TI1 LPV811DBVT Nanopower operational amplifier Datasheet

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LPV811, LPV812
SNOSD33 – AUGUST 2016
1 Features
3 Description
•
•
•
•
•
•
•
•
•
•
•
•
The
LPV811/LPV812
is
an
ultra-low-power
operational amplifier family for “Always ON” sensing
applications in wireless and wired equipment. With 8
kHz of bandwidth from 425 nA of quiescent current
and less than 300µV of input offset, the
LPV811/LPV812 amplifiers provide the required
precision while minimizing power consumption in
equipment such as gas detectors and portable
electronic devices where operational battery-life is
critical.
1
Nanopower Supply Current: 425 nA/channel
Offset Voltage: 300 µV (max)
Good TcVos: 1.5 µV/°C
Gain-Bandwidth: 8 kHz
Unity-Gain Stable
Low Input Bias Current : 100 fA
Wide Supply Range: 1.6 V to 5.5 V
Rail-to-Rail Output
No Output Reversals
EMI Protection
Temperature Range: –40°C to 125°C
Industry Standard Packages:
– Single in 5-pin SOT-23
– Dual in 8-pin VSSOP
2 Applications
•
•
•
•
•
•
•
Gas Detectors such as CO and O2
Current Sensing
Motion Detectors using PIR sensors
Portable Medical Equipment
Thermostats
Remote Sensors, IoT
Active RFID Readers and Tags
In
addition
to
being
ultra-low-power,
the
LPV811/LPV812 amplifiers have CMOS input stages
with fempto-amp bias current which reduces errors
commonly introduced in transimpedance amplifier
(TIA) configurations with megaohm feedback
resistors and high source impedance applications.
The LPV811/LPV812 amplifiers also feature a
negative-rail sensing input stage and a rail-to-rail
output stage that swings within millivolts of the rails,
maintaining the widest dynamic range possible.
Likewise, EMI protection is designed into the
LPV811/LPV812 in order to reduce system sensitivity
to unwanted RF signals from mobile phones, WiFi,
radio transmitters, and tag readers.
The LPV811/LPV812 amplifiers operate with a single
supply voltage as low as 1.6V, ensuring continuous
performance in low battery situations over the
extended temperature range of -40ºC to 125ºC. The
single and dual channel versions are available in
industry standard 5-pin SOT-23 and 8-pin VSSOP
packages respectively.
Device Information (1)
PART
NUMBER
BODY SIZE
LPV811
SOT-23 (5)
2.90 mm x 1.60 mm
LPV812
VSSOP (8)
3.00 mm × 3.00 mm
(1)
Nanopower Oxygen Sensor
PACKAGE
For all available packages, see the orderable addendum at
the end of the data sheet.
Nanopower CO Sensor
100 M
1M
+
V
V
1M
+
RL
+
VOUT
CO
Sensor
+
VOUT
RL
OXYGEN SENSOR
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
PRODUCT PREVIEW
LPV811/LPV812 Precision 425 nA Nanopower Operational Amplifiers
LPV811, LPV812
SNOSD33 – AUGUST 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
4
4
4
4
5
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
7
Device and Documentation Support.................... 6
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
8
Device Support ........................................................
Documentation Support ...........................................
Related Links ............................................................
Receiving Notification of Documentation Updates....
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
6
6
6
6
6
6
7
7
Mechanical, Packaging, and Orderable
Information ............................................................. 7
4 Revision History
DATE
REVISION
NOTES
August 2016
*
Initial release.
PRODUCT PREVIEW
2
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Copyright © 2016, Texas Instruments Incorporated
LPV811, LPV812
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SNOSD33 – AUGUST 2016
5 Pin Configuration and Functions
LPV812 8-Pin VSSOP
DGK Package
Top View
LPV811 5-Pin SOT-23
DBV Package
Top View
OUT A
OUTPUT
5
1
1
8
V+
7
OUT B
A
+
V
-IN A
2
B
V
-
+
+IN
+IN A
3
6
-IN B
V-
4
5
+IN B
2
4
3
-IN
Pin Functions: LPV811 DBV
TYPE
DESCRIPTION
NAME
NUMBER
OUT
1
O
Channel A Output
-IN
2
I
Channel A Inverting Input
+IN
3
I
Channel A Non-Inverting Input
V-
4
P
Negative (lowest) power supply
V+
5
P
Positive (highest) power supply
PRODUCT PREVIEW
PIN
Pin Functions: LPV812 DGK
PIN
TYPE
DESCRIPTION
NAME
NUMBER
OUT A
1
O
Channel A Output
-IN A
2
I
Channel A Inverting Input
+IN A
3
I
Channel A Non-Inverting Input
V-
4
P
Negative (lowest) power supply
+IN B
5
I
Channel B Non-Inverting Input
-IN B
6
I
Channel B Inverting Input
OUT B
7
O
Channel B Output
V+
8
P
Positive (highest) power supply
Copyright © 2016, Texas Instruments Incorporated
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LPV811, LPV812
SNOSD33 – AUGUST 2016
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6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
–0.3
6
V
Common mode
(V-) - 0.3
(V+) + 0.3
V
Differential
(V-) - 0.3
(V+) + 0.3
V
-10
10
mA
Continuous
Continuous
Operating temperature
–40
125
°C
Storage temperature, Tstg
–65
150
°C
150
°C
Supply voltage, Vs = (V+) - (V-)
Voltage
Input pins
Input pins
(2) (3)
Current
Output short
current (4)
Junction temperature
(1)
(2)
(3)
PRODUCT PREVIEW
(4)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Not to exceed -0.3V or +6.0V on ANY pin, referred to VInput terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should
be current-limited to 10 mA or less.
Short-circuit to Vs/2, one amplifer per package. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Supply voltage (V+ – V–)
1.6
5.5
V
Specified temperature
-40
125
°C
6.4 Thermal Information
THERMAL METRIC (1)
LPV811
DBV (SOT23)
5 PINS
LPV811
DGK
(VSSOP)
5 PINS
184.2
θJA
Junction-to-ambient thermal resistance
177.4
θJCtop
Junction-to-case (top) thermal resistance
133.9
75.3
θJB
Junction-to-board thermal resistance
36.3
105.5
ψJT
Junction-to-top characterization parameter
23.6
13.5
ψJB
Junction-to-board characterization parameter
35.7
103.9
(1)
4
UNIT
ºC/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
LPV811, LPV812
www.ti.com
SNOSD33 – AUGUST 2016
6.5 Electrical Characteristics
TA = 25°C, VS = 1.8 V to 5 V, VCM = VOUT = VS/2, and RL≥ 10 MΩ to VS / 2, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
±55
±300
UNIT
OFFSET VOLTAGE
VOS
Input offset voltage
VS = 1.8 V and 3.3 V, VCM = V-
ΔVOS/ΔT
Input offset drift
VCM = V-
PSRR
Power-supply rejection
ratio
VS = 1.8 V to 3.3 V, VCM = V-
TA = –40°C to 125°C
1.5
1.6
µV
µV/°C
60
µV/V
2.4
V
INPUT VOLTAGE RANGE
VCM
Common-mode voltage
range
VS = 3.3V
CMRR
Common-mode rejection
ratio
(V–) ≤ VCM ≤ (V+) – 0.9 V, VS = 3.3V
0
80
98
dB
INPUT BIAS CURRENT
IB
Input bias current
VS = 1.8V
100
fA
IOS
Input offset current
VS = 1.8V
100
fA
Differential
Common mode
8
pF
3.8
pF
25
µVp-p
PRODUCT PREVIEW
INPUT IMPEDANCE
NOISE
En
Input voltage noise
ƒ = 0.1 Hz to 10 Hz
en
Input voltage noise
density
ƒ = 100 Hz
340
ƒ = 1 kHz
420
Open-loop voltage gain
(V–) + 0.3 V ≤ VO ≤ (V+) – 0.3 V, RL = 100 kΩ
135
VOH
Voltage output swing
from positive rail
VS = 1.8V, RL = 100 kΩ to V+/2
VOL
Voltage output swing
from negative rail
VS = 1.8V, RL = 100 kΩ to V+/2
ISC
Short-circuit current
Short to VS/2
ZO
Open loop output
impedance
ƒ = 1 KHz, IO = 0 A
nV/√Hz
OPEN-LOOP GAIN
AOL
dB
OUTPUT
10
6
mV
4
10
4.7
mA
94.5
kΩ
8
kHz
FREQUENCY RESPONSE
GBP
SR
Gain-bandwidth product
Slew rate (10% to 90%)
CL = 20 pF, RL = 10 MΩ, VS = 5V
G = 1, Rising Edge, CL = 20 pF, VS = 5V
1.8
G = 1, Falling Edge, CL = 20 pF, VS = 5V
1.7
V/ms
POWER
SUPPLY
IQ-LPV811
Quiescent Current, Per
Channel
VCM = V-, IO = 0, VS = 3.3V
450
540
IQ-LPV812
Quiescent Current, Per
Channel
VCM = V-, IO = 0, VS = 3.3V
425
495
nA
Copyright © 2016, Texas Instruments Incorporated
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LPV811, LPV812
SNOSD33 – AUGUST 2016
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7 Device and Documentation Support
7.1 Device Support
7.1.1 Development Support
TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti
DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm
TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm
TI FilterPro Filter Design software, http://www.ti.com/tool/filterpro
7.2 Documentation Support
7.2.1 Related Documentation
PRODUCT PREVIEW
For related documentation, see the following:
• AN-1798 Designing with Electro-Chemical Sensors, SNOA514
• AN-1803 Design Considerations for a Transimpedance Amplifier, SNOA515
• AN-1852 Designing With pH Electrodes, SNOA529
• Compensate Transimpedance Amplifiers Intuitively, SBOA055
• Transimpedance Considerations for High-Speed Operational Amplifiers, SBOA112
• Noise Analysis of FET Transimpedance Amplifiers, SBOA060
• Circuit Board Layout Techniques, SLOA089
• Handbook of Operational Amplifier Applications, SBOA092
7.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LPV811
Click here
Click here
Click here
Click here
Click here
LPV812
Click here
Click here
Click here
Click here
Click here
7.4 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
7.5 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
7.6 Trademarks
E2E is a trademark of Texas Instruments.
6
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
LPV811, LPV812
www.ti.com
SNOSD33 – AUGUST 2016
7.7 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
7.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
8 Mechanical, Packaging, and Orderable Information
PRODUCT PREVIEW
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2016, Texas Instruments Incorporated
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7
PACKAGE OPTION ADDENDUM
www.ti.com
10-Aug-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LPV811DBVR
PREVIEW
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LPV811DBVT
PREVIEW
SOT-23
DBV
5
250
TBD
Call TI
Call TI
-40 to 125
LPV812DGKR
PREVIEW
VSSOP
DGK
8
2500
TBD
Call TI
Call TI
-40 to 125
LPV812DGKT
PREVIEW
VSSOP
DGK
8
250
TBD
Call TI
Call TI
-40 to 125
PLPV811DBVT
PREVIEW
SOT-23
DBV
5
250
TBD
Call TI
Call TI
-40 to 125
PLPV812DGKT
PREVIEW
VSSOP
DGK
8
250
TBD
Call TI
Call TI
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Aug-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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