ETC2 GS2AF Surface mount general rectifier Datasheet

GS2AF THRU GS2MF
SURFACE MOUNT GENERAL RECTIFIER
Reverse Voltage - 50 to 1000 Volts
FEATURES
SMAF
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
260 C/10 seconds at terminals
Glass passivated chip junction
Cathode Band
Top View
0.110(2.80)
0.094(2.40)
0.059(1.50)
0.051(1.30)
0.144(3.65)
0.128(3.25)
0.012(0.30)
0.006(0.15)
0.055(1.40)
0.043(1.10)
Forward Current - 2.0 Amperes
0.047(1.20)
0.028(0.70)
MECHANICAL DATA
Case: JEDEC SMAF molded plastic body over passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.0018 ounce, 0.064 grams
0.189(4.80)
0.173(4.40)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
MDD Catalog Number
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL=75 C
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 2.0A
Maximum DC reverse current
TA=25 C
at rated DC blocking voltage
TA=100 C
Typical junction capacitance (NOTE 1)
Typical thermal resistance (NOTE 2)
Operating junction and storage temperature range
SYMBOLS
VRRM
VRMS
VDC
GS2AF GS2BF GS2DF GS2GF GS2JF
50
35
50
100
70
100
200
140
200
400
280
400
600
420
600
GS2KF
GS2MF
UNITS
800
560
800
1000
700
1000
VOLTS
VOLTS
VOLTS
I(AV)
2.0
Amps
IFSM
60.0
Amps
VF
1.1
Volts
IR
5.0
50.0
µA
CJ
RθJA
TJ,TSTG
30.0
50.0
-50 to +150
pF
C/W
C
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
2014-03 01版
http://www.microdiode.com
FIG. 1- FORWARD CURRENT DERATING CURVE
2.0
1.6
1.2
Single Phase
Half Wave 60Hz
Resistive or
inductive Load
0.8
0.4
0
0
25
50
75
100
125
150
PEAK FORWARD SURGE CURRENT,
AMPERES
AVERAGE FORWARD RECTIFIED CURRENT,
AMPERES
RATINGS AND CHARACTERISTIC CURVES GS2AF THRU GS2MF
FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
60
50
40
30
20
175
10
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
1
10
AMBIENT TEMPERATURE, C
20
10
1
TJ=25 C
PULSE WIDTH=300 µs
1%DUTY CYCLE
0.01
0.6
0.8
1.0
1.2
1.4
1.5
FIG. 4-TYPICAL REVERSE CHARACTERISTICS
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
INSTANTANEOUS FORWARD
CURRENT,AMPERES
FIG. 3-TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
0.1
1,000
100
TJ=100 C
1
0.1
TJ=25 C
0.01
0
20
40
60
80
100
200
TJ=25 C
10
TRANSIENT THERMAL IMPEDANCE,
C/W
PERCENT OF PEAK REVERSE VOLTAGE,%
FIG. 5-TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE, pF
TJ=150 C
10
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
100
100
NUMBER OF CYCLES AT 60 Hz
FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE
100
10
1
0.1
0.01
0.1
1
10
100
1
0.1
1.0
10
REVERSE VOLTAGE,VOLTS
2014-03 01版
100
t,PULSE DURATION,sec.
http://www.microdiode.com
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