AMMP-6545 18 to 40 GHz GaAs MMIC Sub-Harmonic Mixer in SMT Package Data Sheet Description Features Avago’s AMMP-6545 is an easy-to-use broadband sub-harmonic mixer, with the LO injected at half the frequency of that required by a conventional mixer. MMIC includes an 180° balanced diode based mixer. The MMIC is fabricated using PHEMT technology. The surface mount package allows elimination of “chip & wire” assembly for lower cost. This MMIC is a cost effective alternative to multi-chip solution that have higher loss and complex assembly. • • • • • • Applications Typical 18-30 GHz • • • • Microwave radio systems Satellite VSAT, DBS up/down link LMDS & Pt-Pt mmW long haul Broadband wireless access (including 802.16 and 802.20 WiMax) • WLL and MMDS loops Package Diagram LO NC NC IF 1 2 3 8 RF Frequency : 18-40 GHz LO Frequency : 9-20 GHz IF Frequency : DC-3.5 GHz 5x5 mm Surface Mount Package Suitable for Up and Down Conversion Diode Mixer Performance Conversion Loss IIP3 2LO-R Leakage 2LO-I Leakage 5 NC NC NC : : : : 13 dB +12 dBm -40 dBm -55 dBm Typical 30-40 GHz Conversion Loss IIP3 2LO-R Leakage 2LO-I Leakage NC NC IF 1 2 3 RF LO 6 11 dB +11 dBm -45 dBm -60 dBm Functional Block Diagram 4 7 : : : : x2 8 4 7 6 5 NC NC NC RF PIN 1 2 3 4 5 6 7 8 FUNCTION NC NC IF RF NC NC NC LO TOP VIEW PACKAGE BASE: GND Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) : 30V ESD Human Body Model (Class 0) :100V Refer to Avago Technologies Application Note A004R: Electrostatic Discharge, Damage and Control. Note: MSL Rating - Level 2A Electrical Specifications 1. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C. 2. Pre-assembly into package performance verified 100% on-wafer. 3. This final package part performance is verified by a functional test correlated to actual performance at one or more frequencies. 4. Specifications are derived from measurements in a 50 Ω test environment. Aspects of the amplifier performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise (Гopt) matching. 5. NF is measure on-wafer. Additional bond wires (-0.2nH) at Input could improve NF at some frequencies. Table 1. RF Electrical Characteristics TA=25°C, Zo=50 Ω, LO=+15dBm, IF=2GHz Parameter RF=18-30GHz, LO=9-15GHz RF=30-40GHz, LO=15-20GHz Min Min Conversion Loss, CL [1] Input Third Order Intercept, IIP3 [1] 10.5 Input Third Order Intercept, IIP3 [1] RF: 24-30GHz 8.5 RF: 18-24GHz Typ Max 11 12 Typ Max Unit 13 dB 11 12 dBm 11 12 dBm 2LO-R Leakage, 2LO-R -45 -40 -40 dBm 2LO-I Leakage, 2LO-I -60 -50 -55 dBm L-R Leakage, L-R -30 -35 dB L-I Leakage, L-I -35 -30 dB Comment Note: 1.Production RF tested at 21, 23 and 26 GHz in upconverter configuration All tested parameters are guaranteed with the following measurement accuracy: RF=18-24 GHz: ±0.8 dBm for RF-leakage, ±2.5 dBm for IF-leakage, ±1.2dB for Conversion Loss, ±0.5 dBm for IIP3 RF=24-30 GHz: ±0.8 dBm for RF-leakage, ±4.0 dBm for IF-leakage, ±0.6 dB for Conversion Loss, ±0.5 dBm for IIP3 Table 2. Recommended Operating Range 1. Ambient operational temperature TA = 25°C unless otherwise noted. 2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal Resistance at backside temperature (Tb) = 25°C calculated from measured data. Parameter Min. RF Frequency, RFfreq LO Frequency, LOfreq Typical Max. Unit 18 40 GHz 9 20 GHz IF Frequency, IFfreq DC 3.5 GHz LO Power, LO +12 +22 dBm Min Ambient Operating Temp, Tmin -55 +15 Comments °C Max Ambient Operating Temp, Tmax +125 °C Max. Unit Comments 25 dB +150 °C 260 °C Absolute Minimum and Maximum Ratings Table 3. Minimum and Maximum Ratings Pin Min. RF CW Input Power, Pin Storage Temperature, Tstg Maximum Assembly Temperature, Tmax -65 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. 2 20 second maximum AMMP-6545 Typical Performance (TA = 25°C, Zin = Zout = 50 Ω), IF Freq = 2 GHz, LO Power = +15 dBm unless noted) UP-CONVERTER TYP. PERFORMANCE 7 9 11 15 IIP3 (dBm) C.L. (dB) 13 LO = +13 (dB) LO = +15 (dB) LO = +17 (dB) LO = +19 (dB) LO = +20 (dB) 17 19 21 23 25 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 UP-CONVERTER TYP. PERFORMANCE 28 LO = +13 dBm 26 LO = +15 dBm 24 LO = +17 dBm LO = +19 dBm 22 LO = +20 dBm 20 18 16 14 12 10 8 6 4 2 0 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 RF FREQUENCY (GHz) RF FREQUENCY (GHz) Figure 1. Up-conversion loss at LO = +13 to +20 dBm (high side LO) Figure 2. Up-conversion IIP3 at LO = +13 to +20 dBm (high side LO) UP-CONVERTER TYP. PERFORMANCE 7 9 11 15 IIP3 (dBm) C.L. (dB) 13 LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +19 dBm LO = +20 dBm 17 19 21 23 25 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 UP-CONVERTER TYP. PERFORMANCE 28 LO = +13 dBm 26 LO = +15 dBm 24 LO = +17 dBm LO = +19 dBm 22 LO = +20 dBm 20 18 16 14 12 10 8 6 4 2 0 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 RF FREQUENCY (GHz) RF FREQUENCY (GHz) Figure 4. Up-conversion IIP3 at LO = +13 to +20 dBm (low side LO) Figure 3. Up-conversion loss at LO = +13 to +20 dBm (low side LO) DOWN-CONVERTER TYP. PERFORMANCE 7 9 11 15 LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +19 dBm LO = +20 dBm 17 19 21 23 25 18 IIP3 (dBm) C.L. (dB) 13 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) Figure 5. Down-conversion loss at LO = +13 to +20 dB (low side LO) 3 36 38 40 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 18 DOWN-CONVERTER TYP. PERFORMANCE LO = +13 dBm LO = +15 dBm LO = +17 dBm LO = +19 dBm LO = +20 dBm 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) Figure 6. Down-conversion IIP3 at LO = +13 to +20 dBm (low side LO) 36 38 40 AMMP-6545 Typical Performance -30 -40 -35 -45 LO = +12 dBm LO = +13 dBm LO = +14 dBm LO = +15 dBm LO = +16 dBm LO = +17 dBm -50 -40 -45 -50 -55 LO = +12 dBm LO = +13 dBm LO = +14 dBm LO = +15 dBm LO = +16 dBm LO = +17 dBm -60 -65 2LO-I LEAKAGE (dBm) 2*LO-R LEAKAGE (dBm) (TA = 25°C, Zin = Zout = 50 Ω), IF Freq = 2 GHz, LO Power = +15 dBm unless noted) -55 -60 -65 -70 -75 -80 -85 -70 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 -90 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 RF FREQUENCY (GHz) 2*LO FREQUENCY (GHz) Figure 8. 2*LO-I leakage at LO = +12 to +17 dBm 20 20 25 25 30 30 35 40 LO = +12 dBm LO = +13 dBm LO = +14 dBm LO = +15 dBm LO = +16 dBm LO = +17 dBm 45 50 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 LO FREQUENCY (GHz) Figure 9. L-R isolation at LO = +12 to +17dBm 4 L-I ISOLATION (dB) L-R ISOLATION (dB) Figure 7. 2*LO-R leakage at LO = +12 to +17 dBm LO = +12 dBm LO = +13 dBm LO = +14 dBm LO = +15 dBm LO = +16 dBm LO = +17 dBm 35 40 45 50 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 LO FREQUENCY (GHz) Figure 10. L-I isolation at LO = +12 to +17dBm Package Dimension, PCB Layout and Tape and Reel information Please refer to Avago Technologies Application Note 5520, AMxP-xxxx production Assembly Process (Land Pattern A). AMMP-6545 Part Number Ordering Information Part Number Devices per Container Container AMMP-6545-BLKG 10 Antistatic bag AMMP-6545-TR1G 100 7” Reel AMMP-6545-TR2G 500 7” Reel For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV02-0251EN AV02-1382EN - July 8, 2013