LITEON LTPL-C0675WPNB Smd led Datasheet

SMD LED
Product Data Sheet
LTPL-C0675WPNB
Spec No.: DS35-2014-0010
Effective Date: 10/07/2014
Revision: -
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
LTPL-C0675WPNB
1. Description
LITEON FLASH is a compact power LED light source specifically designed to provide greater amounts of light where needed,
enabling higher resolution pictures to be taken in lower level ambient light environments at greater distances..
1 .1 Features



1.2 Applications
Highest brightness SMD Flash LED
Instant Turn On. Very small emitter size
RoHS Compliant



Camera phones
Handhelds
Digital still cameras
2. Package Dimensions
Part No.
Lens Color
Emitted Color
LTPL-C0675WPNB
Yellow/White
InGaN White
Notes :
1. All dimensions are in millimeters and dimension tolerances are ±0.1mm.
2. Dimensions without tolerances are for reference only.
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3. Rating and Characteristics
3.1 Absolute Maximum Ratings at Ta=25°C
LTPL-C0675WPNB
Unit
9.1
W
Pulsed Forward Current
(33ms:ON ,1617ms: OFF ,D=0.02)
2000
mA
DC Forward Current
350
mA
Junction Temperature
125
°C
Electrostatic Discharge Threshold (HBM)
8000
V
Operating Temperature Range
-40 ºC
to + 85 ºC
Storage Temperature Range
-40 ºC
to + 100 ºC
Parameter
Power Dissipation(Pulse Mode)
Notes :
1. HBM : Human Body Model.
2. Stresses in excess of the absolute maximum ratings can cause damage to the emitter. Maximum Rating limits apply to
each parameter in isolation, all parameters having values within the Current Derating Curves. It should not be assumed
that limiting values of more than one parameters can be applied to the product at the same time. Exposures to the
absolute maximum ratings for extended periods can adversely affect device reliability and continuously will cause
possible permanent damage and de-rating parameters.
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3.2 Suggest IR Reflow Condition For Pb Free Process:
Profile Feature
Lead Free Assembly
Average Ramp-Up Rate (TSmax to TP)
3°C / second max
Preheat Temperature Min (TSmin)
150°C
Preheat Temperature Max (TSmax)
200°C
Preheat Time (tSmin to tSmax)
60 – 120 seconds
Time Maintained Above Temperature (TL)
217°C
Time Maintained Above Time (tL)
60 – 150 seconds
Peak / Classification Temperature (TP)
260°C
Time Within 5°C of Actual Peak Temperature (tP)
5 seconds
Ramp – Down Rate
6°C / second max
Time 25°C to Peak Temperature
8 minutes max
Notes:
1.
2.
3.
All temperatures refer to topside of the package, measured on the package body surface.
The soldering condition referring to J-STD-020D.
The soldering profile could be further referred to different soldering grease material characteristic. The grease
vendor will provide this information.
4. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.
5. Although the recommended reflow conditions are specified above, the reflow or hand soldering condition at the
lowest possible temperature is desirable for the LEDs.
6. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip soldering method.
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3.3 Electrical / Optical Characteristics at Ta=25°C
LTPL-C0675WPNB
Parameter
Symbol
MIN.
TYP.
MAX.
180
240
330
Unit
Test
Condition
lm
IFP = 1000mA
Deg
Fig.2
Luminous Flux
ΦV
Viewing Angle
21/2
Color Temperature
CCT
4500
--
7000
K
IFP = 1000mA
Forward Voltage
VF
2.65
3.4
4.55
V
IFP = 1000mA
Reverse Current
IR
100
μA
120
VR = 5V
Note 4
NOTE:
1. Luminous flux measurement tolerance: ±10%
2. Forward voltage measurement tolerance: ±0.1V
3. Electric and optical data is tested at 300ms pulse condition.
4. Reverse voltage(VR) condition is applied to IR test only. The device is not designed for reverse operation.
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4. Bin Rank
4.1 Bin code list
█
Luminous Flux Binning
Parameter
Bin
Symbol
Min
Typ.
Max
180
--
200
200
--
240
MZ
240
--
280
NX
280
--
330
M2
N5
ΦV
Luminous Flux
Unit
Condition
lm
IFP = 1000mA
Luminous flux measurement tolerance: ±10%
█
Forward Voltage Binning
Parameter
Bin
Symbol
Min
Typ.
Max
A
2.65
--
2.95
B
2.95
--
3.25
3.25
--
3.55
D
3.55
--
3.95
E
3.95
--
4.25
F
4.25
--
4.55
C
Forward Voltage
VF
Unit
Condition
V
IFP = 1000mA
Forward voltage measurement tolerance: ±0.1V
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Category Code Table
█
Bin
Cx
Cy
0.38
0.48
0.355
0.445
A
Bin
Cx
Cy
0.355
0.445
0.33
0.417
B
Bin
Cx
Cy
0.33
0.417
0.293
0.3771
C
0.341
0.309
0.33
0.3
0.3125
0.285
0.353
0.319
0.341
0.309
0.33
0.3
Notes:
1.
The value is all dies operated performance.
2.
The chromaticity coordinates (x, y) is derived from the CIE 1931 chromaticity diagram.
3.
IS CAS140B is for the luminous flux (lm) and the CIE1931 chromaticity coordinates (x, y) testing. The chromaticity
coordinates (x, y) guarantee should be added ± 0.01 tolerance.
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5. Typical Electrical / Optical Characteristics Curves.
(25℃ Ambient Temperature Unless Otherwise Noted)
Fig 1. Relative Spectrum of Emission
0°
100%
90%
30°
R e l a tiv e In te n s i ty ( % )
80%
70%
60%
60°
50%
40%
30%
20%
10%
0%
90°
60
30°
0°
50
100
Fig 2. Radiation Characteristics
Fig 3. Forward Current Derating Curve
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Fig 4. Forward Current
Fig 5. Relative Luminous Flux
Fig 6. Correlated Color Temperature (CCT)Shift
Notes: All correlation data is mounted on thermal heat sink with 2cmX 2cm Metal Core PCB
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6. User Guide
6.1 Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for less one minute.
6.2 Recommend Printed Circuit Board Attachment Pad
Notes:
1. Suggest stencil thickness is maximum 0.10mm.
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6.3 Package Dimensions Of Tape And Reel
Note:
1. Drawings not to scale.
2. All dimensions are in millimeters.
3. All dimensions without tolerances are for reference only.
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6.4 Package Dimensions of Reel
Notes:
1. Drawings not to scale.
2. All dimensions are in millimeters.
3. All dimensions without tolerances are for reference only.
4. Minimum package quantity is 500 pieces for remainders.
5. 7 inch reel-2000 pieces.
6. Empty component pockets sealed with top cover tape.
7. The maximum number of consecutive missing lamps is two
8. In accordance with EIA-481 specifications
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7. Cautions
7.1 Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications
in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize
life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety
devices).
7.2 Storage
This product is qualified as Moisture sensitive Level 3 per JEDEC J-STD-020 Precaution when handing this moisture
sensitive product is important to ensure the reliability of the product.
The package is sealed:
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within
one year, while the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are limited to solder process within
168hrs. If the Humidity Indicator shows the pink color in 10% even higher or exceed the storage limiting time since
opened, that we recommended to baking LEDs at 60°C at least 48hrs. To seal the remainder LEDs return to package, it’s
recommended to be with workable desiccants in original package.
7.3 Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
7.4 Soldering
Recommended soldering conditions:
Reflow soldering
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
Soldering iron
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Notes:
Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit
boards, no single temperature profile works for all possible combinations. However, you can successfully mount your
packages to the PCB by following the proper guidelines and PCB-specific characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.
The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on
JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page2 shows
a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your
reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the
solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
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7.5 Drive Method
A LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED
as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
7.6 ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:




Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a
result of friction between LEDs during storage and handling.
Plastic lens as a result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward Voltage, or
“no light-up” at low currents.
To verify for ESD damage, check for “light up” and Vf of the suspect LEDs at low currents.
The Vf of “good” LEDs should be>[email protected] for InGaN product.forward voltage, or “no lightup” at low currents.
To verify for ESD damage, check for “lightup” and VF of the suspect LEDs at low currents.
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8. Reliability Test
Stress Test
Thermal Cycling
Thermal Shock
Stress Condition
Stress Duration
- 40℃(30min)/100℃(30min) transition time 5 min@25℃
500 cycles
- 40℃(20min)/100℃(20min) transition time 20 secs
200 cycles
Room Temperature Operation Life
25℃, IF=350mA
500hr
Low Temperature Storage Life
- 40℃
500hr
High Temperature Storage Life
100℃
500hr
Resistance to solder heat
Tsol=260℃, 10sec,6min
3 times
Wet High Temperature Operation Life
85℃/85%
500hr
Pulse test
IF=1000mA 50ms on /950 ms off @25℃
30000times
Notes:
1. All reliability items are mounted on thermal heat sink with 2cmX 2cm Metal Core PCB
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9. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
10. Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with
conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for InGaN LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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