Not Recommended for New Designs LMV1051 www.ti.com SNAS508A – SEPTEMBER 2010 – REVISED MAY 2013 PRODUCT BRIEF Processor for Dual Microphone Adaptive Noise Cancelling With Wind Noise Alert Check for Samples: LMV1051 FEATURES APPLICATIONS • • • • 1 2 • • • • • • • • • Superior Noise Cancellation – Dual Mic Technology – Active Directional Pattern – Up to 30dB Peak Noise Rejection of Stationary and Non-Stationary Noise Sources – No Distortion of Desired Signal – Flat Frequency Response Wind Noise Alert and Protection – Automatically Reduces Wind Noise by ≈ 20 dB (vs. Directional Mic) – Wind Noise Alert can be Used to Further Reduce Impact of Wind on Desired Signal Ultra-Low Power Consumption – 210 μA (Typical) Including Mic Bias – Battery-Free Operation in Wired Headsets Compatible with Standard ECM Interfaces – 2-Wire or 3-Wire Interface – Powered from Mic Bias Supply Complete Signal Processing Solution – No Software Required – Enables a Fully Integrated Mic Module Zero-Latency Signal Processing Noise Cancelling or Omni-Directional Output Better EMI Noise Rejection than ECM Supports Telephony Bandwidth Small Size 3 x 3 mm Wired Headset Webcams Cellular or Cordless Handsets DESCRIPTION The LMV1051-LLP is an ultra-low power signal processor that processes the signals from 2 ECM or MEMS microphones to create an adaptive beam forming noise reduction system. The LMV1051-LLP processor is intended to be integrated with microphones (ECMs or MEMS). By using a proprietary TI algorithm, the processor extracts a clean intelligible signal from noisy environments through the use of an adaptive directional pattern. The resulting solution can reduce noise by up to 30 dB, resulting in a significant improvement to the signal-to-noise ratio (SNR). The signal processing does not introduce artifacts into the talker’s voice. The desired signal is unmodified, which improves intelligibility and speech recognition accuracy. The LMV1051-LLP is designed to replace a standard ECM using a two-wire or three-wire interface. The entire module, including the processing IC, is powered from the mic bias supply. The resulting system uses less power than an individual ECM giving the end-product designer the ability to upgrade current designs without modifying the existing circuit. The result is an easy-to-use, low cost microphone alternative, providing superior noise reduction for end users. Notice: This document is not a full datasheet. For more information regarding this product or to order samples please contact your local TI sales office or visit http://www.ti.com/support/dir.html These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2013, Texas Instruments Incorporated Not Recommended for New Designs LMV1051 SNAS508A – SEPTEMBER 2010 – REVISED MAY 2013 www.ti.com Block Diagram Standard 2-Wire Or 3-Wire Interfaces LMV1051 Microphone IC Vbias Vdd Mic Rb Beam Steering Engine Input Amplifiers Out Output Amplifier Mic EMI Filter Gnd Omni Mode National IC Wind Indicator Audio Device Program interface pins for factory use only Ground in application Typical Applications Circuit Vdd 2.0V Vbatt 2.0V LMV1051-LLP Rbatt 2.9 k: Idd LMV1051-LLP 8: Output OUT Mic Mic Cc 2.2 PF Iout VOUT DC 1.35 WIN D Mic 8: VOUT DC 1.35 Output OUT Cc 2.2 PF WIN D OMNI OMNI GND GND ATST PROG CLK ATST PROG CLK 2-Wire Mode 2 Rbias 12.7 k: VDD VDD Mic Ibias Idd Ibatt Vbias 2.0V Submit Documentation Feedback 3-Wire Mode Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMV1051 Not Recommended for New Designs LMV1051 www.ti.com SNAS508A – SEPTEMBER 2010 – REVISED MAY 2013 REVISION HISTORY Changes from Original (May 2013) to Revision A • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 2 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMV1051 3 PACKAGE OPTION ADDENDUM www.ti.com 3-May-2013 PACKAGING INFORMATION Orderable Device Status (1) LMV1051SDX-BA/NOPB NRND Package Type Package Pins Package Drawing Qty WSON DSC 10 4500 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) Call TI Level-1-260C-UNLIM (4) 0 to 60 L1051 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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