IRF IRFH5406PBF Hexfet power mosfet Datasheet

PD -96299
IRFH5406PbF
HEXFET® Power MOSFET
VDS
60
V
14.4
mΩ
nC
RG (typical)
23
1.1
ID
40
A
RDS(on) max
(@VGS = 10V)
Qg (typical)
(@Tc(Bottom) = 25°C)
Ω
PQFN 5X6 mm
Applications
•
•
•
•
Secondary Side Synchronous Rectification
Inverters for DC Motors
DC-DC Brick Applications
Boost Converters
Features and Benefits
Features
Benefits
Low RDSon (< 14.4 mΩ)
Low Thermal Resistance to PCB (< 2.7°C/W)
100% Rg tested
Low Profile (<0.9 mm)
results in
⇒
Industry-Standard Pinout
Compatible with Existing Surface Mount Techniques
RoHS Compliant Containing no Lead, no Bromide and no Halogen
MSL1, Industrial Qualification
Lower Conduction Losses
Enables better thermal dissipation
Increased Reliability
Increased Power Density
Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier
Increased Reliability
Orderable part number
IRFH5406TRPBF
IRFH5406TR2PBF
Package Type
PQFN 5mm x 6mm
PQFN 5mm x 6mm
Standard Pack
Form
Quantity
Tape and Reel
4000
400
Tape and Reel
Note
Absolute Maximum Ratings
VDS
VGS
ID @ TA = 25°C
ID @ TA = 70°C
ID @ TC(Bottom) = 25°C
ID @ TC(Bottom) = 100°C
IDM
PD @TA = 25°C
PD @ TC(Bottom) = 25°C
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
TJ
TSTG
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Notes  through
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g
g
c
g
Max.
60
± 20
11
9
40
25
160
3.6
46
Units
0.029
-55 to + 150
W/°C
V
A
W
°C
are on page 8
1
04/12/10
IRFH5406PbF
Static @ TJ = 25°C (unless otherwise specified)
BVDSS
∆ΒVDSS/∆TJ
RDS(on)
VGS(th)
∆VGS(th)
IDSS
IGSS
gfs
Qg
Qgs1
Qgs2
Qgd
Qgodr
Qsw
Qoss
RG
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Output Charge
Min.
60
–––
–––
2.0
–––
–––
–––
–––
–––
27
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
0.07
11.4
–––
-8.6
–––
–––
–––
–––
–––
23
3.4
1.7
7.1
11
8.8
7.4
Conditions
Max. Units
–––
V VGS = 0V, ID = 250uA
––– V/°C Reference to 25°C, ID = 1.0mA
14.4 mΩ VGS = 10V, ID = 24A
4.0
V
VDS = VGS, ID = 50µA
––– mV/°C
VDS = 60V, VGS = 0V
20
µA
250
VDS = 60V, VGS = 0V, TJ = 125°C
VGS = 20V
100
nA
-100
VGS = -20V
–––
S VDS = 25V, ID = 24A
35
–––
VDS = 30V
VGS = 10V
–––
nC
–––
ID = 24A
–––
–––
–––
nC VDS = 16V, VGS = 0V
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
–––
–––
–––
–––
–––
1.1
5.4
8.7
12
3.5
1256
206
92
–––
–––
–––
–––
–––
–––
–––
–––
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Qgs2 + Qgd)
e
Ω
ns
pF
VDD = 30V, VGS = 10V
ID = 24A
RG=1.7Ω
VGS = 0V
VDS = 25V
ƒ = 1.0MHz
Avalanche Characteristics
EAS
IAR
Parameter
Single Pulse Avalanche Energy
Avalanche Current
c
Typ.
–––
–––
d
Units
mJ
A
Max.
45
24
Diode Characteristics
Parameter
Continuous Source Current
IS
ISM
VSD
trr
Qrr
ton
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min.
Typ.
–––
–––
Max. Units
40
A
c
–––
–––
160
Conditions
MOSFET symbol
showing the
integral reverse
D
G
p-n junction diode.
TJ = 25°C, IS = 24A, VGS = 0V
TJ = 25°C, IF = 24A, VDD = 30V
di/dt = 500A/µs
–––
–––
1.3
V
–––
20
30
ns
–––
74
111
nC
Time is dominated by parasitic Inductance
S
e
e
Thermal Resistance
RθJC (Bottom)
RθJC (Top)
RθJA
RθJA (<10s)
2
f
f
Junction-to-Case
Junction-to-Case
Junction-to-Ambient
Junction-to-Ambient
Parameter
g
g
Typ.
–––
–––
–––
–––
Max.
2.7
15
35
22
Units
°C/W
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IRFH5406PbF
VGS
15V
10V
8.00V
5.50V
5.00V
4.50V
4.00V
3.75V
ID, Drain-to-Source Current (A)
TOP
100
10
BOTTOM
1000
≤60µs PULSE WIDTH
Tj = 25°C
VGS
15V
10V
8.00V
5.50V
5.00V
4.50V
4.00V
3.75V
TOP
ID, Drain-to-Source Current (A)
1000
1
0.1
100
BOTTOM
10
3.75V
1
≤60µs PULSE WIDTH
3.75V
0.01
Tj = 150°C
0.1
0.1
1
10
100
0.1
V DS, Drain-to-Source Voltage (V)
100
Fig 2. Typical Output Characteristics
2.0
RDS(on) , Drain-to-Source On Resistance
(Normalized)
1000
ID, Drain-to-Source Current (A)
10
V DS, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
100
T J = 150°C
10
T J = 25°C
1
VDS = 25V
≤60µs PULSE WIDTH
2
3
4
5
6
7
8
9
ID = 24A
VGS = 10V
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.1
-60 -40 -20 0
10
Fig 4. Normalized On-Resistance Vs. Temperature
Fig 3. Typical Transfer Characteristics
100000
14
VGS = 0V,
f = 1 MHZ
C iss = C gs + C gd, C ds SHORTED
C rss = C gd
VGS, Gate-to-Source Voltage (V)
ID= 24A
C oss = C ds + C gd
10000
Ciss
1000
Coss
Crss
100
20 40 60 80 100 120 140 160
T J , Junction Temperature (°C)
VGS, Gate-to-Source Voltage (V)
C, Capacitance (pF)
1
12
VDS= 48V
VDS= 30V
VDS= 12V
10
8
6
4
2
0
10
1
10
100
VDS, Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance Vs.Drain-to-Source Voltage
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0
5
10
15
20
25
30
QG, Total Gate Charge (nC)
Fig 6. Typical Gate Charge Vs.Gate-to-Source Voltage
3
IRFH5406PbF
1000
1000
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
OPERATION IN THIS AREA
LIMITED BY RDS(on)
T J = 150°C
100
T J = 25°C
10
100
100µsec
10
1msec
10msec
1
Tc = 25°C
Tj = 150°C
Single Pulse
VGS = 0V
1.0
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.10
VSD, Source-to-Drain Voltage (V)
10
100
VDS, Drain-to-Source Voltage (V)
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
5.0
40
4.5
VGS(th), Gate threshold Voltage (V)
45
35
ID, Drain Current (A)
1
30
25
20
15
10
5
4.0
3.5
3.0
2.5
2.0
1.5
ID = 1.0A
ID = 1.0mA
ID = 250µA
ID = 50µA
1.0
0.5
0
25
50
75
100
125
-75 -50 -25
150
0
25
50
75 100 125 150
T J , Temperature ( °C )
T C , Case Temperature (°C)
Fig 9. Maximum Drain Current Vs.
Case (Bottom) Temperature
Fig 10. Threshold Voltage Vs. Temperature
Thermal Response ( Z thJC ) °C/W
10
1
D = 0.50
0.20
0.1
0.10
0.02
0.01
0.05
0.01
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case (Bottom)
4
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35
200
EAS , Single Pulse Avalanche Energy (mJ)
RDS(on), Drain-to -Source On Resistance (m Ω)
IRFH5406PbF
ID = 24A
30
25
TJ = 125°C
20
15
10
T J = 25°C
5
ID
TOP
3.1A
6.7A
BOTTOM 24A
150
100
50
0
4
6
8
10
12
14
16
18
20
25
50
75
100
125
150
Starting T J , Junction Temperature (°C)
VGS, Gate -to -Source Voltage (V)
Fig 13. Maximum Avalanche Energy vs. Drain Current
Fig 12. On-Resistance vs. Gate Voltage
V(BR)DSS
tp
15V
DRIVER
L
VDS
D.U.T
RG
+
V
- DD
IAS
20V
A
Fig 14a. Unclamped Inductive Test Circuit
VDS
VGS
RG
RD
Fig 14b. Unclamped Inductive Waveforms
VDS
90%
D.U.T.
+
-VDD
V10V
GS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1
Fig 15a. Switching Time Test Circuit
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I AS
0.01Ω
tp
10%
VGS
td(on)
tr
td(off)
tf
Fig 15b. Switching Time Waveforms
5
IRFH5406PbF
D.U.T
Driver Gate Drive
ƒ
+
‚
-
-
„
*
D.U.T. ISD Waveform
Reverse
Recovery
Current
+

RG
•
•
•
•
dv/dt controlled by RG
Driver same type as D.U.T.
ISD controlled by Duty Factor "D"
D.U.T. - Device Under Test
P.W.
Period
VGS=10V
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
-
D=
Period
P.W.
+
V DD
+
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
Re-Applied
Voltage
-
Body Diode
VDD
Forward Drop
Inductor Curent
ISD
Ripple ≤ 5%
* VGS = 5V for Logic Level Devices
Fig 16. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET® Power MOSFETs
Id
Vds
Vgs
L
DUT
0
1K
S
VCC
Vgs(th)
Qgs1 Qgs2
Fig 17. Gate Charge Test Circuit
6
Qgd
Qgodr
Fig 18. Gate Charge Waveform
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IRFH5406PbF
PQFN 5x6 Outline "B" Package Details
For footprint and stencil design recommendations, please refer to application note AN-1154 at
http://www.irf.com/technical-info/appnotes/an-1154.pdf
PQFN 5x6 Outline "B" Part Marking
INTERNATIONAL
RECTIFIER LOGO
DATE CODE
ASSEMBLY
SITE CODE
(Per SCOP 200-002)
PIN 1
IDENTIFIER
XXXX
XYWWX
XXXXX
PART NUMBER
(“4 or 5 digits”)
MARKING CODE
(Per Marking Spec)
LOT CODE
(Eng Mode - Min last 4 digits of EATI#)
(Prod Mode - 4 digits of SPN code)
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/
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7
IRFH5406PbF
PQFN 5x6 Outline "B" Tape and Reel
Qualification information†
Qualification level
Moisture Sensitivity Level
Indus trial
(per JE DE C JE S D47F
PQFN 5mm x 6mm
RoHS compliant
†
††
†††
††
†††
guidelines )
MS L1
†††
(per JE DE C J-S T D-020D
)
Yes
Qualification standards can be found at International Rectifier’s web site
http://www.irf.com/product-info/reliability
Higher qualification ratings may be available should the user have such requirements.
Please contact your International Rectifier sales representative for further information:
http://www.irf.com/whoto-call/salesrep/
Applicable version of JEDEC standard at the time of product release.
Notes:
 Repetitive rating; pulse width limited by max. junction temperature.
‚ Starting TJ = 25°C, L = 0.156mH, RG = 50Ω, IAS = 24A.
ƒ Pulse width ≤ 400µs; duty cycle ≤ 2%.
„ Rθ is measured at TJ of approximately 90°C.
When mounted on 1 inch square 2 oz copper pad on 1.5x1.5 in. board of FR-4 material.
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.04/2010
8
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