIL
VOL
Maximum Low−Level Output
Voltage, SQH
|Iout| v 2.4 mA
|Iout| v 6.0 mA
|Iout| v 7.8 mA
|Iout| v 2.4 mA
IIoutI v 4.0 mA
IIoutIv 5.2 mA
Vin = VIH or VIL
IIoutI v 20 mA
Vin = VIH or VIL
|Iout| v 2.4 mA
IIoutI v 4.0 mA
IIoutIv 5.2 mA
Guaranteed Limit
VCC
V
– 55 to 25_C
v 85_C
v 125_C
Unit
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.4
0.4
0.4
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.2
3.7
5.2
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.4
0.4
0.4
V
V
Iin
Maximum Input Leakage
Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
mA
IOZ
Maximum Three−State
Leakage
Current, QA − QH
Output in High−Impedance State
Vin = VIL or VIH
Vout = VCC or GND
6.0
± 0.5
± 5.0
± 10
mA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
lout = 0 mA
6.0
4.0
40
160
mA
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
VCC
V
Guaranteed Limit
– 55 to 25_C
v 85_C
v 125_C
Unit
fmax
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 7)
2.0
3.0
4.5
6.0
6.0
15
30
35
4.8
10
24
28
4.0
8.0
20
24
MHz
tPLH,
tPHL
Maximum Propagation Delay, Shift Clock to SQH
(Figures 1 and 7)
2.0
3.0
4.5
6.0
140
100
28
24
175
125
35
30
210
150
42
36
ns
tPHL
Maximum Propagation Delay, Reset to SQH
(Figures 2 and 7)
2.0
3.0
4.5
6.0
145
100
29
25
180
125
36
31
220
150
44
38
ns
tPLH,
tPHL
Maximum Propagation Delay, Latch Clock to QA − QH
(Figures 3 and 7)
2.0
3.0
4.5
6.0
140
100
28
24
175
125
35
30
210
150
42
36
ns
tPLZ,
tPHZ
Maximum Propagation Delay, Output Enable to QA − QH
(Figures 4 and 8)
2.0
3.0
4.5
6.0
150
100
30
26
190
125
38
33
225
150
45
38
ns
tPZL,
tPZH
Maximum Propagation Delay, Output Enable to QA − QH
(Figures 4 and 8)
2.0
3.0
4.5
6.0
135
90
27
23
170
110
34
29
205
130
41
35
ns
Symbol
Parameter
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4
MC74HC595A
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
VCC
V
Guaranteed Limit
– 55 to 25_C
v 85_C
v 125_C
Unit
tTLH,
tTHL
Maximum Output Transition Time, QA − QH
(Figures 3 and 7)
2.0
3.0
4.5
6.0
60
23
12
10
75
27
15
13
90
31
18
15
ns
tTLH,
tTHL
Maximum Output Transition Time, SQH
(Figures 1 and 7)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
16
110
36
22
19
ns
Cin
Maximum Input Capacitance
—
10
10
10
pF
Cout
Maximum Three−State Output Capacitance (Output in
High−Impedance State), QA − QH
—
15
15
15
pF
Symbol
Parameter
Typical @ 25°C, VCC = 5.0 V
CPD
300
Power Dissipation Capacitance (Per Package)*
pF
TIMING REQUIREMENTS (Input tr = tf = 6.0 ns)
VCC
V
Guaranteed Limit
25_C to –55_C
v 85_C
v 125_C
Unit
tsu
Minimum Setup Time, Serial Data Input A to Shift Clock
(Figure 5)
2.0
3.0
4.5
6.0
50
40
10
9.0
65
50
13
11
75
60
15
13
ns
tsu
Minimum Setup Time, Shift Clock to Latch Clock
(Figure 6)
2.0
3.0
4.5
6.0
75
60
15
13
95
70
19
16
110
80
22
19
ns
th
Minimum Hold Time, Shift Clock to Serial Data Input A
(Figure 5)
2.0
3.0
4.5
6.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
ns
trec
Minimum Recovery Time, Reset Inactive to Shift Clock
(Figure 2)
2.0
3.0
4.5
6.0
50
40
10
9.0
65
50
13
11
75
60
15
13
ns
tw
Minimum Pulse Width, Reset
(Figure 2)
2.0
3.0
4.5
6.0
60
45
12
10
75
60
15
13
90
70
18
15
ns
tw
Minimum Pulse Width, Shift Clock
(Figure 1)
2.0
3.0
4.5
6.0
50
40
10
9.0
65
50
13
11
75
60
15
13
ns
tw
Minimum Pulse Width, Latch Clock
(Figure 6)
2.0
3.0
4.5
6.0
50
40
10
9.0
65
50
13
11
75
60
15
13
ns
tr, tf
Maximum Input Rise and Fall Times
(Figure 1)
2.0
3.0
4.5
6.0
1000
800
500
400
1000
800
500
400
1000
800
500
400
ns
Symbol
Parameter
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5
MC74HC595A
FUNCTION TABLE
Inputs
Operation
Reset
Resulting Function
Serial
Input
A
Shift
Clock
Latch
Clock
Output
Enable
Shift
Register
Contents
Latch
Register
Contents
Serial
Output
SQH
Parallel
Outputs
QA − QH
Reset shift register
L
X
X
L, H, ↓
L
L
U
L
U
Shift data into shift
register
H
D
↑
L, H, ↓
L
D → SRA;
SRN → SRN+1
U
SRG → SRH
U
Shift register remains
unchanged
H
X
L, H, ↓
L, H, ↓
L
U
U
U
U
Transfer shift register
contents to latch
register
H
X
L, H, ↓
↑
L
U
SRN → LRN
U
SRN
Latch register remains
unchanged
X
X
X
L, H, ↓
L
*
U
*
U
Enable parallel outputs
X
X
X
X
L
*
**
*
Enabled
Force outputs into high
impedance state
X
X
X
X
H
*
**
*
Z
SR = shift register contents
LR = latch register contents
D = data (L, H) logic level
U = remains unchanged
↑ = Low−to−High
↓ = High−to−Low
* = depends on Reset and Shift Clock inputs
** = depends on Latch Clock input
PIN DESCRIPTIONS
INPUTS
A (Pin 14)
Output Enable (Pin 13)
Active−low Output Enable. A low on this input allows the
data from the latches to be presented at the outputs. A high
on this input forces the outputs (QA−QH) into the
high−impedance state. The serial output is not affected by
this control unit.
Serial Data Input. The data on this pin is shifted into the
8−bit serial shift register.
CONTROL INPUTS
Shift Clock (Pin 11)
Shift Register Clock Input. A low− to−high transition on
this input causes the data at the Serial Input pin to be shifted
into the 8−bit shift register.
OUTPUTS
QA − QH (Pins 15, 1, 2, 3, 4, 5, 6, 7)
Reset (Pin 10)
SQH (Pin 9)
Noninverted, 3−state, latch outputs.
Active−low, Asynchronous, Shift Register Reset Input. A
low on this pin resets the shift register portion of this device
only. The 8−bit latch is not affected.
Noninverted, Serial Data Output. This is the output of the
eighth stage of the 8−bit shift register. This output does not
have three−state capability.
Latch Clock (Pin 12)
Storage Latch Clock Input. A low−to−high transition on
this input latches the shift register data.
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6
MC74HC595A
SWITCHING WAVEFORMS
tr
SHIFT
CLOCK
tw
tf
VCC
VCC
90%
50%
10%
tw
GND
GND
tPHL
1/fmax
OUTPUT
SQH
50%
OUTPUT
SQH
tPHL
tPLH
50%
RESET
90%
50%
10%
trec
VCC
SHIFT
CLOCK
tTLH
50%
GND
tTHL
Figure 1.
LATCH
CLOCK
Figure 2.
OUTPUT
ENABLE
VCC
50%
VCC
50%
GND
GND
tPLH
tPHL
OUTPUT Q
OUTPUT Q
tTLH
10%
VOL
90%
VOH
HIGH
IMPEDANCE
tTHL
Figure 4.
VCC
SHIFT
CLOCK
VALID
VCC
50%
GND
50%
tsu
GND
LATCH
CLOCK
th
VCC
SWITCH
CLOCK
tPHZ
50%
Figure 3.
tsu
HIGH
IMPEDANCE
50%
tPZH
90%
QA-QH 50%
OUTPUTS 10%
SERIAL
INPUT A
tPLZ
tPZL
VCC
50%
GND
50%
tw
GND
Figure 6.
Figure 5.
TEST CIRCUITS
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
1 kW
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 7.
Figure 8.
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7
MC74HC595A
EXPANDED LOGIC DIAGRAM
OUTPUT
ENABLE
13
LATCH
CLOCK
12
SERIAL
DATA
INPUT A
14
D
Q
D
SRA
Q
15
QA
LRA
R
Q
D
D
SRB
Q
1
QB
LRB
R
Q
D
D
SRC
Q
2
QC
LRC
R
Q
D
D
SRD
Q
3
QD
LRD
PARALLEL
DATA
OUTPUTS
R
Q
D
D
SRE
Q
4
QE
LRE
R
Q
D
D
SRF
Q
5
QF
LRF
R
Q
D
D
SRG
Q
6
QG
LRG
R
SHIFT
CLOCK
Q
D
11
D
SRH
Q
7
QH
LRH
R
RESET
10
9
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8
SERIAL
DATA
OUTPUT SQH
MC74HC595A
TIMING DIAGRAM
SHIFT
CLOCK
SERIAL DATA
INPUT A
RESET
LATCH
CLOCK
OUTPUT
ENABLE
QA
QB
QC
QD
QE
QF
QG
QH
SERIAL DATA
OUTPUT SQH
NOTE:
implies that the output is in a high−impedance
state.
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MC74HC595A
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
−A
−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
1
−B
−
8
P 8 PL
0.25 (0.010)
M
B
M
G
K
DIM
A
B
C
D
F
G
J
K
M
P
R
F
R X 45°
C
−T
SEATING
−
PLANE
J
M
D16PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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10
MILLIMETERS
MIN
MAX
9.80 10.00
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
6.20
5.80
0.50
0.25
INCHES
MIN
MAX
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.229 0.244
0.010 0.019
MC74HC595A
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
http://onsemi.com
11
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74HC595A
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE U
SCALE 1:1
D
A
16
9
E
H
E1
1
NOTE 8
b2
8
c
B
TOP VIEW
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
e/2
NOTE 3
L
A1
C
D1
e
SEATING
PLANE
M
eB
END VIEW
16X b
SIDE VIEW
0.010
M
C A
M
B
M
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
−−−− 0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−− 0.430
0.115 0.150
−−−−
10 °
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10 °
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