ML LX90248 Micropower & Omnipolar⇔ Hall Switch Application Examples es Features and Benefits 0 0 0 0 0 Micropower consumption ideal for battery-powered applications 0 Omnipolar, easy to use as output switcches with both North and South pole 0 Very High Sensitivity Hall Sensor 0 Chopper stabilized amplifier stage 0 Open-Drain Output 0 Operation down to 1.5V 0 Ultra-Thin QFN package (0.43mm ma ax) & Thin SOT23 3L (both RoHS Compliant) Solid State Switch Handheld Wireless Handset Awake A Switch Lid close sensor for battery-po owered devices Magnet proximity sensor for reed eed switch replacement in low duty cycle e applications Ordering Code Product Code MLX90248 MLX90248 Temperature Code E E Package Code SE LD Option Code EBA-000 EBA-000 Legend: Temperature Code: Package Code: Packing Form: E for Temperature Range -40°C to 85°C SE for TSOT, LD for UTQFN RE for Reel Ordering example: MLX90248E MLX90248ESE-EBA-000-RE 1 Functional Diagram Packing Form Code RE RE 2 General Description The MLX90248 Omnipolar TM Hall effect sensor IC is fabricated from mixxed signal CMOS technology. It incorporates ates advanced chopperstabilization techniques to prrovide accurate and stable magnetic switch points. The circuit design provides an internally controlled clocking mechanism to cycle e power to the Hall element and analog signal processing circuits. This serves to place the high h current-consuming portions of the circuit into nto a “Sleep” mode. Periodically the device is ““Awakened” by this internal logic and the magnet agnetic flux from the Hall element is evaluated again nst the predefined thresholds. If the flux density iss above or below the Bop/Brp thresholds then the output transistor is driven to change states acco ordingly. While in the “Sleep” cycle the output transsistor is latched in its previous state. The design has been optimized for service in applications requiring r extended operating lifetime in battery pow wered systems. The output transistor of the 90 90248 will be latched on (BOP) in the presence of a sufficiently strong South or North magnetic field d facing the marked side of the package. The output utput will be latched off (BRP) in the absence of a magnet agnetic field. 390109024802 Rev 002 Page 1 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch Table of Contents 1 Functional Diagram ........................................................................................................ 1 2 General Description........................................................................................................ 1 3 Glossary of Terms .......................................................................................................... 3 4 Absolute Maximum Ratings ........................................................................................... 3 5 Pin Definitions and Descriptions................................................................................... 3 6 General Electrical Specifications .................................................................................. 4 7 Magnetic Specifications ................................................................................................. 4 8 Outputs Behaviour vs. Magnetic Pole........................................................................... 4 9 Detailed General Description ......................................................................................... 5 10 Unique Features............................................................................................................ 5 11 Performance Graphs .................................................................................................... 6 11.1 Magnetic Thresholds vs. TA .................................................................................................................... 6 11.2 Magnetic Thresholds vs. VDD .................................................................................................................. 6 11.3 Current Consumption vs. TA ................................................................................................................... 6 11.4 Current Consumption vs. VDD ................................................................................................................. 6 11.5 Consumption Period vs. TA ..................................................................................................................... 6 11.6 Consumption Period vs. VDD ................................................................................................................... 6 11.7 Output Saturation Voltage vs. TA ............................................................................................................ 7 11.8 Output Switching Characteristics ............................................................................................................ 7 12 Application Information................................................................................................ 7 13 Standard information regarding manufacturability of Melexis products with different soldering processes........................................................................................... 8 14 ESD Precautions ........................................................................................................... 8 15 Package Information..................................................................................................... 9 15.1 SE Package (TSOT-3L) .......................................................................................................................... 9 15.2 LD Package (UTQFN-6L) ..................................................................................................................... 10 16 Disclaimer.................................................................................................................... 11 390109024802 Rev 002 Page 2 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch 3 Glossary of Terms Gauss, milliTesla (mT), Units of magnetic flux density : 10 Gauss = 1mT 4 Absolute Maximum Ratings Parameter Symbol Supply Voltage VDD Supply Current IDD Output Voltage VOUT Output Current IOUT Operating Temperature Range TA Storage Temperature Range TS ESD Sensitivity - HBM (1) ESD Sensitivity - MM (2) Table 1: Absolute maximum ratings Value 5 5 5 10 -40 to 85 -50 to 150 8000 800 Units V mA V mA °C °C V V Note 1: Human Body Model according JESD22-A114 standard – 100pF capacitor discharged through 1.5k& resistor into each pin. Note 2: Machine Model according JESD22-A115 standard – 200pF capacitor discharged directly (0& resistor) into each pin. Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability. 5 Pin Definitions and Descriptions LD Package SE Package Pin Name Function Pin № (SE) VDD Power Supply 1 GND Ground 3 OUT Output (Open Drain) 2 NC Not Connected Table 2: Pin definitions and descriptions Pin № (LD) 2 4 5 1,3,6 Note : Exposed Pad on LD package is connected to ground 390109024802 Rev 002 Page 3 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch 6 General Electrical Specifications DC Operating Parameters T A = 25oC, VDD = 1.5V to 3.6V (unless otherwise specified) Parameter Symbol Supply Voltage VDD Awake Supply Current IDDawake Sleep Supply Current IDDsleep Average Supply Current IDDav Output Saturation Voltage VSAT Output Leakage Current ILEAK Awake Period TAW Sleep Period TSL Table 3: Electrical specifications Test Conditions Operating VDD = 3.6V VDD = 3.6V VDD = 3.6V, Average IOUT = 1mA VDD = 3.6V Operating Operating Min 1.5 30 25 Typ 3 3.5 6.5 0.27 50 40 Max 3.6 5 6 10 0.4 1 120 70 Units V mA ∝A ∝A V ∝A ∝s ms 7 Magnetic Specifications o DC Operating Parameters T A = 25 C, VDD = 1.5V to 3.6V (unless otherwise specified) Parameter Symbol Operating Point BOP Release Point BRP Hysteresis BHYST Table 4: Magnetic specifications Min +/-1.1 +/-0.8 0.3 Typ - Max +/-6 +/-5.7 2.3 Units mT mT mT Note : For typical values, please refer to the performance graphs section 8 Outputs Behaviour vs. Magnetic Pole SE Package LD Package Parameter Test conditions OUT (SE) North or South pole B > |BOP| Low “Zero” magnetic pole B < |BRP| High Table 5: Outputs behaviour vs. magnetic pole OUT (LD) Low High Note : The magnetic pole is applied facing the branded side of the package 390109024802 Rev 002 Page 4 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch 9 Detailed General Description The MLX90248 is originally used in mobile phone applications for open/close lid detection (flip, slide and swivel phone type). The goal of this detection is to switch on or off the application if the lid is opened or closed, in order to save battery power. The same operation principle can be simply applied to any other battery-powered device with a lid/cover like laptop, digital cameras and camcorders. By the use of a very high sensitivity Hall sensor, a very small and cheap magnet is enough to trigger the MLX90248, hence it can easily replace reed switch. The major benefit of using a Hall sensor is to provide “electronic” commutation, which is bounce-free, more reliable and with increased lifetime compared to usual mechanical contacts. 10 Unique Features The MLX90248 exhibits “Omnipolar” magnetic characteristics. It means the device reacts to both North and South magnetic pole. The purpose is to detect the presence of any magnetic field applied on the device. This mode of operation simplifies customer production processes by avoiding the need to detect the Hall sensor pole active on the magnet used in the application. Taking the example of a generic Hall sensor “south pole active”, during its production, the customer must detect the south pole of the application magnet and face it to the device to enable the output to be turned on and off. Without any magnet pole detection system, the incorrect magnetic pole (north in this example) could be faced to the device which would fail the application. Therefore, the “Omnipolar” magnetic behaviour helps customers by removing the need of magnet pole detection system during production phase. The “Micropower” feature makes the MLX90248 especially suitable for battery-powered device as it combines low voltage operation and low current consumption. By using a sleep/awake strategy managed internally, the power consumption is drastically reduced. To make a comparison, the MLX90248 consumes 100 times less power than the generic low voltage Melexis Hall sensor US3881. As well as Thin SOT package, the MLX90248 is now delivered in an ultra thin UTQFN package. This new 2 leadless package only requires 3mm PCB surface and is 0.43mm maximum thick, which is particularly important in design where space-saving and miniaturisation are the critical factors. 390109024802 Rev 002 Page 5 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch 11 Performance Graphs Unless otherwise specified, performance graphs given at VDD = 3.6V and TA = 25 degree C. 11.1 Magnetic Thresholds vs. TA 11.2 Magnetic Thresholds vs. VDD 6 6 BrpN BopS BrpS 0 -3 0 -3 -6 -6 -40 -20 0 20 40 60 80 100 120 1.5 2 2.5 Ta (° C) 3 3.5 VDD (V) 11.3 Current Consumption vs. TA 11.4 Current Consumption vs. VDD 10 10 Idd awake (mA) Idd awake (mA) Idd sleep (uA) Idd average (uA) Idd sleep (uA) Idd average (uA) 8 Current Consumption 8 Current Consumption BrpN BrpS 3 BopN Magnetic threshold (mT) Magnetic threshold (mT) 3 BopN BopS 6 4 2 6 4 2 0 0 -40 -20 0 20 40 60 80 1.5 2 Ta (° C) 2.5 3 3.5 VDD (V) 11.5 Consumption Period vs. TA 11.6 Consumption Period vs. VDD 100 80 Tawake(us), VDD=3.6V Tawake(us) Tsleep(ms) Tsleep(ms), VDD=3.6V 80 60 Timing Timing 60 40 40 20 20 0 0 -40 -20 0 20 40 60 80 1.5 Ta (° C) 390109024802 Rev 002 2 2.5 3 3.5 VDD (V) Page 6 of 11 Data Sheet Apr/12 MLX X90248 Micropower & Omnipolar⇔ Hall Switch 11.7 Output Saturation Voltage ge vs. TA 11.8 Output Switching Charracteristics 400 VDD = 1.5V Output Saturation Voltage (mV) VDD = 3.6V 300 200 100 0 -40 -20 0 20 40 60 80 Ta (° C) 12 Application Information n Typical application 390109024802 Rev 002 Page 7 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch 13 Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx 14 ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 390109024802 Rev 002 Page 8 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch 15 Package Information 15.1 SE Package (TSOT-3L) 2.75 BSC 110 MAX H-i SEATiNG PLANE I Notes: "I 1. All dimensions are in millimeters 2.Outermost plasttc extreme width does not indude mold flash or protrusions. Mold flash and protrusions shall not exceed 0.15mm per side 3.Outermost plasttc extreme length does not indude mold flash or protrusions. Mold flash and protrusions shall not exceed 0.25mm per side 4.The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shallbe 0.07mm totalin excess of the lead width dimension at maximum materialoond1t1on 5. Dimension IS the length of term1nal for s dering 6. Dimension on SECTI ON B+B' are apply to the flat section of the lead between o.oamm and a.15mm from the lead tip. SIDE VIEW 7.Formed lead shallbe planar with respect to one another with 0.076mm at seating plane Markina- 12" REF. TYP. Top side 248E- Name of the Dev1ce (MLX90248) Bottom side xyww x = last digit of lot number y last dig1t of year WN "'week 0.575 REF. SECTION B-B' END VIEW Hall plate location Notes 1_ AI! dimensions are in millimeters END VIEW TOP VIEW 390109024802 Rev 002 Package line Page 9 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch 15.2 LD Package (UTQFN-6L) 390109024802 Rev 002 Page 10 of 11 Data Sheet Apr/12 MLX90248 Micropower & Omnipolar⇔ Hall Switch 16 Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2012 Melexis NV. All rights reserved. For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: Phone: +32 1367 0495 E-mail: [email protected] America: Phone: +1 248 306 5400 E-mail: [email protected] ISO/TS 16949 and ISO14001 Certified 390109024802 Rev 002 Page 11 of 11 Data Sheet Apr/12