Datasheet AC/DC Converter IC PWM type DC/DC converter IC Included a Switching MOSFET BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ●General Description The PWM type DC/DC converter (BM2PXXXF) for AC/DC provides an optimal system for all products that include an electrical outlet. BM2PXXXF supports both isolated and nonisolated devices, enabling simpler design of various types of low-power electrical converters. The built-in 650V HV starter circuit contributes to low-power consumption. A higher degree of design freedom can be achieved with current detection resistors as external devices. Current is restricted in each cycle and excellent performance is demonstrated in bandwidth and transient response since current mode control is utilized. The switching frequency is 65 kHz. At light load, the switching frequency is reduced and high efficiency is achieved. A frequency hopping function that contributes to low EMI is also included on chip. Design can be easily implemented because includes a 650V switching MOSFET. ●Basic specifications Operating Power Supply Voltage Range: ●Features PWM frequency : 65kHz PWM current mode control Burst operation when load is light Frequency reduction function Built-in 650V starter circuit Built-in 650V switching MOSFET VCC pin Under-Voltage protection VCC pin Over-Voltage protection SOURCE pin Open Protection SOURCE pin Short Protection SOURCE pin Leading Edge Blanking function Per-cycle Over-Current Protection Circuit Soft start Secondary Over-Current Protection Circuit ●Package SOP8 5.00mm x 6.20mm x 1.71mm pitch 1.27mm (Typ.) (Typ.) (TYP.) (TYP.) VCC DRAIN 8.9V to 26.0V to 650V Normal Operating Current: (BM2Px5xF) ：0.60mA (Typ.) (BM2Px9xF) ：0.50mA (Typ.) ■Burst Operating Current: Oscillation Frequency: Operating Temperature: MOSFET ON Resistance: 0.30mA(Typ.) 65kHz(Typ.) - 40deg. to +105deg. BM2Px5xF：4.0Ω (Typ.) BM2Px9xF：8.5Ω (Typ.) ●Applications For AC adapters and household appliances (vacuum cleaners, humidifiers, air cleaners, air conditioners, IH cooking heaters, rice cookers, etc.) ●Application Circuit Figure 1. Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays. 1/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ●Absolute Maximum Ratings （Ta=25C） Parameter Symbol Rating Unit Vmax1 Vmax2 Vmax3 -0.3 to 32.0 -0.3 to 6.5 650 V V V Drain current pulse IDP 2.60 A Drain current pulse IDP 1.30 A Maximum applied voltage 1 Maximum applied voltage 2 Maximum applied voltage 3 Power dissipation Pd 0.56 W Operating o -40 to +105 C Topr temperature range o MAX junction temperature Tjmax 150 C Storage o Tstr -55 to +150 C temperature range (Note1) SOP8 : When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate) Conditions VCC SOURCE, FB, FADJ DRAIN PW=10us, Duty cycle=1% (BM2Px5xF) PW=10us, Duty cycle=1% (BM2Px9xF) When implemented Derate by 4.563mW/°C when operating above Ta=25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. ●Operating Conditions （Ta=25C） Parameter Symbol Rating Unit VCC VDRAIN 8.9 to 26.0 650 V V Power supply voltage range 1 Power supply voltage range 2 Conditions VCC pin voltage DRAIN pin voltage ●Electrical Characteristics of MOSFET (unless otherwise noted, Ta = 25C, VCC = 15V) Parameter Symbol Min Specifications Typ Max Unit Conditions [MOSFET Block] Between drain and source voltage V(BR)DDS 650 - - V Drain leak current IDSS - - 100 uA On resistance RDS(ON) - 4.0 5.5 Ω On resistance RDS(ON) - 8.5 12.0 Ω www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/19 ID=1mA / VGS=0V VDS=650V / VGS=0V ID=0.25A / VGS=10V (BM2Px5xF) ID=0.25A / VGS=10V (BM2Px9xF) TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ●Electrical Characteristics (unless otherwise noted, Ta = 25C, VCC = 15 V) Specifications Parameter Symbol Min Typ Max [Circuit Current] Unit Conditions Circuit current (ON) 1 ION1 410 600 790 μA FB=2.0(at pulse operation) BM2Px5xF Circuit current (ON) 1 ION1 350 500 650 μA FB=2.0(at pulse operation) BM2Px9xF Circuit current (ON) 2 ION2 200 300 400 μA FB=0.0V(at burst operation) VUVLO1 VUVLO2 VUVLO3 VOVP1 VOVP2 VOVP3 VLATCH VCHG1 VCHG2 tLATCH TSD1 TSD2 12.50 7.50 26.0 7.70 12.00 50 120 - 13.50 8.20 5.30 27.5 23.5 4.0 VUVLO2-0.5 8.70 13.00 100 145 115 14.50 8.90 29.0 9.70 14.00 150 - V V V V V V V V V us C C VCC rise VCC fall VUVLO3= VUVLO1- VUVLO2 VCC rise BM2Pxx6F/BM2Pxx8F BM2Pxx6F/BM2Pxx8F FSW1 FSW2 FDEL1 FCH IBST VBST FBST tSS1 tSS2 tSS3 tSS4 Dmax Tmin RFB Gain VBST1 VBST2 VBST3 60 20 75 0.80 1.13 0.30 0.60 1.20 3.20 68.0 150 23 0.220 0.260 - 65 25 4.0 125 1.00 1.20 0.833 0.50 1.00 2.00 4.00 75.0 400 30 4.00 0.280 0.320 0.04 70 30 175 1.20 1.27 0.70 1.40 2.80 4.80 82.0 650 37 0.340 0.380 - KHz KHz KHz Hz uA V KHz ms ms ms ms % ns kΩ V/V V V V [VCC Protection Function] VCC UVLO voltage 1 VCC UVLO voltage 2 VCC UVLO hysteresis VCC OVP voltage 1 VCC OVP voltage 2 VCC OVP hysteresis Latch released VCC voltage VCC recharge start voltage VCC recharge stop voltage Latch mask time Thermal shut down temperature1 Thermal shut down temperature2 VCC fall Control IC, temp rise Control IC, temp fall [PWM Type DCDC Driver Block] Oscillation frequency 1 Oscillation frequency 2 Frequency hopping width 1 Hopping fluctuation frequency FADJ source current FADJ comparator voltage FADJ max burst frequency Soft start time 1 Soft start time 2 Soft start time 3 Soft start time 4 Maximum duty Minimum ON pulse FB pin pull-up resistance ΔFB / ΔSOURCE gain FB burst voltage 1 FB burst voltage 2 FB burst hysteresis FB voltage of starting frequency reduction mode FB OLP voltage 1a FB OLP voltage 1b FB OLP ON time FB OLP OFF time FB=2.00V FB=0.30V FB=2.0V FADJ=0.0V CFADJ=1000pF FB fall FB rise VBST3= VBST2- VBST1 VDLT 1.100 1.250 1.400 V VFOLP1A VFOLP1B TFOLP1 TFOLP2 2.60 80 332 2.80 2.60 128 512 3.00 176 692 V V ms ms VSOURCE 0.375 0.400 0.425 V Over-current detection voltage SS1 VS_SS1 - 0.100 - V Over-current detection voltage SS2 VS_SS2 - 0.150 - V TSS1 [ms] to TSS2 [ms] Over-current detection voltage SS3 VS_SS3 - 0.200 - V TSS2 [ms] to TSS3 [ms] Over-current detection voltage SS4 VS_SS4 - 0.300 - V TSS3 [ms] to TSS4 [ms] tLEB - 250 - ns KSOURCE 12 20 28 mV/us Overload is detected (FB rise) Overload is detected (FB fall) BM2Pxx5F/BM2Pxx6F [Over Current Detection Block] Over-current detection voltage Leading edge blanking time Over current detection AC voltage compensation factor SOURCE pin short protection voltage VSHT 0.020 0.050 0.080 V TSOURCESHT 1.80 3.00 4.20 us Start current 1 Start current 2 ISTART1 ISTART2 0.100 1.000 0.500 3.000 1.000 6.000 mA mA OFF current ISTART3 - 10 20 uA VSC 0.800 1.500 2.100 V SOURCE pin short protection time Ton=0us 0[ms] to Tss1 [ms] [Start Circuit Block] Start current switching voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/19 VCC= 0V VCC=10V Inflow current from Drain pin after UVLO is released and when MOSFET is OFF TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ●Pin Descriptions Table 1. Pin Description NO. Pin Name I/O 1 2 3 4 5 6 7 8 VCC N.C. N.C. DRAIN SOURCE FADJ GND FB I I/O I/O I I/O I Function Power supply input pin MOSFET DRAIN pin MOSFET SOURCE pin MAX Burst Frequency setting pin GND pin Feedback signal input pin ESD Diode VCC GND ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ●I/O Equivalent Circuit Diagram Figure 2. I/O Equivalent Circuit Diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ●Block Diagram FUSE AC Diode Bridge Filter VCC DRAIN 1 4 VCC UVLO + - 13 . 5V / 8 .2V VCC OVP 100us Filter + - Starter 4.0V Line Reg 12V Clamp Circuit 27 . 5V 10uA Internal Block FADJ 6 Burst Frequency Control S R Q DRIVER PWM Control + Burst Control 4 .0 V 4.0V 30k FB 8 OLP + 128 ms/ 512ms Timer 1M Current Limiter Burst Comparator Leading Edge Blanking + - (typ =250 ns) 5 SOURCE + Rs AC Input Compensation Soft Start PWM Comparator + + MAX DUTY OSC (65kHz ) 7 Frequency Hopping GND Slope Compensation FeedBack With Isolation Figure 3. Block Diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ●Line up 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 BM2P095F BM2P045F BM2P096F BM2P046F BM2P097F BM2P047F BM2P098F BM2P048F BM2PA95F BM2PA45F BM2PA96F BM2PA46F BM2PA97F BM2PA47F BM2PA98F BM2PA48F On Resistance [ ohm typ. ] 8.50 4.00 8.50 4.00 8.50 4.00 8.50 4.00 8.50 4.00 8.50 4.00 8.50 4.00 8.50 4.00 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VCC OVP Function FB OLP Frequency Reduction Function Latch Auto Restart ✔ Auto Restart Auto Restart ✔ Latch Latch ✔ Auto Restart Latch ✔ Latch Auto Restart - Auto Restart Auto Restart - Latch Latch - Auto Restart Latch - 6/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ●Block Description (1) Start circuit (DRAIN: Pin 4) This IC has a built-in start circuit. It enables low standby mode electricity and high speed start. After start up, consumption power is determined by idling current ISTART3 （Typ=10uA） only. Reference values of starting time are shown in Figure 6. When Cvcc=10uF it can start in less than 0.1 sec. + FUSE AC 85- 265 Vac Diode Bridge - DRAIN SW1 VCC Cvcc + VCCUVLO Figure 4. Block Diagram of Start Circuit 1.0 0.9 0.8 起動時間[sec] 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 5 10 15 20 25 30 35 40 45 50 Cvcc [uF] Figure 5. Start Current vs VCC Voltage Figure 6. Start Time (reference value) * Start current flows from the DRAIN pin Ex) Consumption power of start circuit only when Vac=100V PVH＝100V*√2*10uA=1.41mW Ex) Consumption power of start circuit only when Vac=240V PVH＝240V*√2*10uA=3.38mW www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series (2) Start sequences (Soft start operation, light load operation, and auto recovery operation during overload protection) Start sequences are shown in Figure 7. See the sections below for detailed descriptions. Figure 7. Start Sequences Timing Chart A: B: C: D: E: F: G: H: I: J: K: Input voltage VH is applied. This IC starts operating when VCC > VUVLO1 (13.5 V Typ). Switching function starts when other protection functions are judged as normal. When the secondary output voltage becomes constant, VCC pin current causes the VCC voltage to drop. As a result, IC should be set to start switching until VCC<VUVLO2 (8.2V Typ). With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current. When the switching operation starts, VOUT rises. Once the output voltage starts, set the rated voltage within the TFOLP period (128ms Typ). When there is a light load, it makes FB voltage < VBST (0.3V Typ). Burst operation is used to keep power consumption down. During burst operation, it operates at low-power consumption mode. When the FB pin Voltage＞VFOLP1A（2.8V Typ）, it overloads. When the FB pin voltage keeps VFOLP1A (= 2.8V Typ) at or goes above T FOLP (128ms Typ), the overload protection function is triggered and the switching stops. During the TFOLP period (128ms Typ), if the FB pin voltage becomes <VFOLP1B even once, the IC’s internal timer is reset. If the VCC voltage drops to < VUVLO2 (7.7V Typ) or below, restart is executed. The IC’s circuit current is reduced and the VCC pin value rises. (same as B) Same as F Same as G www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series (3) VCC pin protection function These ICs have a built-in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection function VCCOVP (Over Voltage Protection), and a VCC recharge function that operates in case of a drop in VCC voltage. VCC charge function stabilizes the secondary output voltage, charged from high voltage lines by the start circuit when VCC voltage drops. (3-1) VCC UVLO ／ VCC OVP function VCCUVLO is an auto recovery comparator while VCCOVP is a latch type or auto restart type comparator with voltage hysteresis. VCCOVP operates in case of continuing VCC pin voltage > VOVP （Typ=27.5V）. This function has a built-in mask time TLATCH（Typ=100us）. Through this function, the IC is protected from pin generated surge, etc. Figure 8 is showed about VCC OVP latch type. Vovp1=27.5Vtyp Vovp1=23.5Vtyp VCCuvlo1=13.5Vtyp Vchg1=13.0Vtyp Vchg2= 8.7Vtyp VCCuvlo2 8.2Vtyp ON ON OFF ON OFF OFF ON ON OFF ON OFF OFF A B C D E F G H I J A Figure 8. VCC UVLO / OVP Timing Chart A: B: C: D: E: F: G: H: I: J: DRAIN voltage input, VCC pin voltage starts rising. VCC>Vuvlo1, DC/DC operation starts. VCC< VCHG1, VCC charge function operates and the VCC voltage rises. VCC > VCHG2, VCC charge function stops. VCC > VOVP1, TLATCH (Typ =100us) continues, switching is stopped by the VCCOVP function. VCC < VOVP2, DC/DC operation restarts. VH is OPEN. VCC Voltage falls. Same as C Same as D VCC<Vuvlo2, DC/DC operation stops. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series （3-2）VCC charge function BM2PxxxF has the recharge function. VCC charge function operates once the VCC pin >VUVLO1 and when the DC/DC operation starts. The VCC pin voltage then drops to <VCHG1. At that time the VCC pin is charged from the DRAIN pin through the start circuit. Through this operation, these series prevent failure. VCC pin voltage rises until VCC >VCHG2. The operation is shown in figure 9. VH VUVLO1 VCHG2 VCC VCHG1 VUVLO2 Switching VH charge charge charge charge charge OUTPUT voltage A B C D E F G H Figure 9. VCC Pin Charge Operation A: B: C: D: E: F: G: H: DRAIN pin voltage rises, charges VCC pin through the VCC charge function. VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts. When the DC/DC operation starts, the VCC voltage drops. VCC < VCHG1, VCC recharge function operates. VCC > VCHG2, VCC recharge function stops. VCC < VCHG1, VCC recharge function operates. VCC > VCHG2, VCC recharge function stops. After the output voltage is finished rising, VCC is charged by the auxiliary winding, and VCC pin stabilizes. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series (4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst) BM2PxxxF has a current mode PWM control. An internal oscillator sets a fixed switching frequency (65 kHz Typ). BM2PxxxF has an integrated switching frequency hopping function, which causes the switching frequency to fluctuate as shown in figure 10 below. The fluctuation cycle is 125 Hz (Typ). Figure 10. Frequency Hopping Function Maximum duty cycle is fixed at 75% (Typ) and minimum pulse width is fixed at 400 ns (Typ). In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50%. As a countermeasure, this IC has built-in slope compensation circuits. This IC has built-in burst mode and frequency reduction circuits to achieve lower power consumption when the load is light. (Only BM2P0xxF series have frequency reduction circuits ) FB pin is pulled up by RFB (30 kΩ Typ). FB pin voltage is changed by secondary output voltage (secondary load power). FB pin is monitored, burst mode operation and frequency detection start. Figure 11 shows the FB voltage, and the DCDC switching frequency operation. ＜BM2P0xxF＞ ・mode1 : Burst operation ・mode2 : Frequency reduction operation ・mode3 : Fixed frequency operation (operates at max frequency) ・mode4 : Overload operation (detects the overload state and stops the pulse operation) Figure 11-1. Switching Operation State Changes by FB Pin Voltage Figure 11-2. Switching Operation State Changes by FB Pin Voltage ( BM2P0xxF series) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ＜BM2PAxxF＞ ・mode1 : Burst operation ・mode2 : Fixed frequency operation ( operates at max frequency) ・mode3 : Fixed frequency operation (operates at max frequency) ・mode4 : Overload operation (detects the overload state and stops the pulse operation) ( BM2PAxxF series) 11/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series (4-1) MAX Burst frequency setting This IC can reduce a burst sound to fix a burst frequency. This IC has two clocks, so this IC can fix the burst frequency. Frequency [kHz] Burst Mode Frequency Reduction Mode Frequency [kHz] Normal Mode 65kHz Burst Mode Frequency Reduction Mode Normal Mode 65kHz Switching frequency Switching frequency 25kHz 25kHz [Region of sound] [Region of sound] FADJ Burst frequency Burst frequency Output Power[W] Output Power[W] Figure 12-1. No setting Figure 12-2. setting Setting external capacitor of FADJ pin, the burst frequency is fixed. It is showed an example of max burst frequency setting using FADJ pin This frequency is decided by FADJ source current, FADJ comparator voltage and external capacitor. 100000 Burst Frequency [Hz] 10000 1000 100 10 10 100 1000 10000 C_FADJ[pF] Figure 13. Example of max burst frequency setting using FADJ pin www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series (5) Over Current limiter BM2PxxxF has a built-in over current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching stops. It also has a built-in AC voltage compensation function. With this function, the over current limiter level is high until the time the AC voltage is compensated. Shown in figure-14, 15, and 16. Figure 14. No AC Voltage Compensation Function Figure15. Built-in AC Compensation Voltage Primary peak current is calculated using the formula below. Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay Vcs： Over current limiter voltage (internal), Rs：Current detection resistance, Vdc： Input DC voltage, Lp：Primary inductance, Tdelay： Delay time after detection of over current limiter Figure 16. Over Current Limiter Voltage （6）L. E. B. Blanking Period When the MOSFET driver is turned ON, surge current flows through each capacitor component and drive current is generated. Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250ns by the on-chip LEB (Leading Edge Blanking) function. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series (7) SOURCE pin (pin 5) short protection function When the SOURCE pin (pin 5) is shorted, BM2PxxxF overheats. BM2PxxxF has a built-in short protection function to prevent destruction. (8) SOURCE pin (pin 5) open protection If the SOURCE pin becomes OPEN, BM2PxxxF may be damaged. To prevent it from being damaged, BM2PxxxF has a built-in OPEN protection circuit （auto recovery protection）. ((9) Output over load protection function （FB OLP Comparator） The output overload protection function monitors the secondary output load status at the FB pin and stops switching whenever overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to the photo coupler, so the FB pin voltage rises. When the FB pin voltage > VFOLP1A (2.8 V Typ) continuously for the period TFOLP (128ms Typ), it is judged as an overload and switching stops. When the FB pin > VFOLP1A (2.8 V Typ), if the voltage goes lower than VFOLP1B (2.6V Typ) during the period TFOLP (128ms Typ), the overload protection timer is reset. The switching operation is performed during this period TFOLP (128ms Typ). At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of VFOLP1A (2.8 V Typ) or above. Therefore, at startup the FB voltage must be set to VFOLP1B (2.6 V Typ) or below during the period TFOLP (128ms Typ), and the secondary output voltage’s start time must be set within the period TFOLP (128ms Typ) following startup of the IC. Recovery is after the period TFOLP2(512 ms Typ), from the detection of FBOLP. ●Operation mode of protection circuit Operation mode of protection functions are shown in Table 2. Table 2. Operation Mode of Protection Circuit Function VCC Under Voltage Locked Out VCC Over Voltage Protection TSD FB Over Limited Protection SOURCE Short Protection SOURCE Open Protection www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Operation mode Auto recovery BM2Pxx5F :Latch（with 100us timer） BM2Pxx6F :Auto recovery BM2Pxx7F :Latch（with 100us timer） BM2Pxx8F :Auto recovery Auto recovery BM2PXX5F:Auto recovery（with 128ms timer） BM2PXX6F:Auto recovery （with 128ms timer） BM2PXX7F:Latch（with 128ms timer） BM2PXX8F:Latch（with 128ms timer） Auto recovery Auto recovery 14/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ● Thermal loss The thermal design should set the operation for the following conditions. (Since the temperature shown below is the guaranteed temperature, be sure to take into account a sufficient margin.) 1. The ambient temperature Ta must be 105℃ or less. 2. The IC’s loss must be within the allowable dissipation Pd. The thermal dissipation characteristics are as follows. (PCB: 70 mm × 70mm × 1.6 mm, mounted on glass epoxy substrate) 1 Pd[W] 0.8 0.6 0.4 0.2 0 0 25 50 75 Ta[℃] 100 125 150 Figure 17. SOP8 Thermal Dissipation Characteristics www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series ●Ordering Information B M 2 P X X X F - Package F: SOP8 Product name GE 2 Packaging and forming specification E2: Embossed tape and reel ●Physical Dimension Tape and Reel Information (Max 5.35 (include.BURR)) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin (UNIT : mm) Reel PKG : SOP8 ●Marking Diagram ) ∗ Order quantity needs to be multiple of the minimum quantity. ●Line Up Part Number Marking 1PIN MARK PXXX LOT No. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Product name BM2P095F BM2P045F BM2P096F BM2P046F BM2P097F BM2P047F BM2P098F BM2P048F BM2PA95F BM2PA45F BM2PA96F BM2PA46F BM2PA97F BM2PA47F BM2PA98F BM2PA48F Part Number Marking P095 P045 P096 P046 P097 P047 P098 P048 PA95 PA45 PA96 PA46 PA97 PA47 PA98 PA48 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. 9. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Datasheet BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 18. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the TSD threshold. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 BM2PXX5F/BM2PXX6F/BM2PXX7F/BM2PXX8F Series date Rev. NO. 21/Apr/2014 28/Nor/2016 001 002 Datasheet Revision Point New release P3. Electrical Characteristics , add Minimum On pulse www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/19 TSZ02201-0F2F0A200210-1-2 28.Oct.2016.Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BM2P045F - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BM2P045F SOP8 2500 2500 Taping inquiry Yes