Material Content Data Sheet Sales Product Name SPA04N60C3 Issued MA# MA000448274 Package PG-TO220-3-111 29. August 2013 Weight* 2265.90 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus tin silver antimony 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-31-5 7440-22-4 7440-36-0 3.279 0.14 1.120 0.05 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.14 1447 1447 494 0.336 0.01 1118.332 49.36 49.42 493544 148 494187 0.720 0.03 0.03 318 318 2.265 0.10 1000 212.895 9.40 917.259 40.48 49.98 404807 499762 7.942 0.35 0.35 3505 3505 0.305 0.01 0.001 0.00 0.952 0.04 0.366 0.02 0.147 0.01 93955 135 0.01 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 135 162 0.07 Important Remarks: 1. 0 420 65 647 1000000