Material Content Data Sheet Sales Product Name TLE4309G MA# MA000722704 Package PG-TO263-7-1 Issued 28. August 2013 Weight* 1566.75 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 3.611 0.23 0.810 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.23 2305 2305 517 0.243 0.02 808.613 51.61 51.68 516109 155 516782 0.171 0.01 0.01 109 109 1.257 0.08 802 57.832 3.69 569.518 36.35 40.12 363503 401217 13.037 0.83 0.83 8321 8321 0.212 0.01 0.001 0.00 0.127 0.01 0.102 0.01 4.867 0.31 0.032 0.00 0.106 0.01 106.210 6.78 36912 136 0.01 1 65 0.33 3106 2. 3. 68 6.79 67790 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3252 20 Important Remarks: 1. 136 81 67878 1000000