Material Content Data Sheet Sales Product Name BSC0923NDI MA# MA001001398 Package PG-TISON-8-2 Issued 3. June 2015 Weight* 96.57 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 0.603 0.62 0.010 0.01 0.041 0.04 425 0.822 0.85 8508 33.360 34.54 35.44 345442 354481 0.061 0.06 0.06 637 637 0.096 0.10 wire encapsulation leadfinish plating solder heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.62 6244 6244 106 989 4.920 5.09 42.753 44.30 49.49 442698 494634 1.122 1.16 1.16 11616 11616 0.186 0.19 0.19 1924 1924 0.025 0.03 0.020 0.02 0.947 0.98 0.003 0.00 0.014 0.01 144 0.279 0.29 2885 11.312 11.71 50947 257 205 1.03 9806 12.01 117131 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 10268 36 120196 1000000