SPSEMI MSM200 Surface mount device Datasheet

PPTC/MSM Series
Features
Applications
Surface Mount Devices
Almost anywhere there is a low voltage
Lead free deivce
power supply, up to DC33V and a load
Size 4532mm/1812 mils
to be protested, including:
Surface Mount packaging for automated assembly
Computer mother board,Modem,USB hub
Agency recognition:UL
PDAs & Charger,Analog & digital line card
Digital cameras,Dish drivers, CD-ROMs
Dimensions (mm)
1.78 ± 0.1
3.2 ± 0.1
1.78 ± 0.1
3.2 ± 0.1
Product dimensions (mm)
Model
A
B
C
D
E
min
max
min
max
min
max
min
min
MSM010
4.37
4.73
3.07
3.41
0.50
1.00
0.30
0.25
MSM014
MSM020/60
4.37
4.73
3.07
3.41
0.50
1.00
0.30
0.25
4.37
4.73
3.07
3.41
0.50
1.30
0.30
0.25
MSM030
4.37
4.73
3.07
3.41
0.50
1.00
0.30
0.25
MSM050/24/30
MSM075/16/24/33
4.37
4.73
3.07
3.41
0.40
1.80
0.30
0.25
4.37
4.73
3.07
3.41
0.40
0.90
0.30
0.25
MSM110/16/24/33
4.37
4.73
3.07
3.41
0.40
1.30
0.30
0.25
4.37
4.73
3.07
3.41
0.60
1.30
0.30
0.25
MSM150/16/24
4.37
4.73
3.07
3.41
0.40
1.20
0.30
0.25
MSM160
MSM200/12
4.37
4.73
3.07
3.41
0.40
1.20
0.30
0.25
4.37
4.73
3.07
3.41
0.50
1.30
0.30
0.25
4.37
4.37
4.37
4.73
4.73
4.73
3.07
3.07
3.07
3.41
3.41
3.41
0.50
0.50
0.50
1.50
1.50
1.50
0.30
0.30
0.30
0.25
0.25
0.25
MSM125
MSM260/13.2/16
MSM300
MSM350
Environmental Specifications
Test
Conditions
Resistance change
Passive aging
85℃,1000hrs
±5% typical
Humidity aging
85℃,85%℃R.H.,168hrs
±5% typical
Thermal shock
85℃,to-40℃,13times
±33% typical
Resistance to solvent
MIL-STD-202,Method 215
No change
Vibration
MIL-STD-202,Method 201
No change
Ambient operating confitions:-40℃ to 85℃
Maximum surface of the device in the tripped state is 125℃
REV.2014.05.01
01 | www.spsemi.cn
PPTC/MSM Series
Model
Electrical characteristics(25℃)
Imax Pd max
Maximum Time To Trip
Current
Time
(Vdc)
(A)
(w)
(A)
(S)
Ihold
Itrip
(A)
(A)
MSM010
0.10
0.30
30
100
0.8
0.5
1.5
0.750
15.000
MSM014
0.14
0.34
60
100
0.8
1.5
0.15
0.650
6.000
MSM020
MSM020/60
MSM030
0.20
0.20
0.30
0.40
0.40
0.60
30
60
30
100
100
100
0.8
0.8
0.8
8.0
8.0
8.0
0.02
0.02
0.1
0.350
0.350
0.250
5.000
5.000
3.000
MSM050
0.50
1.00
15
100
0.8
8.0
0.15
0.150
1.000
MSM050/24
MSM050/30
0.50
0.50
1.00
1.00
24
30
100
100
0.8
0.8
8.0
8.0
0.15
0.15
0.150
0.150
1.000
1.000
MSM075
MSM075/16
MSM075/24
MSM075/33
MSM110
MSM110/16
MSM110/24
MSM110/33
MSM125
MSM150
MSM150/166
MSM150/24
MSM160
MSM200
MSM200/12
MSM260
MSM260/13.2
MSM260/16
0.75
0.75
0.75
1.10
1.10
1.50
1.50
1.50
2.20
2.20
13.2
16
24
33
8
100
100
100
100
100
0.8
0.8
0.8
0.8
0.8
8.0
8.0
8.0
8.0
8.0
0.2
0.2
0.2
0.3
0.3
0.090
0.090
0.090
0.090
0.050
0.450
0.450
0.450
0.450
0.250
1.10
1.10
1.10
1.25
1.50
1.50
1.50
1.60
2.00
2.00
2.60
2.60
2.60
2.20
2.20
2.20
2.50
3.00
3.00
3.00
2.80
4.00
4.00
5.00
5.00
5.00
16
24
33
16
8
16
24
8
8
12
8
13.2
16
100
100
100
100
100
100
100
100
100
100
100
100
100
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
0.3
0.3
0.3
0.4
0.5
0.5
0.5
1.0
2.0
2.0
2.5
2.5
2.5
0.050
0.050
0.050
0.050
0.040
0.040
0.040
0.030
0.020
0.020
0.015
0.015
0.015
0.250
0.250
0.250
0.140
0.160
0.160
0.160
0.130
0.100
0.100
0.050
0.050
0.050
MSM300
3.00
5.00
8
100
0.8
8.0
4.0
0.012
0.040
MSM350
Ihold
Itrip
Vmax
Imax
Pd
Rmin/max
R1max
*CAUTION
Vmax
Resistance
Rmin
Rmax
(Ω)
(Ω)
3.50
6.00
6
100
0.8
8.0
4.0
0.008
0.030
Hold Current:Maximum current device will not trip in 25℃ still air.
Trip current:Minimum current at which the device will always trip in 25℃ still air
Maximum operating volatge device can withstand without damage at ratde current(imax).
Maximum fault current device can withstand without damage at rated voltage(Vmax).
Typical power dissipatde from device when in the tripped state in 25℃ still air.
Minimum/Maximum device resistance prior to tripping at 25℃.
Maximum resistance of device at 25℃ measured one hour after trippde tripping.
Operation beyond the specified rating may result in damage and possible arcing.
Ihold versus tempetature
maximun ambient operating temperature(Tmao)vs.hold current(Ihold)
Model
—40℃
—20℃
0℃
25℃
40℃
50℃
60℃
70℃
85℃
MSM010
0.160
0.14
0.120
0.10
0.080
0.07
0.06
0.05
0.030
MSM014
0.23
0.19
0.17
0.14
0.120
0.10
0.09
0.08
0.06
MSM020
0.29
0.26
0.23
0.20
0.170
0.15
0.14
0.12
0.10
MSM030
0.44
0.39
0.35
0.30
0.260
0.23
0.21
0.18
0.15
MSM050
0.59
0.57
0.55
0.50
0.450
0.43
0.35
0.30
0.23
MSM075
1.10
0.99
0.87
0.75
0.630
0.57
0.49
0.45
0.35
MSM110
1.60
1.45
1.28
1.10
0.920
0.83
0.71
0.66
0.52
MSM125
2.00
1.75
1.52
1.25
1.000
0.95
0.90
0.75
0.53
MSM150
2.30
2.05
1.77
1.50
1.230
1.09
0.95
0.82
0.61
MSM160
2.10
1.96
1.88
1.60
1.260
1.12
0.98
.
0.84
0.63
MSM200
MSM260
MSM300
MSM350
2.88
3.90
4.15
4.84
2.61
3.42
3.76
4.39
2.25
2.96
3.46
4.04
2.00
2.60
3.00
3.50
1.800
2.330
2.550
2.980
1.66
2.07
2.28
2.66
1.45
1.94
2.01
2.35
1.09
1.35
1.61
1.88
0.80
1.00
1.33
1.55
REV.2014.05.01
02 | www.spsemi.cn
PPTC/MSM Series
Termination pad characteristics
Terminal pad materials
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Terminal pad solderability
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Thermal Derating Curve
Typical Time-To-Trip At 25°C
Average Time Current Curves
Derating Curves for mSMD Series
160
140
120
10
100
Time In Seconds
Percentage of Derated
Current
100
80
60
40
20
1
0.1
0.01
0
-40
-20
0
20
40
60
80
0.001
Temperature (°C)
0.1
1
10
0.10A
0.14A
0.20A
0.30A
0.50A
0.75A
1.10A
1.25A
1.50A
2.00A
2.50A
2.60A
100
Current In Amperes
Recommended Solder Reflow Conditions
Temperature(°C)
mSMDmSMD
Series
Preheating
300
Soldering
Cooling
250
200
190
160
‧Recommended reflow methods:IR, vapor phase oven, hot air oven.
‧Devices are not designed to be wave soldered to the bottom side
of the board.
‧Recommended maximum paste thickness is 0.25 mm (0.010 inch).
‧Devices can be cleaned using standard method and solvents.
Note:If reflow temperatures exceed the recommended profile,
100
0
devices may not meet the performance requirements.
60-120
sec.
30-60
sec.
120
sec.
Package Information
Reel:
MSM010~350
REV.2014.05.01
1500pcs/reel
03 | www.spsemi.cn
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