Material Content Data Sheet Sales Product Name BTT6050-2EKA MA# MA001369076 Package PG-DSO-14-40 Issued 22. May 2015 Weight* 149.96 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 3.421 2.28 0.017 0.01 0.070 0.05 464 1.392 0.93 9281 56.512 37.68 38.67 376838 386699 1.065 0.71 0.71 7101 7101 0.168 0.11 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.28 22813 22813 116 1117 7.708 5.14 75.903 50.61 55.86 506144 558657 1.241 0.83 0.83 8278 8278 1.417 0.95 0.95 9452 9452 0.184 0.12 0.866 0.58 51396 1225 0.70 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5775 7000 1000000