Material Content Data Sheet Sales Product Name TLE7718G MA# MA001356176 Package PG-DSO-52-4 Issued 17. April 2015 Weight* 872.01 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 27.549 3.16 0.073 0.01 0.293 0.03 336 5.854 0.67 6713 237.701 27.26 27.97 272591 279724 3.083 0.35 0.35 3536 3536 1.163 0.13 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.16 31592 31592 84 1333 53.484 6.13 526.700 60.41 66.67 604009 666676 7.602 0.87 0.87 8718 8718 0.968 0.11 0.11 1110 1110 1.885 0.22 5.654 0.65 61334 2161 0.87 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 6483 8644 1000000