Diodes DMTH6010LPDQ-13 Dual n-channel enhancement mode mosfet Datasheet

DMTH6010LPDQ
60V 175°C DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
ADVANCE INFORMATION
ADVANCED INFORMATION

BVDSS
RDS(ON) max
60V
11mΩ @ VGS = 10V
16mΩ @ VGS = 4.5V
ID max
TC = +25°C
47.6A
39.5A

Description and Applications
This MOSFET is designed to meet the stringent requirements of
Automotive applications. It is qualified to AEC-Q101, supported by a
PPAP and is ideal for use in:










Rated to +175°C – Ideal for High Ambient Temperature
Environments
100% Unclamped Inductive Switching – ensures more reliable
and robust end application
High Conversion Efficiency
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Mechanical Data
Engine Management Systems
Body Control Electronics
DCDC Converters





Case: PowerDI5060-8 (Type C)
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish  Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)
S1
D1
G1
D1
S2
D2
G2
D2
G2
G1
S2
S1
Pin1
Top View
D2
D1
Pin out
Top View
Bottom View
Equivalent Circuit
Ordering Information (Note 5)
Part Number
DMTH6010LPDQ-13
Notes:
Case
PowerDI5060-8 (Type C)
Packaging
2,500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
D1
D1
D2
D2
= Manufacturer’s Marking
H6010LD = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 16 = 2016)
WW = Week (01 to 53)
H6010LD
YY WW
S1
DMTH6010LPDQ
Document number: DS38517 Rev. 2 - 2
G1
S2
G2
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DMTH6010LPDQ
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
ADVANCE INFORMATION
ADVANCED INFORMATION
Drain-Source Voltage
VDSS
Gate-Source Voltage
Value
60
Unit
V
VGSS
±20
V
Continuous Drain Current (Note 7)
TC = +25°C
TC = +100°C
ID
47.6
33.7
A
Continuous Drain Current (Note 6)
TA = +25°C
TA = +70°C
ID
13.1
10.9
A
90
A
31
A
20
mJ
Value
2.8
53
37.5
4
-55 to +175
Unit
W
°C/W
W
°C/W
°C
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 7)
IDM
IS
Avalanche Current, L = 0.1mH
IAS
Avalanche Energy, L = 0.1mH
EAS
A
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
TA = +25°C
TC = +25°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Symbol
Min
Typ
Max
Unit
BVDSS
60
—
—
—
—
1
V
µA
VGS = 0V, ID = 1mA
IDSS
IGSS
—
—
±100
nA
VGS = ±20V, VDS = 0V
1
—
8.5
3
V
—
11
VDS = VGS, ID = 250μA
VGS = 10V, ID = 20A
—
10.9
16
VSD
—
0.9
1.2
V
Ciss
—
2615
—
pF
Coss
—
1415
—
pF
Crss
—
58
—
Rg
Qg
—
—
0.67
20.3
—
—
pF
Ω
nC
VGS(TH)
RDS(ON)
mΩ
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Qg
—
40.2
—
nC
Qgs
—
5.9
—
nC
Gate-Drain Charge
Qgd
—
9.3
—
nC
Turn-On Delay Time
Turn-On Rise Time
tD(ON)
tR
—
—
5.7
—
—
ns
ns
Turn-Off Delay Time
tD(OFF)
—
—
ns
ns
8.8
20.8
tF
—
7.4
—
Body Diode Reverse Recovery Time
tRR
—
34.5
—
ns
Body Diode Reverse Recovery Charge
QRR
—
37.5
—
nC
Turn-Off Fall Time
Notes:
Test Condition
VDS = 48V, VGS = 0V
VGS = 4.5V, ID = 20A
VGS = 0V, IS = 20A
VDS = 30V, VGS = 0V,
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = 30V, ID = 20A
VDD = 30V, VGS = 10V,
ID = 20A, RG = 3Ω
IF = 20A, di/dt = 100A/μs
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
DMTH6010LPDQ
Document number: DS38517 Rev. 2 - 2
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DMTH6010LPDQ
50.0
30
VDS = 5V
45.0
VGS = 10.0V
25
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 4.5V
35.0
VGS = 4.0V
30.0
VGS = 3.5V
25.0
20.0
15.0
20
5.0
175oC
15
150oC
10
125oC
VGS = 3.0V
10.0
25oC
-55oC
VGS = 2.5V
0
0
0.5
1
1.5
2
2.5
3
1
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
0.014
0.012
VGS = 4.5V
0.01
0.008
VGS = 10.0V
0.006
0
5
1.5
2
2.5
3
3.5
4
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
85oC
5
0.0
10 15 20 25 30 35 40 45
ID, DRAIN-SOURCE CURRENT (A)
0.1
0.08
0.06
0.04
0.02
ID = 20A
0
50
0
4
8
12
16
VGS, GATE-SOURCE VOLTAGE (V)
20
Figure 4. Typical Transfer Characteristic
Figure 3. Typical On-Resistance vs Drain Current
and Gate Voltage
1.8
0.02
VGS = 4.5V
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ADVANCE INFORMATION
ADVANCED INFORMATION
40.0
175oC
0.018
150oC
0.016
125oC
0.014
85oC
0.012
0.01
25oC
0.008
-55oC
0.006
VGS = 10V, ID = 20A
1.6
1.4
1.2
VGS = 4.5V, ID = 20A
1
0.8
0.6
0
5
10
15
20
25
30
ID, DRAIN CURRENT(A)
Figure 5. Typical On-Resistance vs Drain Current
and Junction Temperature
DMTH6010LPDQ
Document number: DS38517 Rev. 2 - 2
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-50
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
May 2016
© Diodes Incorporated
0.016
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.02
VGS = 4.5V, ID = 20A
0.012
0.008
VGS = 10V, ID = 20A
0.004
2.5
2
ID = 1mA
1.5
ID = 250µA
1
0.5
0
-50
-50
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
-25
-25
0
25
75
100 125 150 175
10000
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
IS, SOURCE CURRENT (A)
50
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs Junction
Temperature
20
15
10
TJ = 175oC
TJ = 85oC
TJ = 150oC
5
TJ = 25oC
TJ = 125oC
f = 1MHz
Ciss
1000
Coss
100
Crss
10
TJ = -55oC
1
0
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs Current
0
1.5
5
10 15 20 25 30 35 40 45 50 55 60
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
100
10
RDS(ON)
Limited
9
ID, DRAIN CURRENT (A)
8
7
VGS (V)
ADVANCE INFORMATION
ADVANCED INFORMATION
DMTH6010LPDQ
6
5
4
VDS = 30V, ID = 20A
3
10
PW = 1µs
PW = 10µs
PW = 100µs
1
0.1
2
1
PW = 1ms
TJ(Max) = 175℃
TC = 25℃
Single Pulse
DUT on Infinite Heatsink
VGS = 10V
PW = 10ms
PW = 100ms
PW = 1s
0.01
0
0
5
10
15
20 25 30 35
Qg (nC)
Figure 11. Gate Charge
DMTH6010LPDQ
Document number: DS38517 Rev. 2 - 2
40
45
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0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
100
May 2016
© Diodes Incorporated
DMTH6010LPDQ
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
ADVANCED INFORMATION
1
D=0.7
D=0.5
D=0.9
D=0.3
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJC (t) = r(t) * RθJC
RθJC = 4℃/W
Duty Cycle, D = t1/t2
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMTH6010LPDQ
Document number: DS38517 Rev. 2 - 2
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DMTH6010LPDQ
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
ADVANCE INFORMATION
ADVANCED INFORMATION
PowerDI5060-8 (Type C)
D
D1
0(4x)
c
x
E1
A1
E
y
Seating Plane
e
1
01(4x)
Ø 1.000 Depth 0.07± 0.030
b1(8x)
DETAIL A
e/2
b(8x)
1
b2(2x)
D3
L
k
A
k1
E2
D2
L4
M
D2
La
DETAIL A
L1
PowerDI5060-8 (Type C)
Dim
Min
Max
Typ
A
0.90
1.10 1.00
A1
0
0.05 0.02
b
0.33
0.51 0.41
b1
0.300 0.366 0.333
b2
0.20
0.35 0.25
c
0.23
0.33 0.277
D
5.15 BSC
D1
4.85
4.95 4.90
D2
1.40
1.60 1.50
D3
3.98
E
6.15 BSC
E1
5.75
5.85 5.80
E2
3.56
3.76 3.66
e
1.27BSC
k
1.27
k1
0.56
L
0.51
0.71 0.61
La
0.51
0.71 0.61
L1
0.05
0.20 0.175
L4
0.125
M
3.50
3.71 3.605
x
1.400
y
1.900
θ
10°
12°
11°
θ1
6°
8°
7°
All Dimensions in m
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8 (Type C)
X4
8
Dimensions
X3
Y1
X2
Y2
Y3
G1
X1
Y(4x)
1
X
DMTH6010LPDQ
Document number: DS38517 Rev. 2 - 2
C
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Value
(in mm)
1.270
0.660
0.820
0.610
3.910
1.650
1.650
4.420
1.270
1.020
3.810
6.610
G
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DMTH6010LPDQ
ADVANCE INFORMATION
ADVANCED INFORMATION
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
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labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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