Diodes DMP6110SVT-13 P-channel enhancement mode mosfet Datasheet

DMP6110SVT
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(ON) Max
ID Max
TC = +25°C
105m @ VGS = -10V
-7.3A
130m @ VGS = -4.5V
-6.5A
V(BR)DSS
NEW PRODUCT
NEW PRODUCT
Features and Benefits
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
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
-60V
Mechanical Data
Description and Applications
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.



Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Backlighting
Power Management Functions
DC-DC Converters


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

Case: TSOT26
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminals: Finish  Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208 e3
Weight: 0.008 grams (Approximate)
D
TSOT26
D 1
6
D
D 2
5
D
G 3
4
S
G
S
Top View
Device Schematic
Equivalent Circuit
Case
TSOT26
TSOT26
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
Ordering Information (Note 4)
Part Number
DMP6110SVT-7
DMP6110SVT-13
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
P61 = Product Type Marking Code
YM or YM = Date Code Marking
Y or Y = Year (ex: C = 2015)
M = Month (ex: 9 = September)
Date Code Key
Year
Code
Month
Code
2015
C
Jan
1
2016
D
Feb
2
DMP6110SVT
Document number: DS37594 Rev. 2 - 2
Mar
3
2017
E
Apr
4
May
5
2018
F
Jun
6
1 of 7
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2019
G
Jul
7
Aug
8
2020
H
Sep
9
Oct
O
2021
I
Nov
N
Dec
D
April 2015
© Diodes Incorporated
DMP6110SVT
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TC = +25°C
TC = +70°C
NEW PRODUCT
NEW PRODUCT
Continuous Drain Current (Note 6) VGS = -10V
Maximum Body Diode Forward Current (Note 6)
Pulsed Drain Current (380µs Pulse, 1% Duty Cycle)
Avalanche Current (Note 7) L = 0.1mH
Repetitive Avalanche Energy (Note 7) L = 0.1mH
ID
Value
-60
±20
-7.3
-5.8
IS
IDM
IAS
EAS
-24
-19
18
Unit
V
V
A
A
A
A
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
TA = +25°C
TA = +70°C
Steady state
t<10s
TA = +25°C
TA = +70°C
Steady state
t<10s
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
PD
RJA
PD
RJA
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Value
1.2
0.75
105
60
1.8
1.1
69
39
Unit
W
°C/W
°C/W
W
°C/W
°C/W
RJC
15
°C/W
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-60






-1
100
V
µA
nA
VGS = 0V, ID = -250µA
VDS = -48V, VGS = 0V
VGS = ±16V, VDS = 0V
VGS(TH)
RDS(ON)
VSD



-0.7
-3
105
130
-1.2
V
Static Drain-Source On-Resistance
-1



V
VDS = VGS, ID = -250µA
VGS = -10V, ID = -4.5A
VGS = -4.5V, ID = -3.5A
VGS = 0V, IS = -1A
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR














969
57
44
13.7
8.2
17.2
3.0
3.1
4.4
23
34
42
13.2
6.18














pF
VDS = -30V, VGS = 0V, f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = -30V, ID = -12A
ns
VGS = -10V, VDS = -30V, RGEN = 3Ω,
ID = -12A
ns
nC
IS = -12A, dI/dt = 100A/μs
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -4.5V)
Total Gate Charge (VGS = -10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
mΩ
Test Condition
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
DMP6110SVT
Document number: DS37594 Rev. 2 - 2
2 of 7
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April 2015
© Diodes Incorporated
DMP6110SVT
20.0
20
VGS=-10V
18.0
16
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
14.0
VGS=-5.0V
12.0
VGS=-3.5V
10.0
8.0
6.0
VGS=-3.0V
4.0
VGS=-2.8V
14
12
10
8
6
4
125℃
2
85℃
25℃
-55℃
150℃
0
0.0
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
1
5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
0.14
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
VDS=-5V
18
VGS=-4.5V
2.0
0.12
0.1
VGS=-4.5V
0.08
VGS=-10V
0.06
0.04
0.02
1.5
2
2.5
3
3.5
4
4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
0.25
0.2
ID=-4.5A
0.15
0.1
0.05
ID=-3.5A
0
5
9
13
17
21
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
0
0.14
5
0.3
1
4
8
12
16
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
20
2
VGS=-10V
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
NEW PRODUCT
NEW PRODUCT
16.0
VGS=-4.0V
150℃
0.12
125℃
0.1
85℃
0.08
25℃
0.06
-55℃
0.04
0.02
1
3
5
7
9
11 13 15 17 19 21
ID, DRAIN CURRENT(A)
Figure 5. Typical On-Resistance vs. Drain Current and
Temperature
DMP6110SVT
Document number: DS37594 Rev. 2 - 2
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1.8
VGS=-10V, ID=-4.5A
1.6
1.4
1.2
VGS=-4.5V, ID=-3.5A
1
0.8
0.6
0.4
-50
-25
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
April 2015
© Diodes Incorporated
DMP6110SVT
2.2
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
0.12
VGS=-4.5V, ID=-3.5A
0.1
0.08
0.06
VGS=-10V, ID=-4.5A
0.04
2
1.8
ID=-1mA
1.6
ID=-250μA
1.4
1.2
1
0.8
0.02
-50
-25
0
25
50
75
100
125
-50
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
18
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
10000
16
IDSS, LEAKAGE CURRENT (nA)
IS, SOURCE CURRENT (A)
-25
100000
20
14
12
10
VGS=0V, TA=85℃
8
VGS=0V, TA=125℃
6
4
VGS=0V, TA=25℃
VGS=0V, TA=150℃
2
150℃
1000
125℃
100
85℃
10
1
25℃
0.1
VGS=0V, TA=-55℃
0.01
0
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
1.5
5
10
15
20
25
30
35
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Drain-Source Leakage Current vs.
Voltage
10
10000
f=1MHz
8
Ciss
1000
6
VGS (V)
CT, JUNCTION CAPACITANCE (pF)
NEW PRODUCT
NEW PRODUCT
0.14
100
VDS=-30V, ID=-12A
4
Coss
2
Crss
10
0
0
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 11. Typical Junction Capacitance
DMP6110SVT
Document number: DS37594 Rev. 2 - 2
40
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0
2
4
6
8
10
12
14
Qg (nC)
Figure 12. Gate Charge
16
18
April 2015
© Diodes Incorporated
DMP6110SVT
100
RDS(ON) Limited
PW =1ms
10
ID, DRAIN CURRENT (A)
NEW PRODUCT
NEW PRODUCT
PW =100μs
1
PW =10ms
PW =100ms
TJ(MAX)=150℃
PW =1s
TA=25℃
Single Pulse
PW =10s
DUT on 1*MRP board
DC
VGS= -10V
0.1
0.01
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 13. SOA, Safe Operation Area
100
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.5
D=0.9
D=0.3
D=0.7
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA(t)=r(t) * RθJA
RθJA=105℃/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
1E-05
DMP6110SVT
Document number: DS37594 Rev. 2 - 2
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 14. Transient Thermal Resistance
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100
1000
April 2015
© Diodes Incorporated
DMP6110SVT
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
D
NEW PRODUCT
NEW PRODUCT
e1
E
E1
L2
c
4x1
e
L

6x b
A
A2
A1
TSOT26
Dim Min Max Typ
A
1.00


A1 0.01 0.10

A2 0.84 0.90

D
2.90


E
2.80


E1
1.60


b
0.30 0.45

c
0.12 0.20

e
0.95


e1
1.90


L
0.30 0.50
L2
0.25


θ
0°
8°
4°
θ1
4°
12° 
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
C
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
Y (6x)
X (6x)
DMP6110SVT
Document number: DS37594 Rev. 2 - 2
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April 2015
© Diodes Incorporated
DMP6110SVT
IMPORTANT NOTICE
NEW PRODUCT
NEW PRODUCT
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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Copyright © 2015, Diodes Incorporated
www.diodes.com
DMP6110SVT
Document number: DS37594 Rev. 2 - 2
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© Diodes Incorporated
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