IRF IRGP4266DPBF Insulated gate bipolar transistor with ultrafast soft recovery diode Datasheet

IRGP4266DPbF
IRGP4266D-EPbF
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode
VCES = 650V
C
IC = 90A, TC =100°C
tSC 5.5µs, TJ(max) = 175°C
G
VCE(ON) typ. = 1.7V @ IC = 75A
G
E
E
G
G
Gate
C
Collector
Features
C
E
IRGP4266D‐EPbF
TO‐247AD
IRGP4266DPbF
TO‐247AC
n-channel
Applications
 Industrial Motor Drive
 UPS
 Solar Inverters
 Welding
C
E
Emitter
Benefits
Low VCE(ON) and Switching Losses
5.5µs Short Circuit SOA
Square RBSOA
Maximum Junction Temperature 175°C
Positive VCE (ON) Temperature Co-efficient
Base part number
Package Type
IRGP4266DPbF
IRGP4266D-EPbF
TO-247AC
TO-247AD
High Efficiency in a Wide Range of Applications
Rugged Transient Performance
Increased Reliability
Excellent Current Sharing in Parallel Operation
Standard Pack
Form
Quantity
Tube
25
Tube
25
Orderable Part Number
IRGP4266DPbF
IRGP4266D-EPbF
Absolute Maximum Ratings
Parameter
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IF @ TC = 25°C
IF @ TC = 100°C
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulse Collector Current, VGE=20V
Clamped Inductive Load Current, VGE=20V 
Diode Continuous Forward Current
Diode Continuous Forward Current
Continuous Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw
Max.
Units
650
140
90
300
300
68
42
±20
455
230
-40 to +175
V
A
V
W
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
C
Thermal Resistance
RJC (IGBT)
RJC (Diode)
RCS
RJA
1
Parameter
Thermal Resistance Junction-to-Case-(each IGBT) 
Thermal Resistance Junction-to-Case-(each Diode) 
Thermal Resistance, Case-to-Sink (flat, greased surface)
Thermal Resistance, Junction-to-Ambient (typical socket mount)
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Min.
–––
–––
–––
–––
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Typ.
–––
–––
0.24
40
Max.
0.33
1.1
–––
–––
Units
°C/W
August 21, 2014
IRGP4266DPbF/IRGP4266D-EPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
Parameter
Collector-to-Emitter Breakdown Voltage
Temperature Coeff. of Breakdown Voltage
Min.
650
—
Typ.
—
0.65
—
1.7
—
2.2
Gate Threshold Voltage
5.5
—
VGE(th)
Threshold Voltage Temperature Coeff.
—
-20
VGE(th)/TJ
gfe
Forward Transconductance
—
47
—
1.0
ICES
Collector-to-Emitter Leakage Current
—
1.0
—
—
IGES
Gate-to-Emitter Leakage Current
—
2.1
Diode Forward Voltage Drop
VF
—
1.7
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Max.
—
—
Units
Conditions
V
VGE = 0V, IC = 100µA 
V/°C VGE = 0V, IC = 5.0mA (25°C-175°C)
2.1
V
IC = 75A, VGE = 15V, TJ = 25°C
—
IC = 75A, VGE = 15V, TJ = 175°C
7.7
V
VCE = VGE, IC = 2.1mA
—
mV/°C VCE = VGE, IC = 2.1mA (25°C-150°C)
—
S
VCE = 50V, IC = 75A, PW = 20µs
35
µA VGE = 0V, VCE = 650V
mA VGE = 0V, VCE = 650V, TJ = 175°C
—
±100
nA VGE = ±20V
2.7
V
IF = 75A
—
IF = 75A, TJ = 175°C
VCE(on)
Collector-to-Emitter Saturation Voltage
Qg
Qge
Qgc
Eon
Eoff
Etotal
td(on)
tr
td(off)
tf
Eon
Parameter
Total Gate Charge (turn-on)
Gate-to-Emitter Charge (turn-on)
Gate-to-Collector Charge (turn-on)
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Turn-On Switching Loss
Eoff
Etotal
td(on)
tr
td(off)
tf
Cies
Coes
Cres
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
RBSOA
Reverse Bias Safe Operating Area
SCSOA
Short Circuit Safe Operating Area
5.5
—
—
µs
Erec
trr
Irr
Reverse Recovery Energy of the Diode
Diode Reverse Recovery Time
Peak Reverse Recovery Current
—
—
—
770
170
27
—
—
—
µJ
ns
A
Min.
—
—
—
—
—
—
—
—
—
—
—
Typ.
140
50
60
2.5
2.2
4.7
50
70
200
60
3.9
—
—
—
—
—
—
—
—
—
2.8
6.7
50
70
240
70
4430
310
130
Max Units
Conditions
210
IC = 75A
80
nC VGE = 15V
VCC = 400V
90
3.4
3.0
mJ IC = 75A, VCC = 400V, VGE=15V
6.4
RG = 10, L = 200µH, TJ = 25°C
70
Energy losses include tail & diode
90
ns reverse recovery 
225
80
—
—
—
—
—
—
—
—
—
—
mJ
ns
pF
FULL SQUARE
IC = 75A, VCC = 400V, VGE=15V
RG = 10, L = 200µH, TJ = 175°C
Energy losses include tail & diode
reverse recovery 
VGE = 0V
VCC = 30V
f = 1.0MHz
TJ = 175°C, IC = 225A
VCC = 480V, Vp ≤ 650V
VGE = +20V to 0V
TJ = 150°C,VCC = 400V, Vp ≤ 650V
VGE = +15V to 0V
TJ = 175°C
VCC = 400V, IF = 75A
VGE = 15V, Rg = 10
Notes:






VCC = 80% (VCES), VGE = 20V.
R is measured at TJ of approximately 90°C.
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.
Maximum limits are based on statistical sample size characterization.
Pulse width limited by max. junction temperature.
Values influenced by parasitic L and C in measurement.
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IRGP4266DPbF/IRGP4266D-EPbF
140
For both:
Duty cycle : 50%
Tj = 175°C
Tcase = 100°C
Gate drive as specified
Power Dissipation = 208.3W
Load Current ( A )
120
100
Square Wave:
80
VCC
60
I
40
Diode as specified
20
0.1
1
10
100
f , Frequency ( kHz )
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
500
160
140
400
120
Ptot (W)
IC (A)
100
80
60
40
300
200
100
20
0
0
25
50
75
100
125
150
25
175
50
75
100
125
150
175
TC (°C)
TC (°C)
Fig. 3 - Power Dissipation vs.
Case Temperature
Fig. 2 - Maximum DC Collector Current vs.
Case Temperature
1000
1000
100
10
100
IC (A)
IC (A)
10µsec
100µsec
10
1msec
1
DC
Tc = 25°C
Tj = 175°C
Single Pulse
1
0.1
1
10
100
1000
10000
10
100
VCE (V)
VCE (V)
Fig. 4 - Forward SOA
TC = 25°C; TJ ≤ 175°C; VGE = 15V
3
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1000
Fig. 5 - Reverse Bias SOA
TJ = 175°C; VGE = 20V
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IRGP4266DPbF/IRGP4266D-EPbF
300
300
VGE = 18V
VGE = 18V
VGE = 15V
250
VGE = 15V
250
VGE = 12V
200
VGE = 10V
200
VGE = 8.0V
ICE (A)
ICE (A)
VGE = 12V
VGE = 10V
150
VGE = 8.0V
150
100
100
50
50
0
0
0
2
4
6
8
0
10
2
4
6
8
10
V CE (V)
V CE (V)
Fig. 6 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 20µs
Fig. 7 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 20µs
300
300
VGE = 18V
VGE = 15V
250
250
VGE = 12V
VGE = 10V
200
VGE = 8.0V
IF (A)
ICE (A)
200
150
150
100
100
50
50
-40°C
25°C
175°C
0
0
0
2
4
6
8
0.0
10
1.0
2.0
12
12
10
10
ICE = 38A
ICE = 75A
8
ICE = 38A
ICE = 75A
8
ICE = 150A
V CE (V)
V CE (V)
4.0
Fig. 9 - Typ. Diode Forward Voltage Drop
Characteristics
Fig. 8 - Typ. IGBT Output Characteristics
TJ = 175°C; tp = 20µs
6
ICE = 150A
6
4
4
2
2
0
0
5
10
15
20
5
10
V GE (V)
Fig. 10 - Typical VCE vs. VGE
TJ = -40°C
4
3.0
V F (V)
V CE (V)
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15
20
V GE (V)
Fig. 11 - Typical VCE vs. VGE
TJ = 25°C
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IRGP4266DPbF/IRGP4266D-EPbF
225
12
10
8
135
ICE = 150A
ICE (A)
V CE (V)
180
ICE = 38A
ICE = 75A
6
90
TJ = 25°C
TJ = 175°C
4
45
2
0
0
5
10
15
2
20
4
8
10
12
14
16
V GE (V)
Fig. 12 - Typical VCE vs. VGE
TJ = 175°C
Fig. 13 - Typ. Transfer Characteristics
VCE = 50V; tp = 20µs
12
1000
10
tdOFF
Swiching Time (ns)
8
Energy (mJ)
6
V GE (V)
EON
6
4
EOFF
tF
100
tdON
2
tR
0
0
25
50
75
100
125
10
150
0
IC (A)
Fig. 14 - Typ. Energy Loss vs. IC
TJ = 175°C; L = 200µH; VCE = 400V, RG = 10; VGE = 15V
50
100
150
IC (A)
Fig. 15 - Typ. Switching Time vs. IC
TJ = 175°C; L = 200µH; VCE = 400V, RG = 10; VGE = 15V
10000
11
10
Swiching Time (ns)
9
Energy (mJ)
8
1000
7
6
EON
5
4
tdOFF
tF
tR
100
EOFF
3
tdON
2
0
25
50
75
100
10
0
20
40
Rg ()
Fig. 16 - Typ. Energy Loss vs. RG
TJ = 175°C; L = 200µH; VCE = 400V, ICE = 75A; VGE = 15V
5
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60
80
100
120
R G ()
Fig. 17 - Typ. Switching Time vs. RG
TJ = 175°C; L = 200µH; VCE = 400V, ICE = 75A; VGE = 15V
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IRGP4266DPbF/IRGP4266D-EPbF
30
30
RG = 10
25
25
20
IRR (A)
IRR (A)
RG = 22
RG = 47
15
20
15
10
RG = 100
10
5
20
40
60
80
100
120
140
160
0
20
40
60
80
100
IF (A)
RG (
Fig. 18 - Typ. Diode IRR vs. IF
TJ = 175°C
Fig. 19 - Typ. Diode IRR vs. RG
TJ = 175°C
4.4
30
150A
4.0
75A
QRR (µC)
IRR (A)
25
20
3.6
10
22
47
3.2
100
38A
15
2.8
2.4
10
200
200 250 300 350 400 450 500 550 600
300
400
500
600
700
800
diF /dt (A/µs)
diF /dt (A/µs)
Fig. 20 - Typ. Diode IRR vs. diF/dt
VCC = 400V; VGE = 15V; IF = 75A; TJ = 175°C
Fig. 21 - Typ. Diode QRR vs. diF/dt
VCC = 400V; VGE = 15V; TJ = 175°C
700
24
650
400
Tsc
20
RG = 10
330
Isc
Time (µs)
RG = 22
550
RG = 47
500
450
16
260
12
190
8
120
Current (A)
Energy (µJ)
600
RG = 100
400
4
20
40
60
80
100
120
140
160
50
8
10
6
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14
16
18
VGE (V)
IF (A)
Fig. 22 - Typ. Diode ERR vs. IF
TJ = 175°C
12
Fig. 23 - VGE vs. Short Circuit Time
VCC = 400V; TC = 150°C
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IRGP4266DPbF/IRGP4266D-EPbF
10000
16
VGE, Gate-to-Emitter Voltage (V)
Capacitance (pF)
Cies
1000
Coes
100
Cres
VCES = 400V
VCES = 300V
14
12
10
10
8
6
4
2
0
0
100
200
300
400
500
600
0
20
V CE (V)
40
60
80
100 120 140 160
Q G, Total Gate Charge (nC)
Fig. 25 - Typical Gate Charge vs. VGE
ICE = 75A
Fig. 24 - Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz
1
Thermal Response ( Z thJC )
D = 0.50
0.1
0.20
0.10
0.05
0.01
J
0.02
0.01
R1
R1
J
1
R2
R2
R3
R3
R4
R4
C
2
1
2
3
4
3
C
4
Ci= iRi
Ci= iRi
0.001
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-006
1E-005
Ri (°C/W)
i (sec)
0.0125052
0.000036
0.0722526
0.000151
0.1389474
0.005683
0.1056000
0.029339
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 26 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
Thermal Response ( Z thJC )
10
1
D = 0.50
0.20
0.10
0.05
0.02
0.1
J
0.01
0.01
R1
R1
J
1
R2
R2
R3
R3
R4
R4
C
2
1
2
3
4
3
Ci= iRi
Ci= iRi
0.001
1E-005
0.0001
0.001
4
i (sec)
0.0131492
0.000022
0.3667154
0.000779
0.3959357
0.009640
0.3228848
0.079874
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-006
C
Ri (°C/W)
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 27 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
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IRGP4266DPbF/IRGP4266D-EPbF
L
L
VCC
DUT
0
80 V +
-
DUT
1K
VCC
Rg
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.2 - RBSOA Circuit
diode clamp /
DUT
L
4X
DC
VCC
-5V
DUT /
DRIVER
DUT
VCC
Rg
RSH
Fig.C.T.3 - S.C. SOA Circuit
Fig.C.T.4 - Switching Loss Circuit
C force
R=
VCC
ICM
100K
D1
22K
C sense
DUT
VCC
DUT
G force
0.0075µF
Rg
E sense
E force
Fig.C.T.5 - Resistive Load Circuit
8
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Fig.C.T.6 - BVCES Filter Circuit
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IRGP4266DPbF/IRGP4266D-EPbF
600
120
tf
120
600
tr
500
100
500
400
80
400
60
300
TEST
CURRENT
100
80
40
60
90% ICE
40
200
ICE (A)
200
VCE (V)
300
ICE (A)
VCE (V)
90% ICE
10% VCE
100
20
10% ICE
0
100
0
-0.5
0
0.5
0
0
1
-0.5
0
0.5
time (µs)
Fig. WF1 - Typ. Turn-off Loss Waveform
@ TJ = 175°C using Fig. CT.4
Fig. WF2 - Typ. Turn-on Loss Waveform
@ TJ = 175°C using Fig. CT.4
600
600
100
QRR
500
tRR
500
VCE
400
400
40
300
300
Vce (V)
60
20
0
-20
Peak
IRR
200
100
100
0
0
-40
-0.5
ICE
200
0.0
0.5
1.0
-100
-100
-5
0
time (µs)
Fig. WF3 - Typ. Diode Recovery Waveform
@ TJ = 175°C using Fig. CT.4
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Ice (A)
80
IF (A)
-20
-100
-20
time(µs)
9
20
10% VCE
Eon Loss
Eoff Loss
-100
10% ICE
5
10
time (µs)
Fig. WF4 - Typ. S.C. Waveform
@ TJ = 150°C using Fig. CT.3
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IRGP4266DPbF/IRGP4266D-EPbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
Notes: This part marking information applies to devices produced after 02/26/2001
EXAMPLE: THIS IS AN IRFPE30
WITH ASSEMBLY
LOT CODE 5657
ASSEMBLED ON WW 35, 2001
IN THE ASSEMBLY LINE "H"
Note: "P" in assembly line position
indicates "Lead-Free"
INTERNATIONAL
RECTIFIER
LOGO
PART NUMBER
IRFPE30
56
135H
57
ASSEMBLY
LOT CODE
DATE CODE
YEAR 1 = 2001
WEEK 35
LINE H
TO-247AC package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
10
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IRGP4266DPbF/IRGP4266D-EPbF
TO-247AD Package Outline
Dimensions are shown in millimeters (inches)
TO-247AD Part Marking Information
E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D - E
W IT H A S S E M B L Y
LO T C O D E 5657
ASSEM B LED O N W W 35, 2000
IN T H E A S S E M B L Y L IN E "H "
N o te : "P " in a s s e m b ly lin e p o s itio n
in d ic a te s "L e a d - F re e "
PART N U M BER
IN T E R N A T IO N A L
R E C T IF IE R
LO G O
56
035H
57
ASSEM B LY
LO T C O D E
D A TE C O D E
YE A R 0 = 2 0 0 0
W EEK 35
L IN E H
TO-247AD package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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IRGP4266DPbF/IRGP4266D-EPbF
Qualification Information†
Industrial
Qualification Level
TO-247AC
Moisture Sensitivity Level
(per JEDEC JESD47F)††
N/A
TO-247AD
N/A
Yes
RoHS Compliant
†
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
††
Applicable version of JEDEC standard at the time of product release.
Revision History
Date
8/21/2014
Comments
 Updated Temperature Coeff. of Breakdown Voltage from “0.11V/C” to “0.65 V/C” on page 2 .
Updated IC vs. TC graph Fig.2 to match page1 spec data on page 3.
Updated package outline on page11.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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