Diodes DMN3018SFG-13 30v n-channel enhancement mode mosfet Datasheet

DMN3018SFG
30V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(ON) max
ID max
TA = +25°C
21mΩ @ VGS = 10V
8.5A
V(BR)DSS
30V
Features and Benefits
Low RDS(ON) – ensures on state losses are minimized
Small form factor thermally efficient package enables higher
density end products
•
6.6A
35mΩ @ VGS = 4.5V
•
•
Occupies just 33% of the board area occupied by SO-8 enabling
Description
•
ESD Protected Gate
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
This MOSFET has been designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 standards for High Reliability
ideal for high efficiency power management applications.
Mechanical Data
Applications
•
•
•
•
Backlighting
Power Management Functions
DC-DC Converters
•
®
Case: POWERDI 3333-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
S
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminal Connections Indicator: See diagram
•
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe
Solderable per MIL-STD-202, Method 208 e3
•
Weight: 0.072 grams (approximate)
D
Pin 1
S
S
G
G
ESD PROTECTED
D
D
D
Gate Protection
Diode
D
Bottom View
Top View
S
Top View
Internal Schematic
Ordering Information (Note 4)
Part Number
DMN3018SFG-7
DMN3018SFG-13
Notes:
Case
®
POWERDI 3333-8
®
POWERDI 3333-8
Packaging
2000/Tape & Reel
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
YYWW
NEW PRODUCT
smaller end product
N38
DMN3018SFG
Document number: DS35638 Rev. 4 - 2
N38 = Product Type Marking Code
YYWW = Date Code Marking
YY = Last digit of year (ex: 11 = 2011)
WW = Week code (01 ~ 53)
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DMN3018SFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
t<10s
NEW PRODUCT
Continuous Drain Current (Note 6) VGS = 4.5V
Steady
State
t<10s
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
ID
Value
30
±25
8.5
6.8
ID
11.3
9.1
A
ID
6.6
5.3
A
8.7
7.0
2.5
60
18
16
ID
Maximum Continuous Body Diode Forward Current (Note 4)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Avalanche Current (Note 7) L = 0.1mH
Avalanche Energy (Note 7) L = 0.1mH
IS
IDM
IAS
EAS
Units
V
V
A
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Symbol
PD
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
t<10s
RθJA
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Value
1.0
126
71
2.2
56
31
7.0
-55 to 150
PD
Steady State
t<10s
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
RθJA
RθJC
TJ, TSTG
Units
W
°C/W
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
30
—
—
—
—
—
—
1
±10
V
μA
μA
VGS = 0V, ID = 250μA
VDS = 24V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
RDS(ON)
2.1
21
35
1.2
mΩ
VSD
1.7
16
21
—
V
Static Drain-Source On-Resistance
1
—
—
0.5
VDS = VGS, ID = 250μA
VGS = 10V, ID = 10A
VGS = 4.5V, ID = 8.5A
VGS = 0V, IS = 1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
Trr
Qrr
—
—
—
—
—
—
—
—
—
—
—
—
—
—
697
97
67
1.47
6.0
13.2
2.2
1.8
4.3
4.4
20.1
4.1
7.3
7.9
—
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
ns
nC
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
V
Test Condition
VDS = 15V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V,f = 1.0MHz
VGS = 10V, VDS = 15V,
ID = 9A
VDD = 15V, VGS = 10V,
RL = 15Ω,ID = 1A, RG = 6Ω
IF = 9A, di/dt = 500A/µs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
7. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
DMN3018SFG
Document number: DS35638 Rev. 4 - 2
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© Diodes Incorporated
DMN3018SFG
30.0
20
VGS = 3.5V
16
VGS = 10V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25.0
20.0
VGS = 4.5V
15.0
10.0
VGS = 3.0V
12
8
T A = 150°C
TA = 85°C
4
5.0
T A = 25°C
TA = 125°C
VGS = 2.5V
0.0
0
0.5
1
1.5
2
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
VGS = 4.5V
VGS = 10V
4
8
12
16
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
VGS = 10 V
ID = 10A
1.4
VGS = 4.5V
ID = 5A
1.2
1.0
0.8
0.6
-50
Document number: DS35638 Rev. 4 - 2
0.5
1
1.5
2
2.5
3
3.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
4
0.06
0.04
TA = 125°C
TA = 150°C
TA = 85°C
T A = 25°C
TA = -55°C
0.02
0
0
4
8
12
16
ID, DRAIN CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
20
0.08
0.06
0.04
VGS = 4.5V
ID = 5A
0.02
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
DMN3018SFG
0
VGS = 4.5V
20
1.6
TA = -55°C
0.08
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
VGS = 2.5V
0.01
0
0
3
0.1
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
VDS = 5.0V
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VGS = 10V
ID = 10A
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
April 2014
© Diodes Incorporated
DMN3018SFG
ID = 1mA
1.6
IS, SOURCE CURRENT (A)
VGS(th), GATE THRESHOLD VOLTAGE (V)
20
2.0
ID = 250µA
1.2
0.8
15
10
TA = 25°C
5
0.4
0
-50
0
-25
0
25
50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
1,000
Coss
100
0
0.2
0.4
0.6
0.8
1.0
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
10
Ciss
VGS GATE THRESHOLD VOLTAGE (V)
CT, JUNCTION CAPACITANCE (pF)
C rss
VDS = 15V
ID = 9A
8
6
4
2
f = 1MHz
10
0
5
10
15
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
2.4
20
0
0
2
4
6
8
10
12
14
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate Charge
16
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
RθJA = 127°C/W
Duty Cycle, D = t1/ t2
D = Single Pulse
0.001
0.0001
DMN3018SFG
Document number: DS35638 Rev. 4 - 2
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 11 Transient Thermal Resistance
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100
1000
April 2014
© Diodes Incorporated
DMN3018SFG
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
®
A
POWERDI 3333-8
Dim Min Max Typ
D
3.25 3.35 3.30
E
3.25 3.35 3.30
D2 2.22 2.32 2.27
E2 1.56 1.66 1.61
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3
0.203
−
−
b
0.27 0.37 0.32
b2
0.20
−
−
L
0.35 0.45 0.40
L1
0.39
−
−
e
0.65
−
−
Z
0.515
−
−
All Dimensions in mm
A3
A1
D
NEW PRODUCT
D2
1
Pin 1 ID
L
(4x)
4
b2
(4x)
E
E2
8
Z (4x)
5
e
L1
(3x)
b (8x)
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Dimensions
C
G
G1
Y
Y1
Y2
Y3
X
X2
X
G
Y2
8
5
G1
Y1
Y
1
4
Value (in mm)
0.650
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
Y3
X2
DMN3018SFG
Document number: DS35638 Rev. 4 - 2
C
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DMN3018SFG
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
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website, harmless against all damages.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
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labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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DMN3018SFG
Document number: DS35638 Rev. 4 - 2
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