Microchip MCP73837-FCI/MF Advanced stand-alone li-ion/li-polymer battery charge management controller with autonomous ac adapter or usb port source selection Datasheet

MCP73837/8
Advanced Stand-Alone Li-Ion/Li-Polymer Battery Charge
Management Controller with Autonomous AC Adapter or
USB Port Source Selection
Features
Applications
• Highly Accurate Preset Voltage Regulation:
±0.5%
• Available Voltage Regulation Options:
- 4.20V, 4.35V, 4.4V or 4.5V
• Complete Linear Charge Management Controller:
- Autonomous Power Source Selection
- Integrated Pass Transistors
- Integrated Current Sense
- Integrated Reverse Discharge Protection
• Constant Current (CC)/Constant Voltage (CV)
Operation with Thermal Regulation
• Selectable USB Port Charge Current:
- Low: 1 Unit Load
- High: 5 Unit Loads
• Programmable AC Adapter Charge Current:
- 15 mA – 1000 mA
• Two-Charge Status Outputs
• Power-Good Monitor: MCP73837
• Timer Enable: MCP73838
• Automatic Recharge:
- Selectable Voltage Threshold
• Automatic End-of-Charge Control:
- Selectable Charge Termination Current Ratio
- Selectable Safety Timer Period
• Preconditioning of Deeply Depleted Cells – Can
Be Disabled
• Battery Cell Temperature Monitor
• UVLO (Undervoltage Lockout)
• Automatic Power-Down When Input Power Is
Removed
• Low-Dropout (LDO) Linear Regulator Mode
• Numerous Selectable Options Available for a
Variety of Applications:
- Refer to Section 1.0 “Electrical Characteristics” for Selectable Options
- Refer to the “Product Identification System”
for Standard Options
• Temperature Range: -40°C to 85°C
• Packaging:
- 10-Lead 3 mm x 3 mm DFN
- 10-Lead MSOP*
* Consult the factory for MSOP availability.
• Smart Phones and Personal Data Assistants
(PDA)
• Portable Media Players (PMP)
• Ultra Mobile Devices (UMD)
• Digital Cameras
• MP3 Players
• Bluetooth Headsets
• Handheld Medical Devices
• AC/USB Dual Source Li-Ion Battery Chargers
 2007-2015 Microchip Technology Inc.
Description
The MCP73837 and MCP73838 devices are fully
integrated linear Li-Ion/Li-Polymer battery chargers
with autonomous power source selection. Along with its
small physical size, the low number of external
components required makes the MCP73837/8 ideally
suitable for portable applications.
The MCP73837/8 automatically selects the USB port or
AC adapter as the power source for the system. For the
USB port powered systems, the MCP73837/8
specifically adheres to the current limits governed by
the USB specification. The host microcontroller can
select from two preset maximum charge current rates
of 100 mA (low-power USB port) or 500 mA
(high-power USB port). With an AC adapter providing
power to the system, an external resistor sets the magnitude of the system or charge current up to a
maximum of 1A.
The MCP73837/8 employs a constant current/constant
voltage
charge
algorithm
with
selectable
preconditioning and charge termination. The constant
voltage regulation is fixed with four available options:
4.20V, 4.35V, 4.40V or 4.50V, to accommodate the new
emerging battery charging requirements. The
MCP73837/8 limits the charge current, based on die
temperature, during high power or high ambient
conditions. This thermal regulation optimizes the
charge cycle time while maintaining the reliability of the
device .
The MCP73837/8 are fully specified over the ambient
temperature range of -40°C to +85°C.
The MCP73837/8 devices are available in either a
3 mm x 3 mm 10-lead DFN package or a 10-lead
MSOP package.
DS20002071C-page 1
MCP73837/8
Package Types
MCP73837/8
10-Lead MSOP
MCP73837/8
3 x 3 10-Lead DFN*
VAC
VAC
10 VBAT
1
10 VBAT
1
9 THERM
VUSB 2
9 THERM
8 PG (TE)
STAT1 3
8 PG (TE)
STAT2 4
7 PROG2
STAT2 4
7 PROG2
VSS 5
6 PROG1
VUSB 2
EP
11
STAT1 3
VSS
5
6 PROG1
*Includes Exposed Thermal Pad (EP); see Table 3-1.
Typical Applications
MCP73837 Typical Application
1
AC/DC Adapter
4.7 µF
2
USB Port
4.7 µF
1 k
1 k
1 k
3
4
8
VAC
VBAT
VUSB
THERM
STAT1
VSS
STAT2
PROG2
PG
PROG1
10
Thermistor
9
4.7 µF
Single
Li-Ion
Cell
5
7
Low Hi
6
RPROG
MCP73838 Typical Application
1
AC/DC Adapter
4.7 µF
2
USB Port
4.7 µF
1 K
1 K
3
4
5
VAC
VBAT
VUSB
THERM
STAT1
STAT2
VSS
TE
PROG2
PROG1
10
Thermistor
9
4.7 µF
Cell
8
Low
7
Hi
Low Hi
6
RPROG
DS20002071C-page 2
 2007-2015 Microchip Technology Inc.
MCP73837/8
Functional Block Diagram (MCP73837/8)
VOREG
Direction
Control
ȝ$
VUSB
VBAT
SENSEFET
G = 0.001
100mA/500mA
10k
2k
SENSEFET
G = 0.001
VOREG
Direction
Control
VAC
AC/USB
+
SENSEFET
G = 0.001
1k
VREF
Current
Limit
-
SENSEFET
G = 0.001
PROG1
AC/USB
Reference,
Bias, UVLO,
and SHDN
VOREG
+
VREF (1.21V)
CA
310k
111k
10k
+
UVLO
-
72.7k
-
Precondition
470.6k
+
48k
TERM
-
PROG2
+
CHARGE
STAT1
STAT2
Charge Control,
Timer,
and
Status Logic
6k
+
VA
-
157.3k
VOREG
+
LDO
PG (TE)
175k
+
HTVT
-
ȝ$
470.6k
THERM
+
LTVT
-
175k
121k
 2007-2015 Microchip Technology Inc.
1M
Vss
DS20002071C-page 3
MCP73837/8
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
VDDN.................................................................................7.0V
All Inputs and Outputs w.r.t. VSS ............. -0.3 to (VDD + 0.3)V
Maximum Junction Temperature, TJ ............Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins
Human Body Model (1.5 k in Series with 100 pF) ...... ≥4 kV
Machine Model (200 pF, No Series Resistance) .............300V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40°C to +85°C.
Typical values are at +25°C, VDD = [VREG (typical) + 1.0V].
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage
VDD
VREG(Typ)
+0.3V
—
6
V
Supply Current
ISS
—
1900
3000
µA
Charging
—
—
110
300
µA
Charge Complete, No Battery
Supply Input
(1)
75
100
µA
Standby (PROG Floating)
0.6
5
µA
Shutdown (VDD ≤ VBAT – 100 mV
or VDD < VSTOP)
UVLO Start Threshold
VSTART
3.35
3.45
3.55
V
VDD = Low to High (USB Port)
UVLO Stop Threshold
VSTOP
3.25
3.35
3.45
V
VDD = High to Low (USB Port)
VHYS
—
75
—
mV
UVLO Start Threshold
VSTART
4.1
4.15
4.3
V
(AC Adapter)
UVLO Stop Threshold
VSTOP
4.0
4.1
4.2
V
(AC Adapter)
UVLO Hysteresis
VHYS
—
55
—
mV
(AC Adapter)
VREG
4.179
4.20
4.221
V
—
4.328
4.35
4.372
V
IOUT = 30 mA
4.378
4.40
4.422
V
TA = -5°C to +55°C
UVLO Hysteresis
(USB Port)
Voltage Regulation (Constant Voltage Mode)
Regulated Charge Voltage
VDD = [VREG(typical) + 1V]
4.477
4.50
4.523
V
VRTOL
-0.5
—
+0.5
%
Line Regulation
VBAT/VBAT)
/VDD|
—
0.075
0.2
%/V
Load Regulation
VBAT/VBAT|
—
0.150
0.3
%
IOUT = 10 mA to 100 mA
VDD = [VREG(typical)+1V]
PSRR
—
60
—
dB
IOUT = 10 mA, 10Hz to 1 kHz
—
—
52
—
dB
IOUT = 10 mA, 10Hz to 10 kHz
—
23
—
dB
IOUT = 10 mA, 10Hz to 1 MHz
Regulated Charge Voltage
Tolerance
Supply Ripple Attenuation
TA = -5°C to +55°C
VDD = [VREG(typical)+1V] to 6V
IOUT = 30 mA
Current Regulation (Fast Charge Constant-Current Mode)
AC Adapter Fast Charge Current
IREG
95
105
115
mA
PROG1 = 10 k
—
900
1000
1100
mA
PROG1 = 1 k(2)
TA = -5°C to +55°C
The supply voltage (VDD) = VAC when input power source is from AC adapter and the supply voltage (VDD) = VUSB
when input power source is from the USB port.
2: The value is guaranteed by design and not production tested.
3: The current is based on the ratio of selected current regulation (IREG).
The maximum charge impedance has to be less than shutdown impedance for normal operation.
Note 1:
DS20002071C-page 4
 2007-2015 Microchip Technology Inc.
MCP73837/8
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40°C to +85°C.
Typical values are at +25°C, VDD = [VREG (typical) + 1.0V].
Parameters
USB port Fast Charge Current
Maximum Output Current Limit
Sym.
Min.
Typ.
Max.
Units
IREG
80
90
100
mA
PROG2 = Low
Conditions
—
400
450
500
mA
PROG2 = High
TA = -5°C to +55°C
IMAX
—
1200
—
mA
PROG1 < 833
12.5
%
(3)
TA = -5°C to +55°C
Precondition Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current Ratio
IPREG/IREG
—
Precondition Current Threshold
Ratio
7.5
10
15
20
25
%
30
40
50
%
—
100
—
%
VPTH/VREG
64
66.5
69
%
VBAT Low to High
—
69
71.5
74
%
VPHYS
—
120
—
mV
ITERM/IREG
3.75
5
6.25
%
PROG1 = 1 kto 10 k
—
5.6
7.5
9.4
%
TA = -5°C to +55°C
7.5
10
12.5
%
(3)
15
20
25
%
VRTH/VREG
92
94.0
96
%
VBAT High to Low
—
95
97
99
%
TA = -5°C to +55°C
RDSON
—
350
—
m
VDD = 4.5V, TJ = +105°C
IDISCHARGE
—
0.1
2
µA
Standby (PROG1 or PROG2
Floating)
—
—
0.55
2
µA
Shutdown (VDD ≤ VBAT -100 mV
or VDD < VSTOP)
—
-6
-15
µA
Charge Complete
mA
Precondition Hysteresis
VBAT High to Low
Charge Termination
Charge Termination Current Ratio
Automatic Recharge
Recharge Voltage Threshold Ratio
Pass Transistor ON-Resistance
ON-Resistance
Battery Discharge Current
Output Reverse Leakage Current
Status Indicators – STAT1, STAT2, PG (MCP73837)
Sink Current
ISINK
—
16
35
Low Output Voltage
VOL
—
0.3
1
V
ISINK = 4 mA
Input Leakage Current
ILK
—
0.03
1
µA
High Impedance, VDD on pin
Charge Impedance Range
RPROG
1
—
—
k
(4)
Shutdown Impedance
RPROG
70
—
200
k
Minimum Impedance for
Shutdown
Input High Voltage Level
VIH
0.8VDD
—
—
%
Input Low Voltage Level
VIL
—
—
0.2VDD
%
Shutdown Voltage Level
VSD
0.2VDD
—
0.8VDD
%
Input Leakage Current
ILK
—
7
15
µA
PROG1 Input (PROG1)
PROG2 Inputs (PROG2)
VPROG2 = VDD
The supply voltage (VDD) = VAC when input power source is from AC adapter and the supply voltage (VDD) = VUSB
when input power source is from the USB port.
2: The value is guaranteed by design and not production tested.
3: The current is based on the ratio of selected current regulation (IREG).
The maximum charge impedance has to be less than shutdown impedance for normal operation.
Note 1:
 2007-2015 Microchip Technology Inc.
DS20002071C-page 5
MCP73837/8
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40°C to +85°C.
Typical values are at +25°C, VDD = [VREG (typical) + 1.0V].
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
VIH
2
—
—
V
Input Low Voltage Level
VIL
—
—
0.8
V
Input Leakage Current
ILK
—
0.01
1
µA
VTE = VDD
ITHERM
47
50
53
µA
2 k < RTHERM < 50 k
VT1
1.20
1.23
1.26
V
VT1 Low to High
Timer Enable (TE)
Input High Voltage Level
Thermistor Bias
Thermistor Current Source
Thermistor Comparator
Upper Trip Threshold
Upper Trip Point Hysteresis
VT1HYS
—
-40
—
mV
VT2
0.235
0.250
0.265
V
VT2HYS
—
40
—
mV
VIH
—
—
VDD – 0.1
V
THERM Input Sink Current
ISINK
3
5.5
20
µA
Stand-by or System Test Mode
Bypass Capacitance
CBAT
1
4.7
—
—
µF
µF
IOUT < 250 mA
IOUT > 250 mA
Lower Trip Threshold
Lower Trip Point Hysteresis
VT2 High to Low
System Test (LDO) Mode
Input High Voltage Level
Automatic Power Down (SLEEP Comparator, Direction Control)
Automatic Power Down Entry
Threshold
Automatic Power Down Exit
Threshold
VPD
VBAT +
10 mV
VBAT +
100 mV
—
V
2.3V ≤ VBAT ≤ VREG
VDD Falling
VPDEXIT
—
VBAT +
150 mV
VBAT +
250 mV
V
2.3V ≤ VBAT ≤ VREG
VDD Rising
TSD
—
150
—
C
TSDHYS
—
10
—
C
Thermal Shutdown
Die Temperature
Die Temperature Hysteresis
Note 1:
The supply voltage (VDD) = VAC when input power source is from AC adapter and the supply voltage (VDD) = VUSB
when input power source is from the USB port.
2: The value is guaranteed by design and not production tested.
3: The current is based on the ratio of selected current regulation (IREG).
The maximum charge impedance has to be less than shutdown impedance for normal operation.
DS20002071C-page 6
 2007-2015 Microchip Technology Inc.
MCP73837/8
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typical) + 0.3V] to 6V.
Typical values are at +25°C, VDD = [VREG (typical) + 1.0V] .
Parameters
Sym.
Min.
Typ.
Max.
Units
tSTART
—
—
5
ms
VDD Low to High
tDELAY
—
—
10
ms
VBAT < VPTH to VBAT > VPTH
tRISE
—
—
10
ms
IOUT Rising to 90% of IREG
Precondition Comparator Filter Time
tPRECON
0.4
1.3
3.2
ms
Average VBAT Rise/Fall
Termination Comparator Filter Time
tTERM
0.4
1.3
3.2
ms
Average IOUT Falling
Charge Comparator Filter Time
tCHARGE
0.4
1.3
3.2
ms
Average VBAT Falling
Thermistor Comparator Filter Time
tTHERM
0.4
1.3
3.2
ms
Average THERM Rise/Fall
tELAPSED
0
0
0
Hours
—
3.6
4.0
4.4
Hours
—
5.4
6.0
6.6
Hours
—
7.2
8.0
8.8
Hours
Status Output Turn-off
tOFF
—
—
500
µs
ISINK = 1 mA to 0 mA
Status Output Turn-on
tON
—
—
500
µs
ISINK = 0 mA to 1 mA
UVLO Start Delay
Conditions
Current Regulation
Transition Time Out of Precondition
Current Rise Time Out of Precondition
Elapsed Timer
Elapsed Timer Period
Timer Disabled
Status Indicators
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 6V.
Typical values are at +25°C, VDD = [VREG (typ.) + 1.0V] .
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Specified Temperature Range
TA
-40
—
+85
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 10-Lead MSOP
JA
—
113
—
°C/W
4-Layer JC51-7 Standard Board,
Natural Convection(1)
Thermal Resistance, 10-Lead 3 x 3 DFN
JA
—
41
—
°C/W
4-Layer JC51-7 Standard Board,
Natural Convection
Temperature Ranges
Thermal Package Resistances
Note 1:
This represents the minimum copper condition on the Printed Circuit Board (PCB).
 2007-2015 Microchip Technology Inc.
DS20002071C-page 7
MCP73837/8
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
TEMP = 25°C
IOUT = 50 mA
IOUT = 10 mA
IOUT = 100 mA
IOUT = 500 mA
IOUT = 1000 mA
4.5
4.8
5.0
5.3
5.5
Supply Voltage (V)
5.8
Battery Regulation Voltage (V)
4.205
IOUT = 10 mA
VDD = 5.2V
IOUT = 50 mA
4.200
4.195
IOUT = 100 mA
4.190
IOUT = 500 mA
4.185
4.180
IOUT = 1000 mA
4.175
4.170
Battery Voltage (V)
FIGURE 2-3:
Output Leakage Current
(IDISCHARGE) vs. Battery Regulation Voltage
(VBAT).
DS20002071C-page 8
1.2
0.8
0.4
0.0
10 20 30 40 50 60 70 80
Temperature (°C)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
VDD = Floating
TEMP = +25°C
Battery Voltage (V)
FIGURE 2-5:
Output Leakage Current
(IDISCHARGE) vs. Battery Voltage (VBAT).
VDD = VBAT
TEMP = 25 °C
3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2
1.6
3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2
IREG (mA)
Output Leakage Current (µA)
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
VDD = Floating
VBAT = 4.2V
FIGURE 2-4:
Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature (°C)
FIGURE 2-2:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
2.0
-40 -30 -20 -10 0
6.0
FIGURE 2-1:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
4.210
Output Leakage Current (µA)
4.210
4.205
4.200
4.195
4.190
4.185
4.180
4.175
4.170
4.165
4.160
Output Leakage Current (µA)
Battery Regulation Voltage (V)
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA, and TA= +25°C, Constant-voltage mode.
1000
900
800
700
600
500
400
300
200
100
0
VDD = 5.2V
Temp = 25°C
1
6 11 16 21 26 31 36 41 46 51 56 61
RPROG (kΩ)
FIGURE 2-6:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
 2007-2015 Microchip Technology Inc.
MCP73837/8
1200
1150
1100
1050
1000
950
900
850
800
750
700
RPROG = 1 kΩ
Temp = +25°C
4.5
4.8
5.0
5.3
5.5
Supply Voltage (V)
5.8
100
98
96
94
92
RPROG = 10 kΩ
VDD = 5.2V
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature (°C)
FIGURE 2-10:
Charge Current (IOUT) vs.
Ambient Temperature (TA).
Charge Current (mA)
Charge Current (mA)
RPROG = 10 kΩ
Temp = +25°C
102
110
108
106
104
102
100
98
96
94
92
90
6.0
FIGURE 2-7:
Charge Current (IOUT) vs.
Supply Voltage (VDD).
104
Charge Current (mA)
Charge Current (mA)
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA and TA= +25°C, Constant-voltage mode.
90
55
54
53
52
51
50
49
48
47
46
45
RPROG = 20 kΩ
VDD = 5.2V
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature (°C)
FIGURE 2-8:
Charge Current (IOUT) vs.
Supply Voltage (VDD).
FIGURE 2-11:
Charge Current (IOUT) vs.
Ambient Temperature (TA).
Ambient Temperature (°C)
FIGURE 2-9:
Charge Current (IOUT) vs.
Ambient Temperature (TA).
 2007-2015 Microchip Technology Inc.
155
145
135
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
125
700
115
750
105
800
95
850
85
900
75
950
RPROG = 1 kΩ
65
Charge Current (mA)
1000
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
55
RPROG = 1 kΩ
VDD = 5.2V
1050
45
1100
5.8
35
5.0
5.3
5.5
Supply Voltage (V)
25
4.8
Charge Current (mA)
6.0
4.5
Junction Temperature (°C)
FIGURE 2-12:
Charge Current (IOUT) vs.
Junction Temperature (TJ).
DS20002071C-page 9
MCP73837/8
52.0
51.5
51.0
50.5
50.0
49.5
49.0
48.5
48.0
47.5
47.0
90
80
70
60
50
40
30
20
0
FIGURE 2-16:
Thermistor Current (ITHERM)
vs. Ambient Temperature (TA).
0
RPROG = 10 kΩ
Attenuation (dB)
-10
IOUT = 10 mA
COUT = 4.7 µF
-20
-30
-40
-50
-70
0.01
155
145
135
125
115
105
95
85
75
65
55
45
35
25
-60
0.1
1
FIGURE 2-14:
Charge Current (IOUT) vs.
Junction Temperature (TJ).
52.0
51.5
51.0
50.5
50.0
49.5
49.0
48.5
48.0
47.5
47.0
10
100
1000
Frequency (kHz)
Junction Temperature (°C)
FIGURE 2-17:
Power Supply Ripple
Rejection (PSRR).
0
Temp = +25°C
-10
Attenuation (dB)
Thermistor Current (mA)
10
-10
Ambient Temperature (°C)
FIGURE 2-13:
Charge Current (IOUT) vs.
Junction Temperature (TJ).
Charge Current (mA)
-20
Junction Temperature (°C)
120
110
100
90
80
70
60
50
40
30
20
10
0
VDD = 5.2V
-30
Thermistor Current (mA)
155
145
135
125
115
95
105
85
75
65
55
45
35
RPROG = 2 kΩ
-40
600
550
500
450
400
350
300
250
200
150
100
50
0
25
Charge Current (mA)
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA and TA= +25°C, Constant-voltage mode.
IOUT = 100 mA
COUT = 4.7 µF
-20
-30
-40
-50
-60
4.5
4.8
5.0
5.3
5.5
Supply Voltage (V)
5.8
6.0
FIGURE 2-15:
Thermistor Current (ITHERM)
vs. Supply Voltage (VDD).
DS20002071C-page 10
-70
0.01
0.1
1
10
100
1000
Frequency (kHz)
FIGURE 2-18:
Power Supply Ripple
Rejection (PSRR).
 2007-2015 Microchip Technology Inc.
MCP73837/8
-0.5
700
600
500
400
300
200
100
0
-100
-200
Time (Minutes)
Time (µs)
FIGURE 2-19:
Line Transient Response.
FIGURE 2-22:
Load Transient Response.
0.1
VOUT
14
0
12
-0.1
10
8
-0.2
VIN
6
-0.3
4
-0.4
2
VIN
Output Ripple (V)
16
Input Source (V)
0.1
0.05
0
-0.05
-0.1
-0.15
-0.2
-0.25
-0.3
1.6E-03
0
1.4E-03
IOUT = 100 mA
-4.0E-04
-0.4
2
1.2E-03
4
IOUT
1.0E-03
-0.3
8.0E-04
-0.2
VIN
6
6.0E-04
8
4.0E-04
-0.1
10
IOUT = 100 mA
VOUT
2.0E-04
12
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-0.1
0.0E+00
0
Output Ripple (V)
Input Source (V)
14
Output Current (A)
0.1
VOUT
-2.0E-04
16
Output Ripple (V)
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA and TA= +25°C, Constant-voltage mode.
VOUT
IOUT = 10 mA
0
-0.5
800
700
600
500
400
300
200
100
0
-100
-200
Time (µs)
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
-0.05
Line Transient Response.
0.04
0.02
0
-0.02
-0.04
-0.06
-0.08
-0.1
-0.12
IOUT = 10 mA
VOUT(AC)
IOUT
Output Ripple (V)
Output Current (A)
FIGURE 2-20:
FIGURE 2-23:
(IOUT = 1A).
VAC Start Delay
VIN
1.6E-03
1.4E-03
1.2E-03
1.0E-03
8.0E-04
6.0E-04
4.0E-04
2.0E-04
0.0E+00
-2.0E-04
-4.0E-04
VOUT
Time (Minutes)
FIGURE 2-21:
Load Transient Response.
 2007-2015 Microchip Technology Inc.
FIGURE 2-24:
(USB = Low).
VUSB Start Delay
DS20002071C-page 11
MCP73837/8
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA and TA= +25°C, Constant-voltage mode.
UVLOVAC
Battery Voltage (V)
VOUT
0.12
VOUT
0.1
4.0
0.08
3.0
0.06
IOUT
2.0
0.04
VDD = 5.2V
RPROG = USB_Low
180 mAh Li-Ion Battery
1.0
0.02
0.0
Charge Current (A)
5.0
VIN
0
0
20 40 60 80 100 120 140 160 180
Time (Minutes)
FIGURE 2-28:
Complete Charge Cycle
(180 mAh Li-Ion Battery).
Battery Voltage (V)
VOUT
4.0
1.2
5.0
1
4.0
0.8
3.0
IOUT
0.6
2.0
0.4
VDD = 5.2V
RPROG = 1 kΩ
1200 mAh Li-Ion Battery
1.0
0.06
C.V. Begins
2.0
0.04
VDD = 5.2V
RPROG = USB_Low
180 mAh Li-Ion Battery
1.0
0.02
0
0
1
2
3
4
5
6
7
8
9
10
Time (Minutes)
FIGURE 2-29:
Typical Charge Profile in
Preconditioning and CC-CV (180 mAh Li-Ion
Battery).
FIGURE 2-26:
Complete Charge Cycle
(1200 mAh Li-Ion Battery).
4.5
0.08
3.0
0.0
0
Time (Minutes)
1.2
3.5
0.9
3.0
IOUT
2.5
0.6
2.0
1.5
VDD = 5.2V
RPROG = 1 kΩ
1200 mAh Li-Ion Battery
1.0
0.5
0.3
0.0
Charge Current (A)
VOUT
4.0
Battery Voltage (V)
0.1
IOUT
Preconditioning
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
0.0
0.2
0.12
VOUT
C.C. Begins
Battery Voltage (V)
5.0
Charge Current (A)
VUSB Start Delay
Charge Current (A)
FIGURE 2-25:
(USB = High)
0
0
1
2
3
4
5
6
7
8
9
10
Time (Minutes)
FIGURE 2-27:
Typical Charge Profile in
Thermal Regulation (1200 mAh Li-Ion Battery).
DS20002071C-page 12
 2007-2015 Microchip Technology Inc.
MCP73837/8
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Symbol I/O
Function
DFN-10
MSOP-10
1
1
VAC
I
AC Adapter Supply Input
2
2
VUSB
I
USB port Supply Input
3
3
STAT1
O
Charge Status Output 1 (Open-Drain)
4
4
STAT2
O
Charge Status Output 2 (Open-Drain)
—
Battery Management 0V Reference
3.1
5
5
VSS
6
6
PROG1
7
7
PROG2
I
Current Regulation Setting With USB Port; Precondition Set Point for USB
control.
8
8
PG
O
Available on MCP73837: Power-Good Status Output (Open-Drain)
8
8
TE
I
Available on MCP73838: Timer Enable; Enables Safety Timer (Active Low)
9
9
10
10
VBAT
11
—
EP
I/O Current Regulation Setting With AC Adapter; Device Charge Control Enable;
Precondition Set Point for AC control
THERM I/O Thermistor Monitoring Input and Bias current; System Test (LDO) Mode Input
I/O Battery Positive Input and Output Connection
—
EP (Exposed Thermal Pad)
There is an internal electrical connection between the exposed thermal pad
and VSS. The EP must be connected to the same potential as the VSS pin on
the PCB.
AC Adapter Supply Input (VAC)
A supply voltage of VREG + 0.3V to 6V from the AC/DC
wall-adapter is recommended. When both the AC
adapter and the USB port supply voltages are present
at the same time, the AC adapter dominates the regulated charge current with the maximum value of 1A.
Bypass to VSS, with a minimum of 4.7 µF, is
recommended.
3.2
USB Port Supply Input (VUSB)
A supply voltage of VREG + 0.3V to 6V from the USB
port is recommended. When no supply voltage from
VAC pin is available, the Li-Ion battery is charged
directly from USB port. Bypass to VSS, with a minimum
of 1 µF, is recommended.
3.3
Charge Status Output 1 (STAT1)
3.5
Battery Management 0V Reference
(VSS)
Connect to the negative terminal of the battery and
input supply.
3.6
AC Adapter Current Regulation
Set (PROG1)
The AC adapter constant charge current is set by
placing a resistor from PROG1 to VSS. PROG1 is the
set point of precondition and termination when the AC
adapter is present.
PROG1 also functions as device charge control
enable. The MCP73837/8 is shut down when an
impedance value greater than 70 k is applied to
PROG1. When PROG1 is floating, the MCP73837/8
enters into Stand-By mode.
STAT1 is an open-drain logic output for connection to a
LED for charge status indication. Alternatively, a pull-up
resistor can be applied for interfacing to a host
microcontroller.
3.4
Charge Status Output 2 (STAT2)
STAT2 is an open-drain logic output for connection to a
LED for charge status indication. Alternatively, a pull-up
resistor can be applied for interfacing to a host
microcontroller.
 2007-2015 Microchip Technology Inc.
DS20002071C-page 13
MCP73837/8
3.7
USB Port Current Regulation Set
(PROG2)
The MCP73837/8 USB port current regulation set input
(PROG2) is a digital input selection. A logic Low selects
a 1 unit load charge current; a logic High selects a 5
unit loads charge current. The precondition and termination current is internally set to the percentage levels
selected by the device part number. The current is
based on the selected unit load charge current, based
on the level of PROG2.
3.12
Exposed Thermal Pad (EP)
The 10-lead 3 x 3 mm DFN package has an exposed
metal pad on the bottom of the package. It gives the
device better thermal characteristics by providing a
good thermal path to a PCB ground plane.There is an
internal electrical connection between the EP and the
VSS pin; they must be connected to the same potential
on the PCB.
PROG2 also functions as the set point of termination
when the USB port is present. When PROG2 is floating, the MCP73837/8 enters into Stand-By mode.
3.8
Power Good (PG)
Power Good (PG) is available only on MCP73837. PG
is an open-drain logic output for connection to an LED
for input power supply indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
3.9
Timer Enable (TE)
Timer Enable (TE) is available only on MCP73838. TE
enables the built-in safety timer when it is pulled Low,
and disables the built-in safety timer when it is pulled
High.
Note:
3.10
The built-in safety timer is available for
both MCP73837 and MCP73838 in the
following options: Disable, 4 HR, 6 HR,
and 8 HR.
Battery Temperature Monitor
(THERM)
MCP73837/8 continuously monitors the battery
temperature during a charge cycle by measuring the
voltage between the THERM and VSS pins. An internal
50 µA current source provides the bias for the most
common 10 k negative-temperature coefficient
thermistors (NTC).
3.11
Battery Charge Control Output
(VBAT)
Connect to the positive terminal of Li-Ion/Li-Polymer
batteries. Bypass to VSS, with a minimum of 1 µF, to
ensure loop stability when the battery is disconnected.
DS20002071C-page 14
 2007-2015 Microchip Technology Inc.
MCP73837/8
4.0
DEVICE OVERVIEW
The MCP73837/8 devices are simple, yet fully integrated, linear charge management controllers. Figure 4-1 depicts
the operational flow algorithm.
SHUTDOWN MODE*
VDD  VBAT -100 mV
VDD < VSTOP
* Continuously Monitored
STAT1 = High Z
STAT2 = High Z
PG = High Z
SYSTEM TEST (LDO) MODE
VTHERM > (VDD -100 mV)
STAT1 = LOW
STAT2 = LOW
PG = LOW
Timer Suspended
STANDBY MODE *
VDD > (VREG + 100 mV)
PROG > 200 k
STAT1 = High Z
STAT2 = High Z
PG = LOW
VBAT < VPTH
PRECONDITIONING MODE
Charge Current = IPREG
STAT1 = LOW
STAT2 = High Z
PG = LOW
Timer Reset
VBAT > VPTH
FAST CHARGE MODE
Charge Current = IREG
STAT1 = LOW
STAT2 = High Z
PG = LOW
Timer Enabled
TEMPERATURE FAULT
No Charge Current
STAT1 = High Z
STAT2 = High Z
PG = LOW
Timer Suspended
VBAT > VPTH
Timer Expired
VBAT < VRTH
TIMER FAULT
No Charge Current
STAT1 = High Z
STAT2 = High Z
PG = LOW
Timer Suspended
VBAT = VREG
CONSTANT VOLTAGE MODE
Charge Voltage = VREG
STAT1 = LOW
STAT2 = High Z
PG = LOW
IBAT < ITERM
Timer Expired
CHARGE COMPLETE MODE
No Charge Current
STAT1 = High Z
STAT2 = LOW
PG = LOW
FIGURE 4-1:
Operational Algorithm.
 2007-2015 Microchip Technology Inc.
DS20002071C-page 15
MCP73837/8
4.1
Undervoltage Lockout (UVLO)
4.4
Preconditioning
An internal undervoltage lockout (UVLO) circuit
monitors the input voltage and keeps the charger in
Shutdown mode until the input supply rises above the
UVLO threshold. The UVLO circuitry has a built-in
hysteresis of 75 mV for the USB port and 55 mV for the
AC adapter.
If the voltage at the VBAT pin is less than the
preconditioning threshold, the MCP73837/8 enters a
preconditioning mode. The preconditioning threshold is
factory set.
In the event a battery is present when the input power
is applied, the input supply must rise 100 mV above the
battery voltage before MCP73837/8 becomes
operational.
In this mode, the MCP73837/8 supplies a percentage
of the charge current (established with the value of the
resistor connected to the PROG1 pin for AC mode,
established by PROG2 level for USB mode) to the battery. The percentage or ratio of the current is factory
set. Refer to Section 1.0 “Electrical Characteristics” for
preconditioning current options.
The UVLO circuit places the device in shutdown mode
if the input supply falls to within +100 mV of the battery
voltage.
Refer to Section 1.0 “Electrical Characteristics” for preconditioning threshold options.
The UVLO circuit is always active. If, at any time, the
input supply is below the UVLO threshold or within
+100 mV of the voltage at the VBAT pin, the
MCP73837/8 is placed in a Shutdown mode.
When the voltage at the VBAT pin rises above the
preconditioning threshold, the MCP73837/8 enters the
Constant Current or Fast Charge mode.
During any UVLO condition, the battery reverse
discharge current is less than 2 µA.
4.5
4.2
Autonomous Power Source
Selection
The MCP73837/8 devices are designed to select the
USB port or AC adapter as the power source
automatically. If the AC adapter input is not present, the
USB port is selected. If both inputs are available, the
AC adapter has first priority.
Constant Current Mode – Fast
Charge
During Constant Current mode, the programmed (AC
adapter) or selected (USB port) charge current is supplied to the battery or load.
For AC adapter, the charge current is established
using a single resistor from PROG1 to VSS. The
program resistor and the charge current are calculated
using the Equation 4-1.
EQUATION 4-1:
Note:
4.3
If the input power is switched during a
charge cycle, the power path switch-over
will be a break-before-make connection.
As a result, the charge current can
momentarily go to zero. The charge cycle
timer will remain continuous.
Charge Qualification
For a charge cycle to begin, all UVLO conditions must
be met and a battery or output load must be present.
A charge current programming resistor must be connected from PROG1 to VSS. If the PROG1 or PROG2
pin are open or floating, the MCP73837/8 is disabled
and the battery reverse discharge current is less than
2 µA. In this manner, the PROG1 pin acts as a charge
enable and can be used as a manual shutdown.
1000V
I REG = -------------------RPROG
Where:
RPROG
=
kilohm (k
IREG
=
milliampere (mA)
When charging from a USB port, the host
microcontroller has the option of selecting either a
one-unit-load or a five-unit-loads charge rate based on
the PROG2 input. A logic Low selects a one-unit-load
charge rate, a High selects a five-unit-loads charge
rate, and high impedance input suspends or disables
charging.
Note:
USB Specification Rev. 2.0 defines the
maximum absolute current for one unit
load is 100 mA. This value is not an
average over time and cannot be
exceeded.
Constant Current mode is maintained until the voltage
at the VBAT pin reaches the regulation voltage, VREG.
When constant current mode is invoked, the internal
timer is reset.
DS20002071C-page 16
 2007-2015 Microchip Technology Inc.
MCP73837/8
TIMER EXPIRED DURING
CONSTANT CURRENT – FAST
CHARGE MODE
If the internal timer expires before the recharge voltage
threshold is reached, a timer fault is indicated and the
charge cycle terminates. The MCP73837/8 remains in
this condition until the battery is removed, the input
battery is removed or the PROG1/2 pin is opened. If the
battery is removed or the PROG1/2 pin is opened, the
MCP73837/8 enters the Stand-by mode where it
remains until a battery is reinserted or the PROG1/2 pin
is reconnected. If the input power is removed, the
MCP73837/8 is in Shutdown. When the input power is
reapplied, a normal start-up sequence begins.
4.6
Constant Voltage Mode
When the voltage at the VBAT pin reaches the
regulation voltage, VREG, constant voltage regulation
begins. The regulation voltage is factory set to 4.20V,
4.35V, 4.40V, or 4.5V, with a tolerance of ± 0.5%.
4.9
Thermal Regulation
The MCP73837/8 limits the charge current based on
the die temperature. The thermal regulation optimizes
the charge cycle time while maintaining device
reliability. Figure 4-2 depicts the thermal regulation for
the MCP73837/8. Refer to Section 1.0 “Electrical
Characteristics” for thermal package resistances and
Section 6.1.1.3
“Thermal
Considerations”
for
calculating power dissipation.
.
1200
RPROG = 1 kΩ
1100
1000
Charge Current (mA)
4.5.1
900
800
700
600
500
400
300
200
100
0
25
4.7
35
45
Charge Termination
The charge cycle is terminated when, during constant
voltage mode, the average charge current diminishes
below a percentage of the programmed charge current,
or the internal timer has expired. A 1 ms filter time on
the termination comparator ensures that transient load
conditions do not result in premature charge cycle termination. The percentage or ratio of the current is factory set. The timer period is factory set and can be
disabled. Refer to Section 1.0 “Electrical Characteristics” for charge termination current ratio and timer
period options.
FIGURE 4-2:
4.10
55
65 75 85 95 105 115 125 135 145 155
Junction Temperature (°C)
Thermal Regulation.
Thermal Shutdown
The MCP73837/8 suspends charge if the die
temperature exceeds +150°C. Charging will resume
when the die temperature has cooled by
approximately +10°C. The thermal shutdown is a
secondary safety feature in the event that there is a
failure within the thermal regulation circuitry.
The charge current is latched off and the MCP73837/8
enters a charge complete mode.
4.8
Automatic Recharge
The MCP73837/8 continuously monitors the voltage at
the VBAT pin in the charge complete mode. If the
voltage drops below the recharge threshold, another
charge cycle begins and current is once again supplied
to the battery or load. The recharge threshold is factory
set. Refer to Section 1.0 “Electrical Characteristics” for
recharge threshold options.
Note:
Charge termination and automatic
recharge features avoid constantly
charging a Li-Ion battery in order to prolong its life, while keeping its capacity at a
healthy level.
 2007-2015 Microchip Technology Inc.
DS20002071C-page 17
MCP73837/8
5.0
DETAILED DESCRIPTION
•
•
5.1
Analog Circuitry
Digital Circuitry
Analog Circuitry
5.1.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD)
The VDD input is the input supply to the MCP73837/8.
The MCP73837/8 can be supplied by either AC adapter
(VAC) or USB port (VUSB) with autonomous source
selection. The MCP73837/8 automatically enters a
Power-Down mode if the voltage on the VDD input falls
to within +100 mV of the battery voltage or below the
UVLO voltage (VSTOP). This feature prevents draining
the battery pack when both the VAC and VUSB supplies
are not present.
5.1.2
AC ADAPTER CURRENT
REGULATION SET (PROG1)
For the MCP73837/8, the charge current regulation
can be scaled by placing a programming resistor
(RPROG) from the PROG1 input to VSS. The program
resistor and the charge current are calculated using
the following equation:
EQUATION 5-1:
1000V
I REG = ----------------RPROG
Where:
RPROG
=
kilohm (k
IREG
=
milliampere (mA
The preconditioning current and the charge
termination current are ratiometric to the fast charge
current based on the selected device options.
5.1.3
BATTERY CHARGE CONTROL
OUTPUT (VBAT)
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP73837/8
provides constant current and voltage regulation to the
battery pack by controlling this MOSFET in the linear
region. The battery charge control output should be
connected to the positive terminal of the battery pack.
DS20002071C-page 18
5.1.4
TEMPERATURE QUALIFICATION
(THERM)
The MCP73837/8 continuously monitors battery
temperature during a charge cycle by measuring the
voltage between the THERM and the VSS pins. An
internal 50 µA current source provides the bias for the
most common 10 k negative-temperature coefficient
(NTC) or positive-temperature coefficient (PTC)
thermistors. The current source is controlled, avoiding
measurement sensitivity to fluctuations in the supply
voltage (VDD). The MCP73837/8 compares the voltage
at the THERM pin to factory set thresholds of 1.20V
and 0.25V, typically. If a voltage that is outside the
thresholds is detected during a charge cycle, the
MCP73837/8 immediately suspends the charge cycle.
The MCP73837/8 suspends charge by turning off the
pass transistor and holding the timer value. The charge
cycle resumes when the voltage at the THERM pin
returns to the normal range.
If temperature monitoring is not required, place a
standard 10 k resistor from THERM to VSS.
5.1.5
SYSTEM TEST (LDO) MODE
The MCP73837/8 can be placed in a System Test
mode. In this mode, the MCP73837/8 operates as a
low dropout (LDO) linear regulator. The output voltage
is regulated to the factory set voltage regulation option.
The available output current is limited to the programmed fast charge current. For stability, the VBAT
output must be bypassed to VSS with a minimum
capacitance of 1 µF for output currents up to 250 mA.
A minimum capacitance of 4.7 µF is required for output
currents above 250 mA.
The system test mode is entered by driving the THERM
input greater than (VDD – 100 mV) with no battery
connected to the output. In this mode, the MCP73837/8
can be used to power the system without a battery
being present.
Note 1: ITHERM is disabled during shutdown,
stand-by, and system test modes.
2: A pull-down current source on the
THERM input is active only in Stand-By
and System Test modes.
3: During System Test mode, the PROG
input sets the available output current
limit.
4: System Test mode shall be exited by
releasing the THERM input or cycling
input power.
 2007-2015 Microchip Technology Inc.
MCP73837/8
5.2
Digital Circuitry
5.2.1
5.2.4
STATUS INDICATORS AND POWER
GOOD (PG) OPTION
The charge status outputs have two different states:
Low (L), and High Impedance (Hi-Z). The charge status
outputs can be used to illuminate LEDs. Optionally, the
charge status outputs can be used as an interface to a
host microcontroller. Table 5-1 summarizes the state of
the status outputs during a charge cycle.
5.2.2
USB PORT CURRENT
REGULATION SELECT (PROG2)
For the MCP73837/8, driving the PROG2 input to a
logic Low selects the low charge current setting
(maximum 100 mA). Driving the PROG2 input to a logic
High selects the high charge current setting (maximum
500 mA).
The Precondition current and Termination current are
percentages of the charge current selected by the
PROG2 level. The percentage is based on the selected
part number of the device.
TABLE 5-1:
Charge Cycle State
STAT1
STAT2
PG
High Z
High Z
High-Z
Standby
L
High-Z
High Z
Preconditioning
L
High Z
L
Constant Current
L
High Z
L
Constant Voltage
L
High Z
L
L
Charge Complete – Standby
High Z
L
Temperature Fault
High Z
High Z
L
Timer Fault
High Z
High Z
L
L
L
L
5.2.3
The timer enable (TE) input option is used to enable or
disable the internal timer. It is only available on the
MCP73838. A low signal on this pin enables the internal timer and a high signal disables the internal timer.
The TE input can be used to disable the timer when the
charger is supplying current to charge the battery and
power the system load. The TE input is compatible with
1.8V logic.
5.2.5
DEVICE DISABLE (PROG1/2)
The current regulation set input pin (PROG1/2) can be
used to terminate a charge at any time during the
charge cycle, as well as to initiate a charge cycle or to
initiate a recharge cycle.
Placing a programming resistor from the PROG1/2
input to VSS enables the device. Allowing the PROG1/2
input to float or applying a logic-high input signal to
PROG1 disables the device and terminates a charge
cycle. When disabled, the device’s supply current is
reduced to 75 µA, typically.
STATUS OUTPUTS
Shutdown
System Test Mode
TIMER ENABLE (TE) OPTION
POWER GOOD (PG) OPTION
The power good (PG) option is a pseudo open-drain
output. It is only available on the MCP73837. The PG
output can sink current, but not source current. However, there is a diode path back to the input, and as
such, the output should be pulled up only to the input.
The PG output is low whenever the input to the
MCP73837 is above the UVLO threshold and greater
than the battery voltage. If the supply voltage is above
the UVLO, but below VREG(typical)+0.3V, the
MCP73837 will pulse the PG output as the device
determines if a battery is present.
 2007-2015 Microchip Technology Inc.
DS20002071C-page 19
MCP73837/8
6.0
APPLICATIONS
The MCP73837/8 devices are designed to operate in
conjunction with a host microcontroller or in
stand-alone applications. The MCP73837/8 devices
provide the preferred charge algorithm for Lithium-Ion
and Lithium-Polymer cells, Constant-Current followed
by Constant-Voltage. Figure 6-1 depicts a typical
stand-alone MCP73837 application circuit, while
Figure 6-2 and Figure 6-3 depict the accompanying
charge profile.
1
2
USB Port
CIN1
REGULATED
WALL CUBE
1 
CIN2
1 
1 
3
4
8
VAC
VBAT
VUSB
THERM
STAT1
V
STAT2
PROG2
/PG
PROG1
10
Thermistor
9
7
Low
6
R
PROG
IOUT
3.0
0.8
0.6
2.0
0.2
0
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
0.0
0.4
VDD = 5.2V
RPROG = 1 kΩ
1200 mAh Li-Ion Battery
Time (Minutes)
FIGURE 6-2:
Typical Charge Profile
(1200 mAh Li-Ion Battery).
DS20002071C-page 20
4.5
1.2
VOUT
4.0
Battery Voltage (V)
1
3.5
0.9
3.0
IOUT
2.5
0.6
2.0
1.5
VDD = 5.2V
RPROG = 1 kΩ
1200 mAh Li-Ion Battery
1.0
0.5
0.3
0.0
Charge Current (A)
1.2
VOUT
4.0
1.0
Hi
MCP73837 Typical Stand-Alone Application Circuit.
Charge Current (A)
Battery Voltage (V)
5.0
Single
Li-Ion
Cell
5
SS
MCP73837
FIGURE 6-1:
COUT
0
0
1
2
3
4
5
6
7
8
9
10
Time (Minutes)
FIGURE 6-3:
Typical Charge Profile in
Thermal Regulation (1200 mAh Li-Ion Battery).
 2007-2015 Microchip Technology Inc.
MCP73837/8
6.1
Application Circuit Design
6.1.1.1
The preferred fast charge current for Lithium-Ion cells
should always follow references and guidance from
battery manufacturers. For example, programming
700 mA fast charge current for a 1000 mAh Li-Ion
battery pack if its preferred fast charge rate is 0.7C.
This will result in the shortest charge cycle time without
degradation of a battery's life and performance.
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current,
and thermal impedance between the battery charger
and the ambient cooling air.
The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant
Current mode. In this situation, the battery charger has
to dissipate the maximum power. A trade-off must be
made between the charge current, cost, and thermal
requirements of the charger.
6.1.1
6.1.1.2
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
1
USB Port
CIN2
REGULATED
5V WALL CUBE
2
1 kΩ
3
SMAJ5.0A/AC
SMAJ5.0A/AC
Input Over-Voltage Protection
Input over-voltage protection must be used when the
input power source is hot-pluggable. This includes USB
cables and wall-type power supplies. The cabling of
these supplies acts as an inductor. When the supplies
are connected/ disconnected from the system, large
voltage transients are created which may damage the
system circuitry. These transients should be snubbed
out. A TransZorb® diode (unidirectional or bidirectional), connected from the VAC and VUSB inputs to 0V
ground reference, will snub the transients. An example
of this can be shown in Figure 6-4.
COMPONENT SELECTION
CIN1
Charge Current
1 kΩ
1 kΩ
4
8
VAC
VBAT
VUSB
THERM
/PG
PROG2
PROG1
MCP73837
FIGURE 6-4:
Thermistor
9
COUT
Single
Li-Ion
Cell
VSS 5
STAT1
STAT2
10
7
Low
Hi
6
RPROG
Input Over-Voltage Protection Example.
 2007-2015 Microchip Technology Inc.
DS20002071C-page 21
MCP73837/8
6.1.1.3
Thermal Considerations
6.1.1.5
Reverse-Blocking Protection
The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum
and the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this case, the power dissipation is:
The MCP73837/8 provides protection from a faulted or
shorted input. Without the protection, a faulted or
shorted input would discharge the battery pack through
the body diode of the internal pass transistor.
EQUATION 6-1:
The current regulation set input pin (PROG1/2) can be
used to terminate a charge at any time during the
charge cycle, as well as to initiate a charge cycle or a
recharge cycle.
PowerDissipation =  V
DDMAX
–V
PTHMIN
I
REGMAX
Where:
VDDMAX
=
the maximum input voltage
IREGMAX
=
the maximum fast charge current
VPTHMIN
=
the minimum transition threshold
voltage
6.1.1.6
Placing a programming resistor from the PROG1 input
to VSS or driving PROG2 to logic High or Low enables
the device. Allowing either the PROG1/2 input to float
disables the device and terminates a charge cycle.
When disabled, the device’s supply current is reduced
to 75 µA, typically.
6.1.1.7
For example, power dissipation with a 5V, ±10% input
voltage source, and a 500 mA, ±10% fast charge
current is calculated in the following example:
EXAMPLE 6-1:
PowerDissipation =  5.5V – 2.7V   550 mA = 1.54W
Charge Inhibit
Temperature Monitoring
The charge temperature window can be set by placing
fixed value resistors in series-parallel with a thermistor.
The resistance values of RT1 and RT2 can be calculated
with the following equations in order to set the
temperature window of interest.
For NTC thermistors, see Equation 6-2.
EQUATION 6-2:
RT2  RCOLD
24k  = RT1 + --------------------------------RT2 + R COLD
This power dissipation with the battery charger in the
MSOP-10 package will cause thermal regulation to be
entered as depicted in Figure 6-3. Alternatively, the
3 mm x 3 mm DFN package could be utilized to reduce
the charge cycle times.
6.1.1.4
External Capacitors
The MCP73837/8 is stable with or without a battery
load. In order to maintain good AC stability in the Constant Voltage mode, a minimum capacitance of 1 µF is
recommended to bypass the VBAT pin to VSS. This
capacitance provides compensation when there is no
battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant
Voltage mode. Therefore, the bypass capacitance may
be necessary to compensate for the inductive nature of
the battery pack.
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum Effective Series Resistance (ESR) value. The actual value of
the capacitor (and its associated ESR) depends on the
output load current. A 1 µF ceramic, tantalum, or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for output currents up to
500 mA.
DS20002071C-page 22
RT2  RHOT
5k  = RT1 + -----------------------------R T2 + RHOT
Where:
RT1
=
the fixed series resistance
RT2
=
the fixed parallel resistance
RCOLD
=
the thermistor resistance at the lower
temperature of interest
RHOT
=
the thermistor resistance at the
upper temperature of interest
For example, by utilizing a 10 k at +25°C NTC
thermistor with a sensitivity index, , of 3892, the
charge temperature range can be set to 0°C – +50°C
by placing a 1.54 k resistor in series (RT1), and a
69.8 k resistor in parallel (RT2) with the thermistor.
6.1.1.8
Charge Status Interface
A status output provides information on the state of
charge. The output can be used to illuminate external
LEDs or interface to a host microcontroller. Refer to
Table 5-1 or Figure 4-1 for information on the state of
the status output during a charge cycle.
 2007-2015 Microchip Technology Inc.
MCP73837/8
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins.
This is recommended to minimize voltage drops along
the high-current-carrying PCB traces.
If the PCB layout is used as a heat sink, adding many
vias in the heatsink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature.
 2007-2015 Microchip Technology Inc.
DS20002071C-page 23
MCP73837/8
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
10-Lead DFN
Marking
Code
Part Number(1)
Marking
Code
BABA
BABB
BABC
BACA
BACB
BACC
MCP73837T-FCI/MF
MCP73837T-FJI/MF
MCP73837T-NVI/MF
MCP73838T-FCI/MF
MCP73838T-FJI/MF
MCP73838T-NVI/MF
BABA
BABB
BABC
BACA
BACB
BACC
Part Number(1)
Marking
Code
Part Number(1)
Marking
Code
MCP73837-FCI/UN
MCP73837-FJI/UN
MCP73837-NVI/UN
MCP73838-FCI/UN
MCP73838-FJI/UN
MCP73838-NVI/UN
MCP73838-AMI/UN
837FCI
837FJI
837NVI
838FCI
838FJI
838NVI
838AMI
MCP73837T-FCI/UN
MCP73837T-FJI/UN
MCP73837T-NVI/UN
MCP73838T-FCI/UN
MCP73838T-FJII/UN
MCP73838T-NVI/UN
MCP73838T-AMI/UN
837FCI
837FJI
837NVI
838FCI
838FJI
838NVI
838AMI
Part Number(1)
MCP73837-FCI/MF
MCP73837-FJI/MF
MCP73837-NVI/MF
MCP73838-FCI/MF
MCP73838-FJI/MF
MCP73838-NVI/MF
(2)
Example:
BABA
1539
256
Example:
10-Lead MSOP
837FCI
539256
Note 1: Consult Factory for Alternative Device Options.
2: Consult Factory for MSOP Package Availability.
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20002071C-page 24
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2007-2015 Microchip Technology Inc.
MCP73837/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2007-2015 Microchip Technology Inc.
DS20002071C-page 25
MCP73837/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20002071C-page 26
 2007-2015 Microchip Technology Inc.
MCP73837/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2007-2015 Microchip Technology Inc.
DS20002071C-page 27
MCP73837/8
UN
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20002071C-page 28
 2007-2015 Microchip Technology Inc.
MCP73837/8
UN
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2007-2015 Microchip Technology Inc.
DS20002071C-page 29
MCP73837/8
10-Lead Plastic Micro Small Outline Package (UN) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20002071C-page 30
 2007-2015 Microchip Technology Inc.
MCP73837/8
APPENDIX A:
REVISION HISTORY
Revision C (November 2015)
The following is the list of modifications:
1.
2.
3.
4.
Added Section 6.1.1.2 “Input Over-Voltage
Protection”.
Added Figure 6-4.
Added CN output option to “Operational Output Options” table in “Product Identification
System”.
Minor typographical errors.
Revision B (December 2011)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Updated the Functional Block Diagram on
page 3.
Added labels on the charts throughout
Section 2.0 “Typical Performance Curves”.
Updated text in Section 3.7 “USB Port Current
Regulation Set (PROG2)”.
Updated text in Section 4.4 “Preconditioning”.
Updated text in Section 5.2.2 “USB port
Current Regulation Select (PROG2)”.
Added labels in Figure 6-2 and Figure 6-3.
Revision A (November 2007)
• Original Release of this Document.
 2007-2015 Microchip Technology Inc.
DS20002071C-page 31
MCP73837/8
NOTES:
DS20002071C-page 32
 2007-2015 Microchip Technology Inc.
MCP73837/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X/
XX
Examples(1):
XX
a)
b)
c)
d)
Output Temp. Package
Options*
Device:
e)
MCP73837: 1A Fully Integrated Charger,
PG function on pin 8
MCP73837T: 1A Fully Integrated Charger,
PG function on pin 8
(Tape and Reel)
MCP73838: 1A Fully Integrated Charger,
TE function on pin 8
MCP73838T: 1A Fully Integrated Charger,
TE function on pin 8
(Tape and Reel)
f)
g)
h)
i)
j)
k)
l)
Output Options(1)
Refer to “Operational Output Options” table for different
operational output options.
Temperature:
I
Package Type:
MF = 10-Lead Plastic Dual Flat, No Lead Package
3 x 3 x 0.9 mm Body, DFN
UN = 10-Lead Plastic Micro Small Outline Package,
MSOP (2)
Note
1:
2:
= -40C to +85C
Consult the factory for alternative device options.
Consult the factory for MSOP package availability.
MCP73837-FCI/MF: 10-lead DFN package
MCP73837-FJI/MF:
10-lead DFN package
MCP73837-NVI/MF: 10-lead DFN package
MCP73837T-FCI/MF: 10-lead DFN package,
Tape and Reel
MCP73837T-FJI/MF: 10-lead DFN package,
Tape and Reel
MCP73837T-NVI/MF: 10-lead DFN package,
Tape and Reel
MCP73837-FCI/UN: 10-lead MSOP package
MCP73837-FJI/UN:
10-lead MSOP package
MCP73837-NVI/UN: 10-lead MSOP package
MCP73837T-FCI/UN: 10-lead MSOP package
Tape and Reel
MCP73837T-FJI/UN: 10-lead MSOP package
Tape and Reel
MCP73837T-NVI/UN: 10-lead MSOP package
Tape and Reel
a)
b)
c)
d)
MCP73838-FCI/MF:
MCP73838-FJI/MF:
MCP73838-NVI/MF:
MCP73838T-FCI/MF:
e)
MCP73838T-FJI/MF:
f)
MCP73838T-NVI/MF:
g)
h)
i)
j)
k)
MCP73838-AMI/UN:
MCP73838-FCI/UN:
MCP73838-FJI/UN:
MCP73838-NVI/UN:
MCP73838T-AMI/UN:
l)
MCP73838T-FCI/UN:
m)
MCP73838T-FJI/UN:
n)
MCP73838T-FCI/UN:
10-lead DFN package
10-lead DFN package
10-lead DFN package
10-lead DFN package
Tape and Reel
10-lead DFN package
Tape and Reel
10-lead DFN package
Tape and Reel
10-lead MSOP package
10-lead MSOP package
10-lead MSOP package
10-lead MSOP package
10-lead MSOP package
Tape and Reel
10-lead MSOP package
Tape and Reel
10-lead MSOP package
Tape and Reel
10-lead MSOP package
Tape and Reel
OPERATIONAL OUTPUT OPTIONS
Output Options
VREG
IPREG/IREG
VPTH/VREG
ITERM/IREG
VRTH/VREG
Timer Period
AM
BZ
4.20V
10%
71.5%
7.5%
96.5%
0 hours
4.20V
100%
N/A
7.5%
96.5%
0 hours
6 hours
FC
4.20V
10%
71.5%
7.5%
96.5%
GP
4.20V
100%
N/A
7.5%
96.5%
6 hours
G8
4.20V
10%
71.5%
7.5%
96.5%
8 hours
NV
4.35V
10%
71.5%
7.5%
96.5%
6 hours
YA
4.40V
10%
71.5%
7.5%
96.5%
6 hours
6S
4.50V
10%
71.5%
7.5%
96.5%
6 hours
B6
4.20V
10%
66.5%
5.0%
96.5%
4 hours
CN
4.20V
10%
71.5%
20%
94%
4 hours
FJ
4.20V
10%
71.5%
20%
94%
6 hours
 2007-2015 Microchip Technology Inc.
DS20002071C-page 33
MCP73837/8
NOTES:
DS20002071C-page 34
 2007-2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2011-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-879-6
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2011-2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20002071C-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Germany - Karlsruhe
Tel: 49-721-625370
India - Pune
Tel: 91-20-3019-1500
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Italy - Venice
Tel: 39-049-7625286
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
DS20002071C-page 36
 2011-2015 Microchip Technology Inc.
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