Roithner LED375 Uv led Datasheet

LED375-series
TECHNICAL DATA
UV LED
InGaN
LED375-series are InGaN LEDs mounted on a lead frame and encapsulated in various types of
clear silicone lens, which offers different design settings.
On forward bias, it emits a radiation of typical 2.5 mW at a peak wavelength at 375 nm.
Specifications
•
•
•
•
•
Structure: InGaN
Peak Wavelength: typ. 375 nm
Optical Ouput Power: typ. 2.5 mW
Resin Material: Clear silicone resin
Solder: Lead free
Absolute Maximum Ratings (Ta=25°C)
Type
Power Dissipation
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (for 5 sec.)
Symbol
PD
IF
VR
TOP
TSTG
TSOL
Value
200
50
5
-30 … +85
-40 … +100
265
Unit
mW
mA
V
°C
°C
°C
Electro-Optical Characteristics (Ta=25°C)
Item
Forward Voltage
Reverse Current
Radiated Power
Peak Wavelength
Half Width
21.11.2011
Symbol
VF
IR
PO
λP
Δλ
Condition
IF = 20 mA
VR = 5 V
IF = 20 mA
IF = 20 mA
IF = 20 mA
LED375-series
Min.
370
-
Typ.
3.8
2.5
375
10
Max.
4.3
10
380
-
Unit
V
µA
mW
nm
nm
1 of 8
Characteristics of Radiant Intensity (Ta=25°C)
Type
LED375-01
LED375-02
LED375-03
LED375-04
LED375-05
LED375-06
LED375-09
LED375-46
LED375-41
LED375-42
LED375-31
LED375-33
LED375-34
LED375-36
Viewing
Half Angle
±8°
±5°
±10°
±20°
±50°
±4°
±25° (long)
±10° (short)
Radiation Intensity (IF = 20 mA)
[Unit: mW/sr]
Min.
Typ.
Max.
7.0
11.0
7.0
2.5
0.5
13.0
±14°
±20°
±13°
4.0
±25°
2.0
Outer
Dimension
Dimension
Figure
Ø5
Ø5
Ø5
Ø5
Ø5
Ø5
Ø5
Oval
Ø5
Ø4
Ø4
Ø3
Ø3
Ø3
Ø3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
* Radiant Power is measured by S3584-08
* Radiant Intensity is measured by Ando Optical Multi Meter AQ2140 & AQ2741
The above specifications are for reference purpose only and subjected to change without prior notice.
Outer Dimensions
21.11.2011
Figure-1 Ø 5Mold (Type 01)
Figure-2 Ø 5Mold (Type 02)
Figure-3 Ø 5Mold (Type 03)
Figure-4 Ø 5Mold (Type 04)
LED375-series
2 of 8
21.11.2011
Figure-5 Ø 5Mold (Type 05)
Figure-6 Ø 5Mold (Type 06)
Figure-7 Ø 5Mold (Type 09)
Figure-8 Ø 5Mold (Type 46)
Figure-9 Ø 4Mold (Type 41)
Figure-10 Ø 4Mold (Type 42)
Figure-11 Ø 3Mold (Type 31)
Figure-12 Ø 3Mold (Type 33)
Figure-13 Ø 3Mold (Type 34)
Figure-14 Ø 3Mold (Type 36)
LED375-series
3 of 8
Viewing half angle
21.11.2011
Figure-1 Ø 5Mold (Type 01)
Figure-2 Ø 5Mold (Type 02)
Figure-3 Ø 5Mold (Type 03)
Figure-4 Ø 5Mold (Type 04)
Figure-5 Ø 5Mold (Type 05)
Figure-6 Ø 5Mold (Type 06)
Figure-7 Ø 5Mold (Type 09)
Figure-8 Ø 5Mold (Type 46)
Figure-9 Ø 4Mold (Type 41)
Figure-10 Ø 4Mold (Type 42)
LED375-series
4 of 8
Figure-11 Ø 3Mold (Type 31)
Figure-12 Ø 3Mold (Type 33)
Figure-13 Ø 3Mold (Type 34)
Figure-14 Ø 3Mold (Type 36)
Typical Performance Curves
Forward Current – Forward Voltage
21.11.2011
Relative Radiant Intensity – Pulsed Forward
Current
LED375-series
5 of 8
Forward Current – Pulse Duration
Forward Voltage – Ambient Temperature
Relative Radiant Intensity – Ambient
Temperature
Allowable Forward Current – Ambient
Temperature
21.11.2011
LED375-series
6 of 8
Peak Wavelength
Peak Wavelength – Ambient Temperature
Precaution for Use
1. Cautions
• DO NOT look directly into the emitted light or look through the optical system. To prevent in
adequate exposure of the radiation, wear protective glasses.
• The LEDs are emitting UV light.
2. Lead Forming
• When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
• Lead forming should be done before soldering.
• DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
21.11.2011
LED375-series
7 of 8
Recommended Land Layout (Unit: mm)
3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• DO NOT apply any stress to the lead particularly when heat.
• The LEDs must not be reposition after soldering.
• After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
• Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
Soldering Conditions
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
21.11.2011
LED375-series
8 of 8
Similar pages