Diodes SMD Type Fast Recovery Rectifiers FR101FH~FR107FH Features F7 1 ● Surface Mount Fast Recovery Rectifiers 2 ● Reverse Voltage - 50 to 1000 V PIN DESCRIPTION 1 Cathode 2 Anode Weight：17.6mg，0.00062 o z Simplified outline SOD-123FH ● Forward Current :1 A ■ Absolute Maximum Ratings Ta = 25℃ Parameter Symbol FR101FH FR102FH FR103FH FR104FH FR105FH FR106FH FR107FH Unit Repetitive Peak reverse voltage VRRM 50 100 200 400 600 800 Surge Peak reverse voltage VRSM 35 70 140 280 420 560 700 Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 VF 1.3 Max.averaged fwd.current. @ Ta =65℃ IFAV 1 Peak forward surge current IFSM 25 Forward voltage @ IF=1A Maximum DC Reverse Current Ta=25℃ Ta=125℃ *1 trr Typical Junction Capacitance *2 μA 100 150 250 Cj 15 Junction temperature Tj 150 Storage temperature Tstg -55 to 150 V A 5 IR Maximum Reverse Current 1000 500 ns pF ℃ * 1 Measured with IF = 0.5 A, IR = 1 A, Irr = 0.25 A * 2 Measured at 1MHz and applied reverse voltage of 4V D.C ■ Marking NO. Marking FR101FH FR102FH FR103FH FR104FH FR105FH FR106FH FR107FH F2 F3 F7 www.kexin.com.cn 1 Diodes SMD Type Fast Recovery Rectifiers FR101FH~FR107FH ■ Typical Characterisitics Fig.2 Typical Reverse Characteristics Instaneous Reverse Current（μ A） Average Forward Current (A) Fig.1 Forward Current Derating Curve 1.2 1.0 0.8 0.6 0.4 Single phase half-wave 60 Hz resistive or inductive load 0.2 0.0 25 75 50 100 125 150 175 100 T J =125° C 10 1.0 T J =25° C 0.1 10 T J =25° C 1.0 0.1 pulse with 300μs 1% duty cycle 0.5 1.0 1.5 20 Peak Forward Surage Current (A) 80 100 120 140 2.0 10 T J =25° C 1 2.5 0.1 1.0 30 25 20 15 10 8.3 ms Single Half Sine Wave (JEDEC Method) 05 00 1 10 Reverse Voltage (V) Fig.5 Maximum Non-Repetitive Peak Forward Surage Current 10 Number of Cycles www.kexin.com.cn 60 100 Instaneous Forward Voltage (V) 2 40 Fig.4 Typical Junction Capacitance Junction Capacitance ( pF) Instaneous Forward Current (A) Fig.3 Typical Instaneous Forward Characteristics 0.01 0.0 00 percent of Rated Peak Reverse Voltage (%) Ambient Temperature (° C) 100 100 Diodes SMD Type Fast Recovery Rectifiers FR101FH~FR107FH ■ Typical Application Plastic surface mounted package; 2 leads C A ∠A LL R O U N D HE VM e A E D pad e E A pad bottom d mil C D d E e HE max 1.08 0.16 2.9 3.3 1.8 1.0 3.8 min 0.95 0.14 2.6 3.0 1.5 0.7 3.5 max 42.5 6.3 114 130 70 39 150 min 37.4 5.5 102 118 60 28 138 ∠ 5° The recommended mounting pad size 1.1 (43) 2.0 (79) 1.1 (43) 1.1 (43) mm A 1.8 (71) UNIT 0.8 (32) 0.8 (32) Unit： mm (mil) www.kexin.com.cn 3 Diodes SMD Type Fast Recovery Rectifiers FR101FH~FR107FH ■ Typical Application Recommended condition of flow soldering 300 Preliminary Heating Soldering Cooling (in air) Temperature of Soldering (°C) 265°C 250 245°C 200 150 120°C 100 100°C 50 0 2 to 5 min more than 1 min less than 10s Recommended condition of reflow soldering Temperature of Soldering (°C) 300 Peak Temperature 245 to 260°C, 10s max. 250 . Reflow Heating Rate 1 to 5°C / s 200 150 100 50 0 Pre Heating Rate 1 to 5°C / s Preliminary Heating 130 to 170°C, 50 to 120s Soldering 230°C 20 to 30s Cooling more than 60s 2 times max. Recommended peak temperature is over 245 ° C. If peak temperature is below 245 °C, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) 4 www.kexin.com.cn