1 of 3 Creation Date : May 25, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3216X6S1V475M085AC TDK item description C3216X6S1V475MT**** Applications Commercial Grade Feature General General (Up to 50V) Series C3216 [EIA 1206] Status Production (Not Recommended for New Design) Size Length(L) 3.20mm ±0.20mm Width(W) 1.60mm ±0.20mm Thickness(T) 0.85mm ±0.15mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 1.00mm Min. 2.10mm to 2.50mm(Flow Soldering) Recommended Land Pattern (PA) 2.00mm to 2.40mm(Reflow Soldering) 1.10mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PB) 1.00mm to 1.20mm(Reflow Soldering) 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PC) 1.10mm to 1.60mm(Reflow Soldering) Electrical Characteristics Capacitance 4.7μF ±20% Rated Voltage 35VDC Temperature Characteristic X6S(±22%) Dissipation Factor (Max.) 5% Insulation Resistance (Min.) 106MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 25, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3216X6S1V475M085AC Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C3216X6S1V475M085AC ESR C3216X6S1V475M085AC Capacitance C3216X6S1V475M085AC C3216X6S1V475M085AC Temperature Characteristic C3216X6S1V475M085AC(No Bias) DC Bias Characteristic C3216X6S1V475M085AC(DC Bias = 17.5V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C3216X6S1V475M085AC(100kHz) C3216X6S1V475M085AC(500kHz) C3216X6S1V475M085AC(1MHz) Multilayer Ceramic Chip Capacitors C3216X6S1V475M085AC Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 25, 2017 (GMT)